이 특허를 인용한 특허 (83)

1. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.

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2. DeSimone, Joseph M.; Birnbaum, Eva; Carbonell, Ruben G.; Crette, Stephanie; McClain, James B.; McCleskey, T. Mark; Powell, Kimberly R.; Romack, Timothy J.; Tumas, William, Carbon dioxide-soluble polymers and swellable polymers for carbon dioxide applications.

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3. DeSimone Joseph M. ; Romack Timothy ; Betts Douglas E. ; McClain James B., Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants.

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4. Racette, Timothy L.; Damaso, Gene R.; Schulte, James E., Cleaning process utilizing an organic solvent and a pressurized fluid solvent.

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5. Damaso, Gene R.; Schulte, James E.; Racette, Timothy L., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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6. Damaso,Gene R.; Schulte,James E.; Racette,Timothy L., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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7. Racette,Timothy L.; Damaso,Gene R.; Schulte,James E., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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8. Schulte, James E.; Racette, Timothy L.; Damaso, Gene R., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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9. Schulte, James E.; Racette, Timothy L.; Damaso, Gene R., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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10. Schulte, James E.; Racette, Timothy L.; Damaso, Gene R., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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11. Schulte, James E.; Racette, Timothy L.; Damaso, Gene R., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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12. Schulte,James E.; Racette,Timothy L.; Damaso,Gene R., Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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13. Timothy L. Racette ; Gene R. Damaso ; James E. Schulte, Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent.

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14. DeYoung, James P.; McClain, James B.; Gross, Stephen M.; Wagner, Mark I., Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof.

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15. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.

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16. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.

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17. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.

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18. Murphy Dennis Stephen, Dry cleaning system using densified carbon dioxide and a functionalized surfactant.

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19. Jureller Sharon Harriott ; Kerschner Judith Lynne ; Murphy Dennis Stephen, Dry cleaning system using densified carbon dioxide and a surfactant adjunct.

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20. Jureller Sharon Harriott ; Kerschner Judith Lynne ; Murphy Dennis Stephen, Dry cleaning system using densified carbon dioxide and a surfactant adjunct containing a CO.sub.2 -philic and a CO.sub.2 -phobic group.

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21. Sharon Harriott Jureller ; Judith Lynne Kerschner ; Dennis Stephen Murphy, Dry cleaning system with low HLB surfactant.

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22. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.

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23. Ochs, Thomas L.; Summers, Cathy A.; Gerdemann, Steve; Oryshchyn, Danylo B.; Turner, Paul; Patrick, Brian R., Integrated capture of fossil fuel gas pollutants including CO.

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24. Cotte, John Michael; Goldfarb, Dario L.; Jones, Pamela; McCullough, Kenneth John; Moreau, Wayne Martin; Pope, Keith R.; Simons, John P.; Taft, Charles J., Liquid or supercritical carbon dioxide composition.

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25. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.

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26. Humayun, Raashina; Joyce, Patrick C.; Tipton, Adrianne Kay; Shrinivasan, Krishnan; Hess, Dennis W.; Myneni, Satyanarayana; Banerjee, Souvik, Method and apparatus for using surfactants in supercritical fluid processing of wafers.

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27. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.

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28. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.

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29. Adams, Lea; Fisher, Edward C.; Malone, Josh; Miller, Seth; Smith, Jack C.; Dennis, William Kevin; Marsh, Jeffrey W., Method for lubricating MEMS components.

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30. McDermott,Wayne Thomas; Parris,Gene Everad; Roth,Dean Van John; Subawalla,Hoshang, Method for removal of flux and other residue in dense fluid systems.

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31. Malone, Joshua, Method for stripping sacrificial layer in MEMS assembly.

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32. Malone,Joshua, Method for stripping sacrificial layer in MEMS assembly.

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33. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.

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34. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.

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35. Barnes Paul,GBX, Method of cleaning or purifying elastomers and elastomeric articles which are intended for medical or pharmaceutical use.

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36. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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37. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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38. Jureller Sharon Harriott ; Kerschner Judith Lynne, Method of dry cleaning using densified carbon dioxide and a surfactant.

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39. DeSimone Joseph M. ; Romack Timothy ; Betts Douglas E. ; McClain James B., Method of entraining solid particulates in carbon dioxide fluids.

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40. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.

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41. Joseph M. DeSimone ; Saad A. Khan ; Joseph R. Royer ; Richard J. Spontak ; Teri Anne Walker, Method of making foamed materials using surfactants and carbon dioxide.

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42. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.

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43. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.

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44. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.

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45. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.

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46. Miller, Seth Andrian, Method of undercutting micro-mechanical device with super-critical carbon dioxide.

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47. DeYoung, James; McClain, James B.; Cole, Michael E.; Worm, Steven Lee; Brainard, David, Methods and apparatus for cleaning and/or treating a substrate using CO2.

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48. McClain James B. ; Romack Timothy J. ; DeYoung James P. ; Lienhart R. Bradley ; DeSimone Joseph M. ; Huggins Kenneth L., Methods for carbon dioxide dry cleaning with integrated distribution.

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49. McClain James B. ; Romack Timothy J. ; DeYoung James P. ; Lienhart R. Bradley ; DeSimone Joseph M. ; Huggins Kenneth L., Methods for carbon dioxide dry cleaning with integrated distribution.

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50. DeYoung, James P.; McClain, James B.; Gross, Stephen M.; DeSimone, Joseph M., Methods for cleaning microelectronic structures with aqueous carbon dioxide systems.

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51. DeYoung, James; McClain, James B.; Cole, Michael E.; Brainard, David, Methods for cleaning microelectronic structures with cyclical phase modulation.

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52. DeYoung, James P.; McClain, James B.; Gross, Stephen M., Methods for removing particles from microelectronic structures.

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53. DeYoung, James P.; McClain, James B.; Gross, Stephen M., Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures.

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54. DeYoung, James P.; McClain, James B.; Gross, Stephen M.; Wagner, Mark I., Methods for transferring supercritical fluids in microelectronic and other industrial processes.

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55. DeSimone, Joseph M.; Paisner, Sara Naomi, Methods of forming polymeric structures using carbon dioxide and polymeric structures formed therapy.

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56. DeSimone, Joseph M.; Khan, Saad A.; Royer, Joseph R.; Spontak, Richard J.; Walker, Teri Anne; Gay, Yvon J.; Siripurapu, Srinivas, Methods of making foamed materials of blended thermoplastic polymers using carbon dioxide.

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57. DeSimone, Joseph M.; Siripurapu, Srinivas; Khan, Saad A.; Spontak, Richard J.; Royer, Joseph, Nano-and micro-cellular foamed thin-walled material, and processes and apparatuses for making the same.

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58. Patrick, Brian R.; Ochs, Thomas L.; Summers, Cathy A.; Oryshchyn, Danylo B.; Turner, Paul C., Oxy-fuel combustion with integrated pollution control.

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59. Patrick, Brian R.; Ochs, Thomas Lilburn; Summers, Cathy Ann; Oryshchyn, Danylo B.; Turner, Paul Chandler, Oxy-fuel combustion with integrated pollution control.

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60. John Michael Cotte ; Kenneth John McCullough ; Wayne Martin Moreau ; Keith R. Pope ; John P. Simons ; Charles J. Taft, Process and apparatus for cleaning filters.

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61. Ryza, Nicholas A.; Awtrey, Allan W., Process and apparatus for removing a contaminant from a substrate.

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62. Masuda,Kaoru; Iijima,Katsuyuki; Yoshikawa,Tetsuya; Peters,Darry W., Process and composition for removing residues from the microstructure of an object.

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63. Cotte, John Michael; McCullough, Kenneth John; Moreau, Wayne Martin; Pope, Keith R.; Simons, John P.; Taft, Charles J.; Volant, Richard P., Process of providing a semiconductor device with electrical interconnection capability.

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64. Cotte,John Michael; Goldfarb,Dario L.; Jones,Pamela; McCullough,Kenneth John; Moreau,Wayne Martin; Pope,Keith R.; Simons,John P.; Taft,Charles J., Process of removing residue from a precision surface using liquid or supercritical carbon dioxide composition.

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65. DeYoung, James P.; McClain, James B.; Gross, Stephen M., Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide.

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66. McDermott,Wayne Thomas; Subawalla,Hoshang; Johnson,Andrew David; Schwarz,Alexander, Processing of semiconductor components with dense processing fluids and ultrasonic energy.

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67. Subawalla,Hoshang; Parris,Gene Everad; Rao,Madhukar Bhaskara; Kretz,Christine Peck, Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols.

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68. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.

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69. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.

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70. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.

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71. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.

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72. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.

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73. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.

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74. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.

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75. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.

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76. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.

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77. Malchesky, Paul S., Sub-critical fluid cleaning and antimicrobial decontamination system and process.

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78. Dickinson, C. John; Jansen, Frank; Murphy, Daimhin P., Substrate processing apparatus and related systems and methods.

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79. Chandra, Mohan; Mount, David J.; Costantini, Michael A.; Moritz, Heiko D.; Jafri, Ijaz; Boyd, Jim; Heathwaite, Rick M., Supercritical fluid cleaning process for precision surfaces.

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80. Joyce, Patrick C.; Tipton, Adrianne; Shrinivasan, Krishnan; Hess, Dennis W.; Myneni, Satyanarayana; Levitin, Galit, Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials.

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81. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.

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82. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.

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83. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.

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