초록 ▼

A solder drop ejector is disclosed where a current through liquid solder in a channel flows in a direction opposite to the direction of current through a fixed conductor insulated from the channel. The magnetic fields generated repulse the solder toward an orifice to eject a droplet of solder. The d

A solder drop ejector is disclosed where a current through liquid solder in a channel flows in a direction opposite to the direction of current through a fixed conductor insulated from the channel. The magnetic fields generated repulse the solder toward an orifice to eject a droplet of solder. The dielectric layer separating the fixed conductor and the solder is formed of a film. The film may be made extremely thin, such as 0.1 microns, so that the necessary repulsion force generated by the oppositely flowing currents may be achieved with relatively low driving currents of 10-200 amperes. The thin dielectric film is not molded and is not required to provide mechanical support to a channel wall. Hence, the manufacturing of the resulting solder jet printhead is simplified and its reliability is improved.

대표청구항 ▼

[ What is claimed is:] [1.] A solder drop ejector comprising:an insulating substrate;a first conductor located on a surface of said insulating substrate;a dielectric layer located on said first conductor, said dielectric layer having at least one opening for exposing a first portion of said first co

[ What is claimed is:] [1.] A solder drop ejector comprising:an insulating substrate;a first conductor located on a surface of said insulating substrate;a dielectric layer located on said first conductor, said dielectric layer having at least one opening for exposing a first portion of said first conductor;a solder channel, for containing liquid solder, located on said dielectric layer such that liquid solder in said solder channel will be in electrical contact with said first conductor through said opening in said dielectric layer and insulated from said first conductor along a second portion of said first conductor by said dielectric layer, said solder channel communicating with an orifice; andelectrodes for conducting a current through said first conductor in a first direction and conducting a current through said liquid solder within said solder channel in a direction substantially opposite to said first direction,said first conductor, said solder channel, and said orifice being arranged such that a sufficient electric current through said first conductor and said liquid solder in said solder channel generates magnetic fields which force an amount of said solder through said orifice.