초록 ▼

Circuit pack wherein the electronic components are arranged with high temperature operating components on one side of a PCB and low temperature components on the other side. The PCB acts as a thermal insulator to restrict heat flow from the hot to cooler components. The components on each side of th

Circuit pack wherein the electronic components are arranged with high temperature operating components on one side of a PCB and low temperature components on the other side. The PCB acts as a thermal insulator to restrict heat flow from the hot to cooler components. The components on each side of the board are disposed in a vertical connection chimney for heat removal.

대표청구항 ▼

[ What is claimed is:] [1.] A circuit pack comprising two printed circuit boards within a housing, each Printed circuit board having a first surface and a second surface, the printed circuit boards being spaced apart with the first surfaces confronting each other and with the second surfaces facing

[ What is claimed is:] [1.] A circuit pack comprising two printed circuit boards within a housing, each Printed circuit board having a first surface and a second surface, the printed circuit boards being spaced apart with the first surfaces confronting each other and with the second surfaces facing and spaced from walls of the housing to provide air flow passages between the confronting first surfaces and between each second surface and a spaced wall of the housing, the passages having openings at each end of the housing, high temperature operating electronic components providing a first group of components, and relatively low temperature operating components comprising a second group of components with one of the groups of components being located on a first board surface and the other group of components being disposed on at least one second board surface, and wherein the passage between the confronting first surfaces and the passage between the at least one second board surface and its spaced wall of the housing are of different widths so as to balance thermal drag over the two groups of components.