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Sealed electronic packaging for environmental protection of active electronics 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-009/00
출원번호 US-0397600 (1995-03-02)
발명자 / 주소
  • Diaz Steve
  • Horsma Dave
  • Kulkarni Narendra
  • Lundquist Peter
  • Nakazato Akira
  • Shen Nelson
  • Lippe Paul von der
출원인 / 주소
  • Raychem Corporation
대리인 / 주소
    Burkard
인용정보 피인용 횟수 : 40  인용 특허 : 27

초록 ▼

An environmentally sealed electronics assembly. The assembly includes a flexible envelope surrounding the active electronics board. The electronics board is insertable into the envelope and with subsequent sealing provides a reenterable but environmentally sealed active electronics package. Methods

대표청구항 ▼

[ What is claimed is:] [1.] A protection apparatus for an active electronics circuit board comprising:a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around the entire said active electronics circuit

이 특허에 인용된 특허 (27)

  1. Bliven David C. (San Jose CA) Vranicar Anthony (Santa Clara CA) Vail Philip B. (San Leandro CA) Shimirak Gerald L. (Danville CA) Mullaney Julian S. (Raleigh NC), Alarm and test system for a digital added main line.
    상세보기
  2. Uken William D. (Fremont CA), Article for protection of a substrate.
    상세보기
  3. Lane, Richard J.; Rozek, Kurt L., Circuit board package and method of manufacture.
    상세보기
  4. Chapman Dwight E. (Columbus OH) DeProspero David A. (Upper Arlington OH), Composite sheet material for electromagnetic radiation shielding.
    상세보기
  5. Goto Hideo (Atsugi JPX), Composite sheet material for magnetic and electronic shielding and product obtained therefrom.
    상세보기
  6. Kadokura Susumu (Sagamihara JPX), Electrically conductive covers and electrically conductive covers of electronic equipment.
    상세보기
  7. Annis Gerald A. (Honeoye Falls NY) Hoge ; Jr. William C. (Palmyra NY) Welch Robert L. (Webster NY), Emi shielding having flexible conductive envelope.
    상세보기
  8. Mehta Rajendra M. (Ypsilanti MI), Encapsulated product and method of manufacture.
    상세보기
  9. McDermott Michael G. (Glenside PA), Encapsulation and insulation of electronic circuit board structures.
    상세보기
  10. Shimirak Gerald L. (Danville CA) Thomas Jackie (East Palo Alto CA) Morales Miguel (Pacifica CA), Gel filled electrical connector.
    상세보기
  11. Shimirak Gerald L. (Danville CA) Thomas Jackie (Sunnyvale CA) Morales Miguel (Fremont CA) Dhanik Yogendra S. (Fremont CA) Messner Darcey (Sunnyvale CA), Gel filled modular electrical connecting block.
    상세보기
  12. Salisbury Ian David (Galmpton EN) Ingram Roy Edward (Brixham EN), Hybrid circuit package.
    상세보기
  13. Monovoukas Yiannis A. (Menlo Park CA), Induction heating of loaded materials.
    상세보기
  14. Hayashi Hideharu (Kosai JPX), Junction block.
    상세보기
  15. Leyland Walter E. (Riverside CA), Lightweight portable EMI shielding container.
    상세보기
  16. Koskenmaki David C. (St. Paul MN) Calhoun Clyde D. (Stillwater MN) Tucker Pamela S. (Austin TX) Lambert ; Jr. Robert L. (Georgetown TX), Method of forming metal fiber mat/polymer composite.
    상세보기
  17. Foss Robert M. (Scottsdale AZ) Severson Gerald R. (Scottsdale AZ), Method of hermetically sealing electronic packages.
    상세보기
  18. Gustafson Ake (La Coudraie CH-1618 Chatel-St-Denis CHX), Method of making a shield that is substantially opaque to electromagnetic radiation.
    상세보기
  19. Kiku Yutaro (Yokohama JPX), Multifunctional card having a static protection.
    상세보기
  20. Kiku Yutaro (Yokohama JPX), Multifunctional card having an electromagnetic wave protection.
    상세보기
  21. Butterworth Donald J. (Glen Mills PA), RF shielded and electrically insulated circuit board structure and method of making same.
    상세보기
  22. Bennett George D. (Shelburne VT), Sealed split instrument housing with foil-backed acrylic transfer adhesive tearband.
    상세보기
  23. Jones Allen M. (Novi MI), Self tooling, molded electronics packaging.
    상세보기
  24. Jones Allen M. (Novi MI), Shielded self-molding package for an electronic component.
    상세보기
  25. Dittmer Catherine A. (Half Moon Bay CA) Dubrow Robert S. (Redwood City CA), Thermally conductive gel materials.
    상세보기
  26. Hasegawa Hiroaki (Fukui JPX), Transparent electromagnetic wave shielding material.
    상세보기
  27. Sibbach William R. (Hoffman Estates IL) Conant Roger P. (Glencoe IL), Water vapor barrier laminate for packaging.
    상세보기

이 특허를 인용한 특허 (40)

  1. Glovatsky,Andrew, Apparatus and method for protecting an electronic circuit.
    상세보기
  2. Batten ; Jr. L. Eugene ; McCulloch Dennis A. ; Fordham Mark J., Assemblies of electrical devices and flexible containers therefor.
    상세보기
  3. Batten ; Jr. L. Eugene ; McCulloch Dennis A., Assemblies of electronic devices and flexible containers therefor.
    상세보기
  4. Batten ; Jr. L. Eugene ; McCulloch Dennis A. ; Kim John, Assemblies of printed circuit boards and flexible containers therefor.
    상세보기
  5. Hendren, Keith J.; Coster, Daniel J.; Brock, John; Goldberg, Michelle Rae; Mathew, Dinesh; Ligtenberg, Chris; Ching, Hank D.; Wheelock, Glenn E., Battery connector structures for electronic devices.
    상세보기
  6. Furukawa, Koji, Connector.
    상세보기
  7. Philipp, Dietmar; Sievers, Christian, Control device.
    상세보기
  8. George, Frank R.; Bryant, Robert T.; Daly, Michael F.; Loya, Arthur A.; Ritz, Mary C., Cover for electromagnetic treatment applicator.
    상세보기
  9. George, Frank R.; Bryant, Robert T.; Daly, Michael F.; Loya, Arthur A.; Ritz, Mary C., Cover for electromagnetic treatment applicator.
    상세보기
  10. Denzene Quentin S. ; Nealis Edwin J., Cover member for sealed circuit board assembly.
    상세보기
  11. George, Frank R.; Bryant, Robert T.; Daly, Michael F.; Loya, Arthur A.; Ritz, Mary C., Disposable protective cover for RF treatment apparatus.
    상세보기
  12. MacDonald, James D.; Marcinkiewicz, Walter; Mendolia, Gregory S., Electric module structure formed with a polymer shrunk material.
    상세보기
  13. Naritomi, Masanori, Electrical equipment for junction and method of manufacturing the same.
    상세보기
  14. Gabower,John F., Electromagnetic interference shields for electronic devices.
    상세보기
  15. Winch, Gary William; Smith, Brian Donald, Electromagnetically shielded enclosure with operable interfaces.
    상세보기
  16. Shirasaki, Takayuki, Electronic component mounting package and electronic device.
    상세보기
  17. Denzene Quentin Scott ; Nealis Edwin John, Electronic enclosure with improved environmental protection.
    상세보기
  18. Neill, Ryan Thomas; Hartley, Gary Wayne; Donelson, Michael Eugene; Trautman, Theodore Robert; Gilmer, John Walker; Maine, James Collins; Bishop, Bryan Steven; Young, Robert Erik, Encapsulation of electrically energized articles.
    상세보기
  19. Carswell,Samuel A., Environmental protection of serial ATA and other electronic devices.
    상세보기
  20. Desai,Shrikant M., Hook and loop device applied to control shock and vibration of critical components.
    상세보기
  21. Braxton Thomas Ray, Housing assembly utilizing a heat shrinkable composite laminate.
    상세보기
  22. Loebowitz, Torben; Grimm, Axel, Housing, in particular an industrial housing.
    상세보기
  23. Lin,M. C; Liu,Jim; Jan,Hank, Information device.
    상세보기
  24. Arai,Tsuyoshi; Furuhashi,Masayuki, Insert molding technique.
    상세보기
  25. Forte, Steven Lo; Oliphant, David, Integrated shield wrap.
    상세보기
  26. Neill, Ryan Thomas; Donelson, Michael Eugene; Bishop, Bryan Steven, Lamination process optimization utilizing neopentyl glycol-modified polyesters.
    상세보기
  27. Goenka Lakhi Nandlal ; Li Delin ; Dailey Daniel Phillip ; Schweitzer Charles Frederick ; Bednarz Michael ; Nation Brenda Joyce, Method for protecting electronic components.
    상세보기
  28. Isoda, Takeshi; Shinoda, Koji, Method of manufacturing a device module.
    상세보기
  29. Hunkeler,Hugh R.; Fortune,Duane D., Method of manufacturing a sealed electronic module.
    상세보기
  30. Arnold, Rocky R.; Zarganis, John; Toyama, Steve, Multi-layered structures and methods for manufacturing the multi-layered structures.
    상세보기
  31. Kanne Mark Melvin ; Whiting Ian Mark, Protective shield tent and method of using same.
    상세보기
  32. George, Frank R.; Bryant, Robert T.; Daly, Michael F.; Loya, Arthur A.; Ritz, Mary C., RF shielding cover for RF radiating applicator.
    상세보기
  33. Suzuki Masataka,JPX ; Ashiya Hiroyuki,JPX ; Maki Yayoi,JPX ; Masuda Atsushi,JPX, Resin-coated mount substrate and method of producing the same.
    상세보기
  34. Rogers, John A.; Fan, Jonathan; Yeo, Woon-Hong; Su, Yewang; Huang, Yonggang; Zhang, Yihui, Self-similar and fractal design for stretchable electronics.
    상세보기
  35. Rogers, John A.; Fan, Jonathan; Yeo, Woon-Hong; Su, Yewang; Huang, Yonggang; Zhang, Yihui, Self-similar and fractal design for stretchable electronics.
    상세보기
  36. Zambaux, Jean-Pascal, Sterile, pyrogen-free, polymeric film-based heating bag.
    상세보기
  37. Chu Richard C. ; Chrysler Gregory M. ; Simons Robert E., Sub-dew point cooling of electronic systems.
    상세보기
  38. Walter Kicinski ; Christine White, System for monitoring plant assets including machinery.
    상세보기
  39. Bedoe, Scott; Buck, Frederick Allan, System of forming a protective covering for a wire harness.
    상세보기
  40. Donelson, Michael Eugene; Neill, Ryan Thomas; Maine, James Collins; Bishop, Bryan Steven; Young, Robert Erik, Using branched polymers to control the dimensional stability of articles in the lamination process.
    상세보기

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