초록 ▼

A cryogenic cooling apparatus is provided, wherein the degree of freedom of installation and use is increased without deteriorating the reliability or stability and the range of uses of the apparatus is also increased. A coil unit and a refrigeration unit are positioned such that a second heat condu

A cryogenic cooling apparatus is provided, wherein the degree of freedom of installation and use is increased without deteriorating the reliability or stability and the range of uses of the apparatus is also increased. A coil unit and a refrigeration unit are positioned such that a second heat conductive member disposed on an extendible wall of a vacuum container and a fourth heat conductive member disposed on an extendible wall of another vacuum container face each other coaxially. In this state, the coil unit and refrigeration unit are relatively moved to approach each other, and thus the second heat conductive member and fourth heat conductive member come in contact. If the coil unit and refrigeration unit are further moved, the extendible wall extends and consequently the second heat conductive member comes in contact with a first heat conductive member. In addition, the extendible wall contracts and consequently the fourth heat conductive member comes in contact with a third heat conductive member. Thus, a superconducting coil is thermally connected to the refrigeration unit so that the superconducting coil is cooled.

대표청구항 ▼

[ We claim:] [1.] A cooling apparatus for cooling an object, said apparatus comprising:a first vacuum container;a cooling source housed within the first vacuum container;a second vacuum container, provided separately from the first vacuum container, for accommodating the object; andthermal connectio

[ We claim:] [1.] A cooling apparatus for cooling an object, said apparatus comprising:a first vacuum container;a cooling source housed within the first vacuum container;a second vacuum container, provided separately from the first vacuum container, for accommodating the object; andthermal connection and disconnection means for thermally connecting the cooling source and the object when the object is to be cooled by the cooling source, and thermally disconnecting the cooling source and the object when the object is to be thermally insulated.