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Method and apparatus for interconnection of multiple modules 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-013/00
출원번호 US-0633988 (1996-04-17)
발명자 / 주소
  • Copeland Jeffrey P.
  • Crowell Jonathan C.
출원인 / 주소
  • Digital Equipment Corporation
대리인 / 주소
    Rodriquez
인용정보 피인용 횟수 : 53  인용 특허 : 14

초록

A computer system includes a housing, a motherboard, a first module and a second module. An electrical connector on the motherboard is joined to and in electrical communication with an electrical connector on one of two opposing surfaces of the first module, and an electrical connector on the second

대표청구항

[ What is claimed is:] [1.] An apparatus, comprising:a first circuit board having surfaces on opposite sides thereof, each of the surfaces having an electrically conductive surface region;a first electrical connector on one of the surfaces of the first circuit board, the first electrical connector h

이 특허에 인용된 특허 (14)

  1. Lipcon Jesse B. (Harvard MA) Maskas Barry A. (Marlboro MA), Arrangement for expanding memory capacity.
  2. Gonzales Roman Y. (Andover MA), Backplane connector.
  3. Brouillette Peter (Franklin MA) Pickles Charles S. (N. Attleboro MA), Circuit card interface system.
  4. Lewis Mark E. (Mansfield MA), Circuit card interface system.
  5. Martin Michael W. (Camberley GB3) Moor John C. (Wokingham GB3) Bird Terence J. (Simmondley GB3), Data processing system with search processor which initiates searching in response to predetermined disk read and write.
  6. Larner Joel B. (Fort Collins CO), Device to translate logical unit number communications on one SCSI bus to ID communications on a subordinate SCSI bus.
  7. Record Grant C. (Palo Alto CA), Expandable card cage.
  8. Oliver Christopher J. (Rochester NH), Flexible module interconnect system.
  9. Buron Douglas J. (Plantation FL) Steinman Sheldon (Miramar FL) Wray Donald L. (Lauderhill FL), Modular expandable housing arrangement for electronic apparatus.
  10. Weber Ronald M. (Lebanon PA), Modular plug-in connection means for flexible power supply of electronic apparatus.
  11. Maroushek Timothy R. (Lino Lakes MN), Modular stacked housing arrangement.
  12. Prager, Jay M.; Gonzales, Roman Y., Readily expandable input/output construction for programmable controller.
  13. House Kenneth A. (Arlington MA) Kirk John (Boxboro MA) Narhi Lawrence (Bolton MA), SCSI interface employing bus extender and auxiliary bus.
  14. DiViesti Anthony M. (Arlington Heights IL), Surface mounted electrical connector for printed circuit boards.

이 특허를 인용한 특허 (53)

  1. Itabashi, Noriyuki; Takahashi, Shingo, Board, board apparatus and method for interconnection of boards.
  2. Stone, Dennis; Vu, William; Tze, Ryan; Laing, Ralph, Circuit board interconnection and fan-mounting assembly for convective cooling.
  3. Sawada,Akira; Hayashi,Mitsuaki; Tanaka,Hironori; Kuramitsu,Kouichi; Hashimoto,Miyuki; Takano,Wataru; Fujimura,Mitsuo, Communication device.
  4. Vinson, Wade D.; Franz, John P.; Farnsworth, Arthur K.; Sherrod, David W., Component layout in an enclosure.
  5. Jenwei Hsieh ; Truc Nguyen, Dual-purpose backplane design for multiple types of hard disks.
  6. Peng, Wen-Tang; Zhou, Hai-Chen, Electronic device with expansion card.
  7. Ahmad, Mudasir; Aria, Percy, Electronic devices mounted on multiple substrates.
  8. Che-Yu Li ; David A. Lysack ; Thomas L. Sly, High capacity memory module with high electrical design margins.
  9. Woo, Steven; Ching, Michael; Bellows, Chad A.; Richardson, Wayne S.; Knorpp, Kurt T.; Kim, Jun, Integrated circuit memory device having dynamic memory bank count and page size.
  10. Woo,Steven; Ching,Michael; Bellows,Chad A.; Richardson,Wayne S.; Knorpp,Kurt T.; Kim,Jun, Integrated circuit memory system having dynamic memory bank count and page size.
  11. Garrett, Jr.,Billy, Mechanism for enabling full data bus utilization without increasing data granularity.
  12. Kevin S. Randall ; Andrew J. Wood, Medical diagnostic ultrasound system and method.
  13. Perego, Richard E.; Stark, Donald C.; Ware, Frederick A.; Tsern, Ely K.; Hampel, Craig E., Memory apparatus supporting multiple width configurations.
  14. Ware, Frederick A.; Hampel, Craig E.; Richardson, Wayne S.; Bellows, Chad A.; Lai, Lawrence, Memory controller for micro-threaded memory operations.
  15. Hampel, Craig E.; Ware, Frederick A., Memory controller for selective rank or subrank access.
  16. Hampel, Craig E.; Ware, Frederick A., Memory controller for selective rank or subrank access.
  17. Lai, Lawrence; Richardson, Wayne S.; Bellows, Chad A., Memory device having staggered memory operations.
  18. Perego, Richard E.; Stark, Donald C.; Ware, Frederick A., Memory device supporting a dynamically configurable core organization.
  19. Hampel, Craig E.; Ware, Frederick A., Memory module with reduced access granularity.
  20. Perego, Richard E.; Stark, Donald C.; Ware, Frederick A.; Tsern, Ely K.; Hampel, Craig E., Memory modules and devices supporting configurable data widths.
  21. Shaeffer, Ian, Memory signal buffers and modules supporting variable access granularity.
  22. Shaeffer, Ian, Memory signal buffers and modules supporting variable access granularity.
  23. Perego, Richard E.; Stark, Donald C.; Ware, Frederick A.; Tsern, Ely K.; Hampel, Craig E., Memory systems with multiple modules supporting simultaneous access responsive to common memory commands.
  24. Andresen, Mark E.; Ott, Virginia, Method of connecting components to a printed circuit board.
  25. Ware, Frederick A.; Hampel, Craig E.; Richardson, Wayne S.; Bellows, Chad A.; Lai, Lawrence, Micro-threaded memory.
  26. Ware, Frederick A.; Hampel, Craig E.; Richardson, Wayne S.; Bellows, Chad A.; Lai, Lawrence, Micro-threaded memory.
  27. Champion, Shaun L.; Ives, Philip H.; Andreas, Harry A.; Lee, Norman C.; Dooley, Karrie D., Microelectronic assemblies.
  28. Schuette, Franz Michael, Modular mass storage system and method therefor.
  29. Dayley, J Don, Modular processor based apparatus.
  30. Justiniano Joseph G. ; Estanislao Danilo F., Mounting system to support electrical components in a stacked relationship to one another.
  31. Ware, Frederick A.; Lai, Lawrence; Bellows, Chad A.; Richardson, Wayne S., Multi-column addressing mode memory system including an integrated circuit memory device.
  32. Ware, Frederick A.; Lai, Lawrence; Bellows, Chad A.; Richardson, Wayne S., Multi-column addressing mode memory system including an integrated circuit memory device.
  33. Ware, Frederick A.; Lai, Lawrence; Bellows, Chad A.; Richardson, Wayne S., Multi-column addressing mode memory system including an integrated circuit memory device.
  34. Ware, Frederick A.; Lai, Lawrence; Bellows, Chad A.; Richardson, Wayne S., Multi-column addressing mode memory system including an integrated circuit memory device.
  35. Ware,Frederick A.; Lai,Lawrence; Bellows,Chad A.; Richardson,Wayne S., Multi-column addressing mode memory system including an integrated circuit memory device.
  36. Ware,Frederick A.; Lai,Lawrence; Bellows,Chad A.; Richardson,Wayne S., Multi-column addressing mode memory system including an integrated circuit memory device.
  37. Jung Yong-Hyun,KRX, Multimedia computer system having multimedia bus.
  38. Andresen, Mark E.; Ott, Virginia, Printed circuit board having a non-plated hole with limited drill depth.
  39. Perego, Richard E.; Stark, Donald C.; Ware, Frederick A.; Tsern, Ely K.; Hampel, Craig E., Printed-circuit board supporting memory systems with multiple data-bus configurations.
  40. Yamada, Tsutomu; Endoh, Hiromichi; Matsumoto, Noritaka; Funaki, Satoru; Ito, Atsushi; Yanagihara, Norihisa, Processing module.
  41. Brinkhus, Hartmut B., Self-configuring modular electronic system.
  42. Hosomi, Eiichi, Semiconductor device including memory unit and semiconductor module including memory units.
  43. Gamini, Nader; Perino, Donald V., Semiconductor package with a controlled impedance bus.
  44. Gamini, Nader; Perino, Donald V., Semiconductor package with a controlled impedance bus and method of forming same.
  45. Sandy,Douglas L.; Harris,Jeffrey M.; Tufford,Robert C., Stacked 3U payload module unit.
  46. Weber Rick ; Howarth James ; Larsen Corey, Stacked printed circuit board memory module.
  47. Rick Weber ; Corey Larsen ; James Howarth, Stacked printed circuit board memory module and method of augmenting memory therein.
  48. Huang, Lan; Liu, Shih-Hao, Storage device backplane and identification circuit.
  49. Finnerty, Michael James; Levie, Stefan Gerhard; Norris, III, Joseph Peter, Sub-mezzanine structure for printed circuit card assemblies.
  50. Tom John Konetski ; Marc Jacques Lalouette, Surface mount connector.
  51. Perego, Richard E.; Ware, Frederick A.; Tsern, Ely K.; Hampel, Craig E., Upgradable memory system with reconfigurable interconnect.
  52. Perego, Richard E.; Ware, Frederick A.; Tsern, Ely K.; Hampel, Craig E., Upgradable memory system with reconfigurable interconnect.
  53. Hines, Douglas J.; Urda, Eugene J., VME circuit host card with triple mezzanine configuration.
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