이 특허를 인용한 특허 (68) 인용/피인용 타임라인 분석

1. Park, Allen; Chang, Ellis, Alteration for wafer inspection.

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2. Howland, William H., Apparatus and method for determining doping concentration of a semiconductor wafer.

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3. Howland, William H., Apparatus and method for determining electrical properties of a semiconductor wafer.

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4. Howland, William H., Apparatus for determining doping concentration of a semiconductor wafer.

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5. Kurada, Satya; Babulnath, Raghav; Ng, Kwok; Gao, Lisheng, Based sampling and binning for yield critical defects.

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6. Saidin, Zain K.; Xiong, Yalin; Glasser, Lance; Hess, Carl; Preil, Moshe E., Computer-implemented methods for detecting defects in reticle design data.

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7. Florence, Glenn; Park, Allen; Rose, Peter, Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects.

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8. Park, Allen; Chang, Ellis, Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan.

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9. Choi, SunYong; Pae, YeonHo; Chang, Ellis, Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer.

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10. Su, Bo; Verma, Gaurav; Du, Hong; Shi, Rui-fang; Andrews, Scott, Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer.

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11. Haga,Tsuyoshi; Shimada,Shigeki; Kimura,Atsushi, Contact probe.

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12. Samsavar,Amin; Schmidt,John M.; Schierle,Rainer; Horner,Gregory S.; Miller,Thomas G.; Xu,Zhiwei; Hu,Xiaofeng; Shi,Jianou; Edelstein,Sergio, Contactless charge measurement of product wafers and control of corona generation and deposition.

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13. Kulkarni, Ashok V.; Chen, Chien-Huei (Adam), Design-based inspection using repeating structures.

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14. Huang, Junqing; Zhang, Yong; Chen, Stephanie; Luo, Tao; Gao, Lisheng; Wallingford, Richard, Detecting defects on a wafer.

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15. Lang, Jun; Chen, Kan; Gao, Lisheng; Huang, Junqing, Detecting defects on a wafer.

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16. Wu, Kenong; Gao, Lisheng; Chen, Grace Hsiu-Ling; Shortt, David W., Detecting defects on a wafer using defect-specific and multi-channel information.

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17. Wu, Kenong; Wu, Meng-Che; Gao, Lisheng, Detecting defects on a wafer using defect-specific information.

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18. Chu, Xing; Lauber, Jan A.; Runyon, J. Rex, Detecting defects on a wafer using template image matching.

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19. Ramachandran, Vijayakumar, Determining a position of inspection system output in design data space.

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20. Chang, Ellis; Van Riet, Michael J.; Park, Allen; Zafar, Khurram; Bhattacharyya, Santosh, Determining design coordinates for wafer defects.

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21. Kulkarni, Ashok V.; Chen, Chien-Huei Adam, Dynamic care areas.

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22. Jayaraman, Thirupurasundari; Babulnath, Raghav, Dynamic design attributes for wafer inspection.

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23. Mazur, Robert G., Flexible membrane probe and method of use thereof.

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24. Kister, January, Knee probe having increased scrub motion.

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25. Kister, January, Knee probe having reduced thickness section for control of scrub motion.

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26. Kister, January, Knee probe having reduced thickness section for control of scrub motion.

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27. Kister, January, Layered probes with core.

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28. Kister, January, Low profile probe having improved mechanical scrub and reduced contact inductance.

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29. Howland, William H.; Hillard, Robert J., Method of determining one or more properties of a semiconductor wafer.

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30. Xiong, Yalin; Hess, Carl, Methods and systems for classifying defects detected on a reticle.

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31. Kekare, Sagar A.; Peterson, Ingrid B.; Preil, Moshe E., Methods and systems for detecting defects in a reticle design pattern.

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32. Peterson, Ingrid B.; Yum, Ed, Methods and systems for detecting defects in a reticle design pattern.

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33. Chen, Chien-Huei (Adam); Xiong, Yan; Zhang, Jianxin; Chang, Ellis; Fang, Tsung-Pao, Methods and systems for determining a defect criticality index for defects on wafers.

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34. Kulkarni, Ashok; Duffy, Brian; Maayah, Kais; Rouse, Gordon; Shifrin, Eugene, Methods and systems for determining a position of inspection data in design data space.

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35. Xiong, Yan, Methods and systems for generating an inspection process for a wafer.

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36. Park, Allen; Rose, Peter; Chang, Ellis; Duffy, Brian; McCord, Mark; Abbott, Gordon, Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions.

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37. Kulkarni, Ashok; Duffy, Brian; Maayah, Kais; Rouse, Gordon, Methods and systems for utilizing design data in combination with inspection data.

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38. Kulkarni, Ashok; Duffy, Brian; Maayah, Kais; Rouse, Gordon, Methods and systems for utilizing design data in combination with inspection data.

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39. Zafar, Khurram; Kekare, Sagar; Chang, Ellis; Park, Allen; Rose, Peter, Methods and systems for utilizing design data in combination with inspection data.

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40. Zafar, Khurram; Kekare, Sagar; Chang, Ellis; Park, Allen; Rose, Peter, Methods and systems for utilizing design data in combination with inspection data.

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41. Bhaskar, Kris; McCord, Mark; Bhattacharyya, Santosh; Liang, Ardis; Wallingford, Richard; Altendorfer, Hubert; Maayah, Kais, Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer.

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42. Bhaskar, Kris; McCord, Mark; Bhattacharyya, Santosh; Liang, Ardis; Wallingford, Richard; Altendorfer, Hubert; Maayah, Kais, Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer.

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43. Verma, Gaurav; Glasser, Lance; Preil, Moshe E., Methods, systems, and carrier media for evaluating reticle layout data.

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44. Kister, January, Multiple contact probes.

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45. Kister, January, Multiple contact probes.

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46. Horner, Gregory S.; Miller, Thomas G., Non-contact hysteresis measurements of insulating films.

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47. Shi,Jianou; Cui,Steve Yifeng; Pei,Shiyou; Xu,Zhiwei (Steve); Wang,Haiyong (Howard), Non-contact methods for measuring electrical thickness and determining nitrogen content of insulating films.

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48. Robert G. Mazur ; Robert J. Hillard, Non-invasive electrical measurement of semiconductor wafers.

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49. Kister, January, Probe bonding method having improved control of bonding material.

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50. Kister, January, Probe cards employing probes having retaining portions for potting in a potting region.

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51. Kister, January; Shtarker, Alex, Probe retention arrangement.

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52. Kister, January; Shtarker, Alex, Probe retention arrangement.

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53. Kister, January, Probe skates for electrical testing of convex pad topologies.

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54. Kister, January, Probes with high current carrying capability and laser machining methods.

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55. Kister, January, Probes with offset arm and suspension structure.

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56. Kister, January, Probes with self-cleaning blunt skates for contacting conductive pads.

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57. Luo, Tao; Zhang, Yong; Chen, Stephanie, Segmentation for wafer inspection.

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58. Takemoto,Megumi; Maekawa,Shigeki; Kashiba,Yoshihiro; Deguchi,Yoshinori; Miki,Kazunobu, Semiconductor device test probe.

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59. Takemoto,Megumi; Maekawa,Shigeki; Kashiba,Yoshihiro; Deguchi,Yoshinori; Miki,Kazunobu, Semiconductor device test probe.

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60. Takemoto, Megumi; Maekawa, Shigeki; Kashiba, Yoshihiro; Deguchi, Yoshinori; Miki, Kazunobu, Semiconductor device test probe having improved tip portion and manufacturing method thereof.

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61. Kister, January, Space transformers employing wire bonds for interconnections with fine pitch contacts.

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62. Rzepiela, Jeffrey A.; Feng, Yiping; Pei, Shiyou; Kagan, Alexander; Shi, Jianou; Edelstein, Sergio, Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer.

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63. Duffy, Brian; Kulkarni, Ashok, Systems and methods for creating inspection recipes.

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64. Samsavar, Amin; Schmidt, John M.; Schierle, Rainer; Horner, Gregory S.; Miller, Thomas G.; Xu, Zhiwei; Hu, Xiaofeng; Shi, Jianou; Edelstein, Sergio, Systems configured to perform a non-contact method for determining a property of a specimen.

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65. Kister, January, Vertical guided layered probe.

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66. Kister, January, Vertical guided probe array providing sideways scrub motion.

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67. Kister, January, Vertical probe array arranged to provide space transformation.

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68. Kister, January, Vertical probe array arranged to provide space transformation.

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