초록 ▼

A heat sink that utilizes a chimney effect to create its own airflow provides heat dissipation without requiring a fan or an air flow passageway between the heat sink and the electronic component. By removing material from each one of a plurality of pipes attached to a base of the heat sink, air flo

A heat sink that utilizes a chimney effect to create its own airflow provides heat dissipation without requiring a fan or an air flow passageway between the heat sink and the electronic component. By removing material from each one of a plurality of pipes attached to a base of the heat sink, air flow inlets are formed. Heat is dissipated from the heat sink by drawing air in through the air flow inlets, passing the air over a base heated by conduction and heating the air so that the air rises and exits out through an outlet in each of a plurality of pipes attached to the base. Heat is dissipated because of the pulling in and directing of air flow. Thus, the heat sink utilizes the cooling benefits of the chimney effect when the heat sink is placed directly on an electronic component and no air flow passageway exists below the heat sink.

대표청구항 ▼

[ What is claimed is:] [1.] A heat sink for cooling an electronic component which generates heat, the heat sink comprising:a base, the base having a predetermined thickness; andat least one pipe wherein the pipe comprises a side wall, a foundation coupled to the base and an outlet opposite the found

[ What is claimed is:] [1.] A heat sink for cooling an electronic component which generates heat, the heat sink comprising:a base, the base having a predetermined thickness; andat least one pipe wherein the pipe comprises a side wall, a foundation coupled to the base and an outlet opposite the foundation, the pipe having material removed from the side wall only near the base to form at least one air flow inlet so that when the heat sink is coupled to the electronic component, the heat is dissipated by a flow of air.