초록 ▼

An apparatus produces compressive stress in a component surface. Positioning of a contact area of the component surface is controlled to situate a contact area of the component surface relative to an indenter element. The indenter element is fixtured to cause an indentation at the contact area. The

An apparatus produces compressive stress in a component surface. Positioning of a contact area of the component surface is controlled to situate a contact area of the component surface relative to an indenter element. The indenter element is fixtured to cause an indentation at the contact area. The force of the indentation is measured as the indenter element contacts the contact area, and controlled responsive to the amount of force measured and the desired compression. The system allows deep compressive stresses to be generated without the surface damage associated with conventional peening.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for producing compressive stress in a component surface comprising:positioning means to control positioning of a contact area of the component surface;at least one indenter element fixtured to contact the component surface and cause an indentation at the cont

[ What is claimed is:] [1.] An apparatus for producing compressive stress in a component surface comprising:positioning means to control positioning of a contact area of the component surface;at least one indenter element fixtured to contact the component surface and cause an indentation at the contact area;measurement means to measure force of the at least one indenter element as the at least one indenter element contacts the contact area; andcontrol means to control force of the at least one indenter element at the contact area.