초록 ▼

Thin circuit pathways of an electronic circuit are integral with thick terminal pins. The thin and thick portions are stamped, formed and chemically etched from a single sheet of copper or copper alloys, and mounted on a substrate to eliminate the need of a separate header. Components are soldered t

Thin circuit pathways of an electronic circuit are integral with thick terminal pins. The thin and thick portions are stamped, formed and chemically etched from a single sheet of copper or copper alloys, and mounted on a substrate to eliminate the need of a separate header. Components are soldered to the thin pathways in the conventional manner and a housing is molded to the circuit or a preformed housing is attached to the circuit. In another embodiment, a filtered header which contains thin circuit pathways integral with thick terminal pins is formed in the same manner and includes filtering components.

대표청구항 ▼

[ The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:] [1.] An electronic circuit comprising:a plurality of conductors mounted on a substrate;each conductor having a thin conductive pathway integral with a thick rigid terminal pin at one en

[ The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:] [1.] An electronic circuit comprising:a plurality of conductors mounted on a substrate;each conductor having a thin conductive pathway integral with a thick rigid terminal pin at one end composed solely of conductive material;the terminal pins being arranged in a connector array; andelectrical components connected to the conductive pathways.