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[미국특허] Carrier head design for a chemical mechanical polishing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-005/00
  • B24B-029/00
출원번호 US-0637208 (1996-04-24)
발명자 / 주소
  • Zuniga Steven M.
  • Blumenkranz Stephen J.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Fish & Richardson, P.C.
인용정보 피인용 횟수 : 157  인용 특허 : 23

초록

A carrier head uses a pressure chamber and a gimbal. The gimbal allows the carrier base to pivot with respect to the drive shaft about a point at the interface between the substrate and the polishing pad. The gimbal may "float" so that no downward force is applied to the substrate through the gimbal

대표청구항

[ What is claimed is:] [1.] A carrier head for a chemical mechanical polishing apparatus comprising:a housing connectable to a drive shaft to rotate with said drive shaft about a first axis;a base to hold a substrate against a polishing pad, said base connected to said housing to rotate about said f

이 특허에 인용된 특허 (23) 인용/피인용 타임라인 분석

  1. Gill ; Jr. Gerald L. (Phoenix AZ) Hyde Thomas C. (Chandler AZ), Apparatus for transporting wafer to and from polishing head.
  2. Gill ; Jr. Gerald L. (Phoenix AZ) Hyde Thomas C. (Chandler AZ), Apparatus for transporting wafer to and from polishing head.
  3. Gill ; Jr. Gerald L. (3502 E. Atlanta Ave. Phoenix AZ 85040), Counterbalanced polishing apparatus.
  4. Bukhman Yefim (Scottsdale AZ), Distributed polishing head.
  5. Cesna Joseph V. (Niles IL), Liquid waxless fixturing of microsize wafers.
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  7. Okumura Katsuya (Poughkeepsie NY) Watanabe Tohru (Hopewell Junction NY) Aoki Riichirou (Kawasaki NY JPX) Yano Hiroyuki (Wappingers Falls NY) Kodera Masako (Kawasaki JPX) Shigeta Atsushi (Kawasaki JPX, Method and apparatus for polishing a workpiece.
  8. Fusco Albert J. (East Boston MA) Cochran Bruce C. (Lexington MA), Method for polishing detector material.
  9. Basi Jagtar S. (Fishkill NY) Mendel Eric (Poughkeepsie NY), Method for polishing titanium carbide.
  10. Carr Jeffrey W. (Fishkill NY) David Lawrence D. (Wappingers Falls NY) Guthrie William L. (Hopewell Junction NY) Kaufman Frank B. (Amawalk NY) Patrick William J. (Newburgh NY) Rodbell Kenneth P. (Poug, Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor.
  11. Banks Edward L. (Willingboro Township ; Burlington County NJ), Methods and apparatus for polishing a semiconductor wafer.
  12. Hirose Masayoshi (Tokyo JPX) Tsujimura Manabu (Tokyo JPX) Ishikawa Seiji (Tokyo JPX) Kimura Norio (Tokyo JPX) Ishii You (Tokyo JPX), Polishing apparatus.
  13. Tanaka Kouichi (Takasaki JPX) Uchiyama Isao (Nishigo JPX), Polishing apparatus.
  14. Nakajima Makoto (Nagano JPX), Polishing machine.
  15. Krmer Hans (Burghausen DEX) Kirschner Helmuth (Burghausen DEX), Process for evening out the amount of material removed from discs in polishing.
  16. Runnels Scott (Austin TX) Eyman L. Michael (San Antonio TX), Pulsed-force chemical mechanical polishing.
  17. Volodarsky Konstantine (San Francisco CA) Kajiwara Jiro (Foster City CA) Owens ; Jr. Herbert W. (San Jose CA) King Jan H. (Sunnyvale CA), Rotary union for coupling fluids in a wafer polishing apparatus.
  18. Koeth Joe E. (Mesa AZ) Hoffman Melvin J. (Scottsdale AZ) Jackson Paul D. (Scottsdale AZ), Semiconductor wafer carrier and method.
  19. Olmstead Dennis L. (Sherman TX), Semiconductor wafer polishing using a hydrostatic medium.
  20. Volodarsky Konstantine (San Francisco CA) Kajiwara Jiro (Foster City CA) Owens ; Jr. Herbert W. (San Jose CA) King Jan H. (Sunnyvale CA), Wafer polisher head adapted for easy removal of wafers.
  21. Shendon Norm (San Carlos CA) Struven Kenneth C. (San Carlos CA) Kolenkow Robert J. (Berkeley CA), Wafer polisher head having floating retainer ring.
  22. Karlsrud Chris E. (Chandler AZ) Van Woerkom Anthony G. (Chandler AZ) Odagiri Shigeru (Yokohama JPX) Nagahashi Isao (Fujisawa AZ JPX) Preston Spencer (Chandler AZ), Wafer polishing method and apparatus.
  23. Strasbaugh Alan (825 Buckley Rd. San Luis Obispo CA 93401), Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied.

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