초록 ▼

A method of minimizing forming of white spots and delamination of a copper plane bonded to one surface of a dielectric material following additive pattern plating of copper onto the other surface of the material and in vias contacting the copper plane utilizing a plating solution containing a reduci

A method of minimizing forming of white spots and delamination of a copper plane bonded to one surface of a dielectric material following additive pattern plating of copper onto the other surface of the material and in vias contacting the copper plane utilizing a plating solution containing a reducing agent and the resulting product is provided. The surface of the copper which has been bonded to the one surface of the dielectric has been treated, preferably by a sodium chlorite treatment to form a chemical roughened surface of copper oxide (CuO and CuO(II)) on the copper. Prior to the bonding, the roughened surface of the copper oxide is treated with a solution such as benzotriazole, which complexes with the copper oxide to prevent formation of white spots and delamination as a result of such plating.

대표청구항 ▼

[ What is claimed is:] [19.] A circuitized structure comprising at least one sheet of copper having a first roughened surface bonded to one surface of a first dielectric substrate and a second roughened surface having an oxide of CuO and CuO(II) thereon bonded to a first surface of a second substrat

[ What is claimed is:] [19.] A circuitized structure comprising at least one sheet of copper having a first roughened surface bonded to one surface of a first dielectric substrate and a second roughened surface having an oxide of CuO and CuO(II) thereon bonded to a first surface of a second substrate and a second surface having electroless plated copper circuitry thereon,at least one via extending from said second surface of said second dielectric substrate into contact with said copper sheet, copper additively pattern plated into said one via, and a complexing agent disposed on said CuO and CuO(II).