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Patterned metal foil laminate and method for making same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44C-001/22
출원번호 US-0602576 (1996-02-14)
발명자 / 주소
  • Schmelzer Michael A.
  • Swiontek Anthony Joseph
  • Habeger Charles C.
  • Pollart Kenneth A.
출원인 / 주소
  • Fort James Corporation
대리인 / 주소
    Sixbey, Friedman, Leedom & Ferguson , PCLeedom, Jr.
인용정보 피인용 횟수 : 142  인용 특허 : 9

초록

A patterned metal foil/substrate laminate wherein the pattern is formed by laminating a sheet of metal foil to a substrate by applying an adhesive between the metal foil and substrate in a predetermined pattern which defines areas where adhesive is present and areas where no adhesive is present, cut

대표청구항

[ We claim:] [1.] A method of forming a patterned metal foil/substrate laminate comprising the steps of:(a) laminating a sheet of metal foil to a substrate by applying an adhesive between said metal foil and said substrate in a pattern which defines areas where adhesive is present and areas where no

이 특허에 인용된 특허 (9)

  1. Maynard Patrick L. (Combined Locks WI) Schmelzer Michael A. (Appleton WI) Pawlowski Thomas D. (Neenah WI) Hollenberg David H. (Neenah WI) Katz Leon (Stamford CT) VanHandel Gerald J. (Neenah WI), Control of microwave interactive heating by patterned deactivation.
  2. Wilson David (Mississauga CAX), Demetallization of metal films.
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  8. Saunier Christiane-Monique (Bjuv SEX), Package having aluminum laminate side wall shield.
  9. Beckett Donald E. (963 Tennyson Ave. Mississauga ; Ontario CAX L5H 2Y9), Production of demetallized packaging material.

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