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Orientation independent evaporator 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0598593 (1996-02-12)
발명자 / 주소
  • Anderson Timothy Merrill
  • Chrysler Gregory Martin
  • Chu Richard Chao-Fan
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cutter
인용정보 피인용 횟수 : 71  인용 특허 : 7

초록

In accordance with a preferred embodiment of the present invention, an orientation independent evaporator includes a wicking member which also operates as a manifold which possesses a number of surface accessible channels preferably via grooves cut in either side of a slab of wicking material at rig

대표청구항

[ The invention claimed is:] [1.] An orientation independent evaporator for cooling a body, said evaporator comprising:a housing for containing an evaporatable cooling fluid, said housing having an extended surface for thermal contact with said body which is to be cooled, said extended surface havin

이 특허에 인용된 특허 (7)

  1. Hamburgen William R. (Menlo Park CA), Apparatus and method for removal of heat from packaged element.
  2. Faghri Amir (Dayton OH), Centrifugal heat pipe vapor absorption heat pump.
  3. Grossman Arthur (Framingham MA), Controlled heat exchanger system.
  4. Holtzapple Mark T. (Brazos TX) Ernst Donald M. (Leola PA), High efficiency, orientation-insensitive evaporator.
  5. Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger and clamping plate.
  6. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger, and clamping plate.
  7. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (New Paltz NY), Intersecting flow network for a cold plate cooling system.

이 특허를 인용한 특허 (71)

  1. Weber, Richard M., Apparatus for cooling with coolant at subambient pressure.
  2. Suzuki, Kazuaki; Sato, Shigemasa; Idei, Akio, Boiling refrigerant type cooling system.
  3. Suzuki, Kazuaki; Sato, Shigemasa; Idei, Akio, Boiling refrigerant type cooling system.
  4. Valenzuela, Javier A., Capillary condenser/evaporator.
  5. Valenzuela, Javier A., Capillary evaporator.
  6. Pfister Dennis M. ; Byrd Charles M., Circuit board having an integral sorber.
  7. Vögerl, Andreas; Bauer, Gerhard; Henniger, Jürgen; Trenner, Uwe; Karrer, Helmut; Wenk, Alexander; Gebhardt, Marion, Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance.
  8. Uchida, Hiroki; Ogata, Susumu, Cooling device using loop type heat pipe.
  9. Toyoda, Hiroyuki; Nakajima, Tadakatsu; Kondo, Yoshihiro; Sasaki, Shigeyuki; Idei, Akio; Satoh, Shigemasa, Cooling system and electronic apparatus applying the same therein.
  10. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  11. Pfister, Dennis M.; Byrd, Charles M.; Davidson, Howard L., Distributed graphitic foam heat exchanger system.
  12. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporator employing a liquid superheat tolerant wick.
  13. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Evaporator for a heat transfer system.
  14. Khrustalev, Dmitry; Cologer, Pete; Garzon, Jessica Maria; Stouffer, Charles; Feenan, Dave; Baker, Jeff; Beres, Matthew C., Evaporator for use in a heat transfer system.
  15. Kroliczek, Edward J.; Khrustalev, Dmitry; Morgan, Michael J., Evaporator including a wick for use in a two-phase heat transfer system.
  16. Huang, Bin-Juine; Huang, Huan-Hsiang; Sun, Fu-Sheng; Lian, Yi-Hai, Evaporator, loop heat pipe module and heat generating apparatus.
  17. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Evaporators for heat transfer systems.
  18. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  19. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  20. Wong,Shwin Chung, Flat-plate heat pipe containing channels.
  21. Heady,Gregory S., Heat collector plate for an electronic display.
  22. Schulz-Harder Jurgen,DEX ; Exel Karl,DEX ; Medick Bernd,DEX ; Bauer-Schulz-Harder Veronika,DEX, Heat exchanger arrangement and cooling system with at least one such heat exchanger arrangement.
  23. Thompson, Alex; Ward, Terence G., Heat transfer plate.
  24. Thors, Petur, Heat transfer surface for electronic cooling.
  25. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, David A., Heat transfer system.
  26. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Heat transfer system.
  27. Bezama, Raschid J.; Long, David C.; Natarajan, Govindarajan; Weiss, Thomas, Liquid cooled compliant heat sink and related method.
  28. Bezama, Raschid J.; Long, David C.; Natarajan, Govindarajan; Weiss, Thomas, Liquid cooled compliant heat sink and related method.
  29. Calaman, Douglas P.; Connors, Mathew J., Liquid cooled heat exchanger with enhanced flow.
  30. Calaman, Douglas P.; Connors, Matthew J., Liquid cooled heat exchanger with enhanced flow.
  31. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
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  33. Ravi Prasher ; Dave Payne, Loop heat pipe for mobile computers.
  34. Edward J. Kroliczek ; Kimberly R. Wrenn ; David A. Wolf, Sr., Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction.
  35. Kang, Shung-Wen; Tsai, Meng-Chang, Loop heat pipe with flat evaportor having a wick with an internal chamber.
  36. Alex,Belits; Valeriy,Belits, Low-profile thermosyphon-based cooling system for computers and other electronic devices.
  37. Kroliczek,Edward J.; Yun,James Seokgeun; Nikitkin,Michael; Wolf, Sr.,David A., Manufacture of a heat transfer system.
  38. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  39. Weber, Richard M.; Wyatt, William G.; Rummel, Kerrin A., Method and apparatus for cooling electronics with a coolant at a subambient pressure.
  40. Davidson,Howard, Method and apparatus for making a sorber.
  41. Lee, Jeong Hyun, Method for heat transfer and device therefor.
  42. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  43. Corbin,David; Goodson,Kenneth; Kenny,Thomas; Santiago,Juan; Zeng,Shulin, Micro-fabricated electrokinetic pump.
  44. Yang, Sophia S.; Jacobsen, Alan J., Micro-truss materials having in-plane material property variations.
  45. Carter, William B.; Gross, Adam F.; Guinn, Keith V.; Jacobsen, Alan J.; Kisailus, David, Microtruss based thermal heat spreading structures.
  46. Carter, William B.; Brewer, Peter D.; Gross, Adam F.; Rogers, Jeffrey L.; Guinn, Keith V.; Jacobsen, Alan J., Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments.
  47. Chesser, Jason B.; Faneuf, Barrett M.; Montgomery, Stephen W., Modular capillary pumped loop cooling system.
  48. Chesser,Jason B.; Faneuf,Barrett M.; Montgomery,Stephen W., Modular capillary pumped loop cooling system.
  49. Joshi, Yogendra; Murthy, Sunil S.; Nakayama, Wataru, Orientation-independent thermosyphon heat spreader.
  50. Ueki Tatsuhiko,JPX ; Yamamoto Masaaki,JPX ; Ikeda Masami,JPX, Plate type heat pipe and a cooling system using same.
  51. Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Ueki Tatsuhiko,JPX ; Sasaki Ken,JPX, Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe.
  52. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  53. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  54. Fujisaki,Akihiko, Semiconductor device cooling apparatus.
  55. Wang,Chin Wen; Wang,Pei Choa; Wang,Ching Chung, Supporting structure for planar heat pipe.
  56. Wyatt, William G.; Weber, Richard M., System and method for separating components of a fluid coolant for cooling a structure.
  57. Weber, Richard M.; Rummel, Kerrin A.; Payton, Albert P., System and method of boiling heat transfer using self-induced coolant transport and impingements.
  58. Zhang, Chunbo; Gu, Yuandong; Kristoffersen, Martin; Kulacki, Francis A.; Krafthefer, Brian C., System and method that dissipate heat from an electronic device.
  59. Zhang, Chunbo; Gu, Yuandong; Kristoffersen, Martin; Kulacki, Francis A.; Krafthefer, Brian C., System and method that dissipate heat from an electronic device.
  60. Strempke James A., System for removing solder.
  61. Yamazaki, Naoya; Iino, Kazuhiro; Shirakami, Takashi; Tada, Yoshiaki, Thermal diffuser and radiator.
  62. Kroliczek, Edward J.; Yun, James; Bugby, David; Wolf, Sr., David A., Thermal management system.
  63. Garner, Scott D., Thermal management system and method for electronics system.
  64. Garner, Scott D., Thermal management system and method for electronics system.
  65. Kroliczek, Edward J.; Yun, James S.; Bugby, David C.; Wolf, Sr., David A., Thermal management systems.
  66. Kroliczek, Edward J.; Yun, James Soekgeun; Bugby, David C.; Wolf, Sr., David A., Thermal management systems including venting systems.
  67. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Thermodynamic system including a heat transfer system having an evaporator and a condenser.
  68. Yang, Hsiu-Wei, Thin heat pipe structure and manufacturing method thereof.
  69. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
  70. Kroliczek, Edward J.; Khrustalev, Dmitry; Morgan, Michael J., Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems.
  71. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same.
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