초록 ▼

A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sin

A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.

대표청구항 ▼

[ We claim:] [1.] A method of producing a thermally enhanced ball grid array package for a solid state electronic component comprising:producing discreet ceramic connector members having first and second surfaces, with conductive pathways to multiple locations on said second surfaces;providing solde

[ We claim:] [1.] A method of producing a thermally enhanced ball grid array package for a solid state electronic component comprising:producing discreet ceramic connector members having first and second surfaces, with conductive pathways to multiple locations on said second surfaces;providing solder balls on said second surfaces so that said balls are electrically connected to said conductive pathways;bonding the first surfaces of a plurality of said connector members to a metal heat sink having a coefficient of thermal expansion that is different from a coefficient of expansion of said ceramic component carriers;bonding said electronic component to said metal heat sink between said connector members to produce a composite bonded structure; andelectrically connecting said electronic component to said conductive pathways, whereby said electronic component is electrically connected to said solder balls through said pathways.