초록 ▼

An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distri

An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus comprising:a heat transfer body mounted in proximity to an electronic device, said heat transfer body having a surface;an adhesive distributed on said heat transfer body, wherein said adhesive affixes said surface of said heat transfer body in proximity to sa

[ What is claimed is:] [1.] An apparatus comprising:a heat transfer body mounted in proximity to an electronic device, said heat transfer body having a surface;an adhesive distributed on said heat transfer body, wherein said adhesive affixes said surface of said heat transfer body in proximity to said electronic device, said adhesive being distributed such that heat transfer from said electronic device to said heat transfer body occurs substantially independently of said adhesive; anda thermally conductive material disposed between and in contact with said electronic device and said surface of said heat transfer body, wherein said thermally conductive material is a liquid at an operating temperature of said electronic device;wherein said surface of said heat transfer body is in contact with both said thermally conductive material and said adhesive, said surface having at least one channel formed therein that is located between regions of said surface contacted by said adhesive and regions of said surface contacted by said thermally conductive material such that said at least one channel limits contact between said thermally conductive material and said adhesive.