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Micromechanical semiconductor component and manufacturing method therefor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/84
출원번호 US-0616629 (1996-03-15)
우선권정보 DE-0009868 (1995-03-17)
발명자 / 주소
  • Hierold Christofer,DEX
  • Scheiter Thomas,DEX
  • Biebl Markus,DEX
  • Klose Helmut,DEX
출원인 / 주소
  • Siemens Aktiengesellschaft, DEX
대리인 / 주소
    Hill, Steadman & Simpson
인용정보 피인용 횟수 : 49  인용 특허 : 4

초록

A component having a movable micromechanical function element arranged in a cavity having a cover layer supported by webs or pillar-like supports is provided. The movable element is potentially covered with a termination layer for closing the etching holes present in the cover layer. Electrical term

대표청구항

[ We claim:] [1.] A micromechanical semiconductor component comprising:a substrate having an upper side;a movable element constructed as a layer and arranged above the upper side of the substrate the movable element having a mobility range;a cover layer located at that side of the movable element th

이 특허에 인용된 특허 (4)

  1. Kloeck Benjamin (Hitachi JPX) Suzuki Seiko (Hitachioota JPX) Tsuchitani Shigeki (Mito JPX) Miki Masayuki (Katsuta JPX) Matsumoto Masahiro (Hitachi JPX) Sato Kazuo (Tokyo JPX) Koide Akira (Choufu JPX), Capacitive type semiconductor accelerometer.
  2. Mastrangelo Carlos H. (Ann Arbor MI), Dry-release method for sacrificial layer microstructure fabrication.
  3. Dunn William C. (Mesa AZ) Scofield ; Jr. Brooks L. (Tempe AZ), Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip.
  4. Fitch Jon T. (Austin TX) Maniar Papu (Austin TX) Witek Keith E. (Austin TX) Gelatos Jerry (Austin TX) Moazzami Reza (Austin TX) Ajuria Sergio A. (Austin TX), Method of forming a semiconductor structure having an air region.

이 특허를 인용한 특허 (49)

  1. Lutz, Markus; Partridge, Aaron; Kronmueller, Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.
  2. Lutz,Markus; Partridge,Aaron; Kronmueller,Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.
  3. Otani Hiroshi,JPX ; Yamaguchi Yasuo,JPX, Electrostatic capacity-type acceleration sensor.
  4. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  5. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  6. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  7. Fukuda, Hiroshi; Hanaoka, Yuko; Fujimori, Tsukasa, Inertial sensor and manufacturing method of the same.
  8. Chiu,Anthony M.; Siegel,Harry Michael, Integrated lid formed on MEMS device.
  9. Fukuda, Hiroshi; Fujimori, Tsukasa; Yokoyama, Natsuki; Hanaoka, Yuko; Matsumura, Takafumi, Integrated micro electro-mechanical system and manufacturing method thereof.
  10. Hsu, Hsin-Hui; Lee, Sheng-Ta; Wang, Chuan-Wei, MEMS package structure.
  11. Hsu, Hsin-Hui; Lee, Sheng-Ta; Wang, Chuan-Wei, MEMS package structure.
  12. Hsu, Hsin-Hui; Lee, Sheng-Ta; Wang, Chuan-Wei, MEMS package structure and method for fabricating the same.
  13. Schoen, Florian, MEMS substrates, devices, and methods of manufacture thereof.
  14. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.
  15. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.
  16. Chilcott, Dan W., Method for manufacturing a micro-electro-mechanical device.
  17. Aigner, Robert; Oppermann, Klaus-Günter, Method for producing a filled recess in a material layer, and an integrated circuit configuration produced by the method.
  18. Beatty Timothy S., Method for protecting a transistor gate from charge damage.
  19. David Fraser ; Brian Doyle, Method of creating shielded structures to protect semiconductor devices.
  20. Fraser, David; Doyle, Brian, Method of creating shielded structures to protect semiconductor devices.
  21. Fraser, David; Doyle, Brian, Method of creating shielded structures to protect semiconductor devices.
  22. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating electromechanical device having a controlled atmosphere.
  23. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating microelectromechanical systems and devices having trench isolated contacts.
  24. Andrew C. McNeil ; David J. Monk ; Bishnu P. Gogoi, Method of manufacturing a sensor.
  25. Degawa, Munenori; Jeong, Heewon, Micro electro mechanical system.
  26. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same.
  27. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.
  28. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.
  29. Allegato, Giorgio; Simoni, Barbara; Valzasina, Carlo; Corso, Lorenzo, Microelectromechanical device with signal routing through a protective cap.
  30. Allegato, Giorgio; Simoni, Barbara; Valzasina, Carlo; Corso, Lorenzo, Microelectromechanical device with signal routing through a protective cap.
  31. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems and devices having thin film encapsulated mechanical structures.
  32. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems having trench isolated contacts, and methods for fabricating same.
  33. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems, and devices having thin film encapsulated mechanical structures.
  34. Hsu, Hsin-Hui; Lee, Sheng-Ta; Wang, Chuan-Wei, Microelectronic device and MEMS package structure and fabricating method thereof.
  35. Lutz,Markus, Micromechanical component and method for producing the same.
  36. Franz, Jochen; Illing, Matthias; Henning, Frank; Fischer, Frank; Hein, Peter, Micromechanical structure, in particular for an acceleration sensor or yaw rate sensor and a corresponding method for producing the same.
  37. Scheiter Thomas,DEX ; Hierold Christofer,DEX ; Naher Ulrich,DEX, Process for producing micromechanical sensors.
  38. Naher Ulrich,DEX ; Berthold Adrian,DEX ; Scheiter Thomas,DEX ; Hierold Christofer,DEX, Semiconductor chip.
  39. Werner Wolfgang,DEX ; Bruchhaus Rainer,DEX ; Wersing Wolfram,DEX, Semiconductor detector for infrared radiation and method for manufacturing same.
  40. Takeshi Ito JP; Muneo Yorinaga JP; Hirofumi Higuchi JP, Semiconductor physical quantity sensor.
  41. Fraser, David; Doyle, Brian, Shielded structures to protect semiconductor devices.
  42. Geisberger, Aaron A., Spring member for use in a microelectromechanical systems sensor.
  43. Judy Michael W., Suspension arrangement for semiconductor accelerometer.
  44. Maxwell, John Alan; Divakar, Mysore Purushotham; Templeton, Jr., Thomas Henry, System and method of reducing die attach stress and strain.
  45. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  46. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  47. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  48. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure.
  49. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure and method of manufacturing same.
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