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Modular system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A47B-097/00
  • B65G-049/07
출원번호 US-0527797 (1995-09-13)
발명자 / 주소
  • Slocum Alexander H.
  • Van Doren Matthew J.
  • Ziegenhagen
  • II Rodney Scott
  • Sauer Don
출원인 / 주소
  • Silicon Valley Group, Inc.
대리인 / 주소
    Walker
인용정보 피인용 횟수 : 55  인용 특허 : 0

초록

A modular system and a method of creating a modular system comprising a substantially rigid frame and a plurality of modules mounted at predetermined locations on the frame by means of kinematic couplings. The frame includes a main beam in the form of a spine, and a plurality of transversely extendi

대표청구항

[ We claim:] [1.] A modular system comprising:a substantially rigid frame; anda plurality of modules each of which is mounted at a predetermined location of the frame by means of a kinematic coupling between the frame and the module, the frame forming a common substrate for the modules, thereby defi

이 특허를 인용한 특허 (55)

  1. Malin, Cosmas G., Air-conditioned storage cupboard.
  2. Vatterott, Bryan; Wilson, Patrick, Apparatus and control for modular manufacturing system.
  3. Culpepper, Martin L., Apparatus and method for accurate, precise, and adjustable kinematic coupling.
  4. Gutierrez, Roman C.; Calvet, Robert J.; Harrington, Darrell; Wang, Guiqin; Jayaraj, Kumaraswamy, Autofocus camera systems and methods.
  5. Malin, Cosmas, Automated substance storage.
  6. George Gregory ; Peery Tim ; Consentino Timothy ; Kuhnle Michael ; Wright Seth ; Ziegler James, Automatic modular wafer substrate handling device.
  7. Calvet, Robert J.; Gutierrez, Roman C.; Tang, Tony Kai, Base, payload and connecting structure and methods of making the same.
  8. Calvet,Robert J.; Gutierrez,Roman C.; Tang,Tony Kai, Base, payload and connecting structure and methods of making the same.
  9. Narita, Shoriki; Imanishi, Makoto; Mae, Takaharu; Kanayama, Shinji; Watanabe, Nobuhisa, Bump bonding apparatus and method.
  10. Englhardt, Eric A.; Rice, Michael R.; Hudgens, Jeffrey C.; Hongkham, Steve; Pinson, Jay D.; Salek, Mohsen; Carlson, Charles; Weaver, William T; Armer, Helen R., Cartesian cluster tool configuration for lithography type processes.
  11. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Cartesian robot cluster tool architecture.
  12. Malin, Cosmas G., Climate controlled cabinet with movable carrier.
  13. Malin,Cosmas G., Climate controlled cabinet with movable carrier.
  14. Gonska, Gernot; Dick, Thorsten; Reinhardt, Heiko, Climatic cabinet.
  15. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  16. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  17. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  18. Ishikawa,Tetsuya; Roberts,Rick J.; Armer,Helen R.; Volfovski,Leon; Pinson,Jay D.; Rice,Michael; Quach,David H.; Salek,Mohsen S.; Lowrance,Robert; Backer,John A.; Weaver,William Tyler; Carlson,Charles; Wang,Chongyang; Hudgens,Jeffrey; Herchen,Harald; Lue,Brian, Cluster tool architecture for processing a substrate.
  19. Volfovski, Leon; Ishikawa, Tetsuya, Cluster tool substrate throughput optimization.
  20. Lowe,Gregory Earl, Environmentally controllable storage system.
  21. Lappen,Alan Rick; Schauer,Ronald V., Facilities connection box for pre-facilitation of wafer fabrication equipment.
  22. Schauer,Ronald Vern, Facilities connection bucket for pre-facilitation of wafer fabrication equipment.
  23. Calvet, Robert J.; Gutierrez, Roman C.; Tang, Tony Kai, Flexure assemblies and methods of making the same.
  24. McHugh,Paul R.; Wilson,Gregory J.; Woodruff,Daniel J.; Zimmerman,Nolan; Erickson,James J., Integrated microfeature workpiece processing tools with registration systems for paddle reactors.
  25. Wirth, Paul; Woodruff, Daniel J., Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces.
  26. Davis,Jeffry Alan; Harris,Randy A., Integrated tool with interchangeable wet processing components for processing microfeature workpieces.
  27. Woodruff,Daniel J.; Davis,Jeffry Alan; Harris,Randy A.; Mattson,David P.; Erickson,James J.; Egloff,Matthew C., Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems.
  28. Calvet, Robert J.; Gutierrez, Roman C.; Tang, Tony Kai, Kinematic and non-kinematic passive alignment assemblies and methods of making the same.
  29. Shelef,Gad, Kinematic mount having connectors with beveled edges.
  30. Ullman, Alan Z.; Traffenstedt, Michael W.; Ahart, Rose M.; Wang, Harry H., Line replaceable systems and methods.
  31. Gomez, Rafael; Ghafar, Abdul; Borkowski, Jonathan E.; Coghlan, Kay; Cannavo, Andres; Ow, Rodney C., Modular frame for a wafer fabrication system.
  32. Norek Richard S., No-slip corner joint.
  33. Moreau, Jean-Michel; Feistenauer, Harald; Ngo, Hung Viet; Stepanek, Patrick, Print head pre-alignment systems and methods.
  34. Moreau, Jean-Michel; Feistenauer, Harald; Ngo, Hung Viet; Stepanek, Patrick, Print head pre-alignment systems and methods.
  35. Culpepper Martin ; Slocum Alexander H., Quasi-kinematic coupling and method for use in assembling and locating mechanical components and the like.
  36. Catey Eric B. ; Hult David ; Puerto Santiago del ; Roux Stephen, Removable cover for protecting a reticle, system including and method of using the same.
  37. Haas,Hansjoerg, Robotic carousel workstation.
  38. William J. Fosnight ; Anthony C. Bonora ; Raymond S. Martin ; Perry Peterson, SMIF pod including independently supported wafer cassette.
  39. Aegerter,Brian K.; Dundas,Curt T.; Ritzdorf,Tom L.; Curtis,Gary L.; Jolley,Michael; Peace,Steven L., Selective treatment of microelectric workpiece surfaces.
  40. Bazydola Kenneth J. ; Price Robert L., Semiconductor wafer cassette positioning and detection mechanism.
  41. Thompson, Raymon F.; Davis, Jeffry A.; Harris, Randy; Scranton, Dana R.; Pfeifle, Ryan; Peace, Steven A.; Aegerter, Brian, Single workpiece processing system.
  42. Cosmas Malin LI, Storage arrangement and storage receptacle with storage arrangement.
  43. Helwig Gunter,DEX ; Malin Cosmas,LIX, Storage device for objects, storage station and air-conditioned cabinet.
  44. Birkner, Andreas; Hiltawski, Knut; Urban, Karsten; Wienecke, Joachim, Substrate conveying module and system made up of substrate conveying module and workstation.
  45. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Van Katwyk, Kirk; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a Cartesian robot cluster tool.
  46. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
  47. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Van Katwyk, Kirk; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
  48. Jang, Sung-Ho; Kang, Byung-Man, Substrate treating apparatus and method of manufacturing the same.
  49. Ngo, Hung Viet; Feistenauer, Harald; Stepanek, Patrick; Moreau, Jean-Michel, System and method for offline print head alignment.
  50. Moreau, Jean-Michel; Feistenauer, Harald; Ngo, Hung Viet; Stepanek, Patrick, System and method for print head alignment using alignment adapter.
  51. Moreau, Jean-Michel; Feistenauer, Harald; Ngo, Hung Viet; Stepanek, Patrick, System and method for print head alignment using alignment adapter.
  52. Del Puerto, Santiago; Loopstra, Erik R.; Massar, Andrew; Kish, Duane P.; Alikhan, Abdullah; Olsen, Woodrow J.; Feroce, Jonathan H., System and method for using a two part cover and a box for protecting a reticle.
  53. Unger,Evan C., Ultrasound imaging and treatment.
  54. Bores Gregory W. ; Zabka Michael C., Wafer carrier having a low tolerance build-up.
  55. Lester, Paul; Meyer, Scott; Atkins, Wyland L.; Richards, Douglas; Predoaica, Constantin; Hudgens, Jeffrey; Carlson, Charles; Kankanala, Penchala; Rice, Mike; Papanu, James S.; Baiya, Evanson G.; Rosato, John J., Wet clean system design.
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