초록 ▼

A package for electrical components in which a circuit board holds the components, includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an intern

A package for electrical components in which a circuit board holds the components, includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space and are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal spaces. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to a circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.

대표청구항 ▼

[ What is claimed is:] [1.] A method for mounting a power-dissipating component having contact pads comprisingmounting the component on a thermally conductive baseplate,placing a circuit board having an aperture over the component with at least part of the power-dissipating component lying in the ap

[ What is claimed is:] [1.] A method for mounting a power-dissipating component having contact pads comprisingmounting the component on a thermally conductive baseplate,placing a circuit board having an aperture over the component with at least part of the power-dissipating component lying in the aperture, andsoldering the pads to the circuit board by heating the baseplate.