[특허]Cooling system for enclosed electronic components

[미국특허] Cooling system for enclosed electronic components 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0661817 (1996-06-11)
발명자 / 주소	Winick Alan Lee Mitty Nagaraj Harpell Gary A.
출원인 / 주소	Sun Microsystems, Inc.
대리인 / 주소	Flehr Hohbach Test Albritton & Herbert LLPCaplan
인용정보	피인용 횟수 : 64 인용 특허 : 10

초록 ▼

An enclosure contains, among other components, hard drive cartridges, graphics or other option cards, power supply and a CPU and its support chips. The total power in the whole enclosure is about 325W and the CPU consumes about 30W of this total. For design purposes the components are closely positioned and hence heat dissipation is an important problem. Plural fans, as hereinafter disclosed, are used to circulate air. For the hard drive cartridges a fan snapped into a sidewall of the enclosure draws air from apertures in the bottom through the cartridge and into a plenum. For the CPU, an impingement fan discharges air directly downward on a heat sink positioned over the chip and into the plenum. Bulk flow fans discharge air from air intake vents in side walls of the enclosure as well as air discharged from the hard drive and CPU through an internal wall into a separate sub-enclosure for the power supply and thence to the exterior. Conventional fans are used but are positioned and inter-related so that the noise level is tolerable.

대표청구항 ▼

[ What is claimed is:] [1.] In combination, an enclosure comprising a bottom and four peripheral sides extending substantially vertically upward from said bottom, a first said side being formed with air inlet first apertures, a motherboard on said bottom, a heat emitting chip positioned on said motherboard, a heat sink above said chip, said heat sink comprising a base resting on said chip and a plurality of vertical fins extending upward from said base, a power supply area adjacent a second said side, a partition parallel to said second side and spaced inwardly of said power supply area, and said partition being in close proximity to said chip, said partition and said first, third and fourth sides defining a plenum, said second side being formed with air discharge second apertures, a top formed with a fan aperture above said heat sink, an impingement first fan located in said fan aperture discharging air from said plenum downward to cool said heat sink and said chip, said top engaging said partition,a second fan in said partition discharging air from said plenum and air emitted from said heat sink and said chip through said power supply area and out through said second apertures.

이 특허에 인용된 특허 (10) 인용/피인용 타임라인 분석

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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Cooling system for enclosed electronic components 원문보기

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[미국특허] Cooling system for enclosed electronic components 원문보기

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연구과제 타임라인

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