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[미국특허] Sensors for a linear polisher 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
  • B24B-051/00
출원번호 US-0797470 (1997-02-06)
발명자 / 주소
  • Pant Anil K.
  • Breivogel Joseph R.
  • Young Douglas W.
  • Jairath Rahul
  • Engdahl Erik H.
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Kidd & Booth, LLP
인용정보 피인용 횟수 : 115  인용 특허 : 13

초록 ▼

A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information fro

대표청구항 ▼

[ We claim:] [1.] In a tool utilized to polish a material having a planar surface and in which said planar surface is placed upon a polishing pad for polishing said planar surface, an apparatus for determining a polishing force exerted onto said planar surface comprising:a platen disposed along an u

이 특허에 인용된 특허 (13) 인용/피인용 타임라인 분석

  1. Yu Chris C. (Boise ID) Sandhu Gurtej S. (Boise ID), Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection.
    상세보기
  2. Rostoker, Michael D., Detecting the endpoint of chem-mech polishing, and resulting semiconductor device.
    상세보기
  3. Leach Michael A. (South Burlington VT) Machesney Brian J. (Burlington VT) Nowak Edward J. (Essex Junction VT), Device and method for detecting an end point in polishing operation.
    상세보기
  4. Cote William J. (Poughquag NY) Cronin John E. (Milton VT) Hill William R. (Underhill VT) Hoffman Cheryl A. (Colchester VT), Endpoint detection apparatus and method for chemical/mechanical polishing.
    상세보기
  5. Kaanta Carter W. (Colchester VT) Leach Michael A. (Bristol VT), In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection.
    상세보기
  6. Miller Gabriel L. (Westfield NJ) Wagner Eric R. (South Plainfield NJ), In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection.
    상세보기
  7. Lustig Naftali E. (Croton-on-Hudson NY) Saenger Katherine L. (Ossining NY) Tong Ho-Ming (Yorktown Heights NY), In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing.
    상세보기
  8. Nakata Tomohiro (Kanagawa JPX), Method and apparatus for burnishing magnetic disks.
    상세보기
  9. Schultz Laurence D. (Boise ID), Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer.
    상세보기
  10. Sandhu, Gurtej S.; Schultz, Laurence D.; Doan, Trung T., Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers.
    상세보기
  11. Morioka Izuru (Tokyo JPX) Kuwano Kenji (Tokyo JPX), Polishing apparatus.
    상세보기
  12. Talieh Homayoun (San Jose CA) Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA), Wafer polishing machine with fluid bearings.
    상세보기
  13. Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA) Talieh Homayoun (San Jose CA), Wafer polishing machine with fluid bearings and drive systems.
    상세보기

이 특허를 인용한 특허 (115) 인용/피인용 타임라인 분석

  1. Talieh, Homayoun; Basol, Bulent M., Advanced chemical mechanical polishing system with smart endpoint detection.
    상세보기
  2. Talieh,Homayoun; Basol,Bulent M., Advanced chemical mechanical polishing system with smart endpoint detection.
    상세보기
  3. Wang, Yuchun; Frey, Bernard M.; Basol, Bulent M.; Talieh, Homayoun; Young, Douglas W.; McGrath, Brett E.; Desai, Mukesh; Velazquez, Efrain; Truong, Tuan, Advanced chemical mechanical polishing system with smart endpoint detection.
    상세보기
  4. Kistler, Rodney C., Afferent-based polishing media for chemical mechanical planarization.
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  5. Mike Ravkin ; Katrina Mikhaylich ; Don E. Anderson, Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process.
    상세보기
  6. Walters, Joseph W.; Kneer, Emil; Cooper, Eric; Grizzard, Richard, Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process.
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  7. Gotkis,Yehiel; Lim,Danny, Apparatus and method for controlling fluid material composition on a polishing pad.
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  8. Thornton Brian ; Nagengast Andrew J. ; Boehm ; Jr. Robert G. ; Pant Anil K. ; Krusell Wilbur C., Apparatus and method for performing end point detection on a linear planarization tool.
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  12. Birang Manoocher ; Rosenberg Lawrence M. ; Somekh Sasson ; White John M, Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet.
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  15. Taravade Kunal N., Apparatus for detecting an endpoint polishing layer of a semiconductor wafer having a wafer carrier with independent concentric sub-carriers and associated method.
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  30. Shelton Gail D. ; Miller Gayle W., Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint.
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  37. Tzeng Huey-Ming, In-situ monitoring of polishing pad wear.
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  40. Franklin, Timothy J.; Marohl, Dan A., Integrated platen assembly for a chemical mechanical planarization system.
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  53. Renteln, Peter; Jensen, Alan J.; Lamb, David S., Method and apparatus for conditioning fixed-abrasive polishing pads.
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    상세보기
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    상세보기
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