초록 ▼

A lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thi

A lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent processes, reproduced in the substrate or in another material which is added onto the substrate.

대표청구항 ▼

[ What is claimed is:] [1.] A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps of:obtaining a substrate;depositing a film on the substrate;obtaining a mold of a stiff material which is hard relative to the film, the mold having a first protruding featu

[ What is claimed is:] [1.] A lithographic method for forming a pattern in a film carried on a substrate, comprising the steps of:obtaining a substrate;depositing a film on the substrate;obtaining a mold of a stiff material which is hard relative to the film, the mold having a first protruding feature and a recess formed thereby and a second protruding feature spaced apart prom the first protruding feature, the first and second features and the recess having a shape forming a mold pattern and providing at least one mold pattern lateral dimension which is less than 200 nm;urging the mold at a molding pressure into the film whereby the thickness of the film under the protruding feature is reduced and a thin region is formed in the film, wherein the molding pressure is sufficiently high to transfer the mold pattern to the film and the molding pressure causes a local deformation in the mold which is less than the mold pattern lateral dimension;removing the mold from the film;processing the relief whereby the thin region is removed exposing portions of the surface of the substrate which underlie the thin region; andwhereby the exposed portions of the surface of the substrate substantially replicate the mold pattern and have at least one lateral dimension which is less than 200 nm.