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Apparatus for a brush assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-007/00
출원번호 US-0932292 (1997-09-17)
발명자 / 주소
  • de Larios John Martin
  • Ravkin Mikhail
  • Gardner Douglas Grant
출원인 / 주소
  • OnTrak Systems, Inc.
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 64  인용 특허 : 0

초록 ▼

A Method and Apparatus for Chemical Delivery Through the Brush used in semiconductor substrate cleaning processes. The chemical solutions are delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies th

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for a brush assembly comprising:a brush for scrubbing a semiconductor substrate, wherein said brush has a core, said core having a space therein;a rotation device, wherein said rotation device rotates said brush; anda solution delivery system, said solution d

이 특허를 인용한 특허 (64)

  1. Zhang, John H., Adjustable brush cleaning apparatus for semiconductor wafers and associated methods.
    상세보기
  2. Yoshimura, Takashi; Murakami, Shoichi; Sekiguchi, Takeshi; Nadamoto, Nobunari, Apparatus and method for cleaning peripheral part of substrate.
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  3. Shipley Kevin D. ; Burke Peter A., Apparatus and method for cleaning semiconductor wafer.
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  4. Roy, Sudipto Ranendra; Gupta, Subhash; Chooi, Simon; Yi, Xu; Aliyu, Yakub; Zhou, Mei Sheng; Sudijono, John Leonard; Ho, Paul Kwok Keung, Apparatus and methods to clean copper contamination on wafer edge.
    상세보기
  5. Svirchevski Julia ; Mikhaylich Katrina ; Zhang Jackie, Apparatus for HF-HF cleaning.
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  6. Ito Kenya,JPX ; Matsuda Naoki,JPX ; Shirakashi Mitsuhiko,JPX ; Oikawa Fumitoshi,JPX ; Ato Koji,JPX, Apparatus for cleaning substrate.
    상세보기
  7. Li, Hugh; Hymes, Diane J., Bond pad and wire bond.
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  8. Brunelli Shon ; Kennedy Timothy ; Ludwig Bryan, Brush alignment method.
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  9. Brunelli Shon ; Kennedy Timothy ; Ludwig Bryan, Brush alignment platform.
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  10. Brunelli Shon ; Kennedy Timothy ; Ludwig Bryan, Brush alignment platform.
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  11. Gockel Thomas R. ; Olson Lorin ; Ryle Lynn ; Whitelaw Brett A., Brush assembly apparatus.
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  12. Vail Jim ; Wallis Mike, Brush interflow distributor.
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  13. Oohiro, Nagayo; Kawaguchi, Tadashi; Miyaji, Hiroshi, Central core for a cleaning sponge roller.
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  14. Yeol Oh Eui,JPX ; Mitsumori Kenichi,JPX ; Miyazawa Satoshi,JPX, Cleaning method and apparatus for the same.
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  15. Li Xu ; Zhao Yuexing ; Hymes Diane J. ; de Larios John M., Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film.
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  16. Liming Zhang ; Yuexing Zhao ; Diane J. Hymes ; Wilbur C. Krusell, Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film.
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  17. Bejtlich, III, Chester L., Cleaning sponge roller.
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  18. Mihara, Koji; Gohda, Shuki; Ide, Masao; Igarashi, Koei; Tokunaga, Konomu; Miyaji, Hiroshi, Cleaning sponge roller.
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  19. Mihara, Koji; Gohda, Shuki; Ide, Masao; Igarashi, Koei; Tokunaga, Konomu; Miyaji, Hiroshi, Cleaning sponge roller.
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  20. Okuzono, Noriyoshi; Miyaji, Hiroshi; Tanaka, Yoichi, Core for washing sponge roller.
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  21. Miyashita Naoto,JPX ; Abe Masahiro,JPX, Double side cleaning apparatus for semiconductor substrate.
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  22. Moes, Freddy; De Wit, Bastiaan Johannes; Eshuis, Peter Christian, Fluid distributing brush assembly and method for operating the same.
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  23. Barnhart, Gunnar A.; Grieger, Eric K.; Green, Greg S., Method and apparatus for cleaning a surface of a microelectronic substrate.
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  24. Gunnar A. Barnhart ; Eric K. Grieger ; Greg S. Green, Method and apparatus for cleaning a surface of a microelectronic substrate.
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  25. Jiang Linda (Tong) ; Hymes Diane J., Method and apparatus for cleaning low K dielectric and metal wafer surfaces.
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  26. Jiang Linda ; Hymes Diane J., Method and apparatus for cleaning low K dielectric and metal wafer surfaces.
    상세보기
  27. Hymes Diane J. ; Ravkin Michael ; Zhang Xiuhua ; Krusell Wilbur C., Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF).
    상세보기
  28. Roy, Sudipto Ranendra; Gupta, Subhash; Chooi, Simon; Yi, Xu; Aliyu, Yakub; Zhou, Mei Sheng; Sudijono, John Leonard; Ho, Paul Kwok Keung, Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate.
    상세보기
  29. Julia S. Svirchevski ; Katrina A. Mikhaylich, Method and system for cleaning a chemical mechanical polishing pad.
    상세보기
  30. Tien, Chia-Ying; Hsueh, Chia-Lin, Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication.
    상세보기
  31. Jeffrey J. Farber ; Julia S. Svirchevski, Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing.
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  32. Ronay Maria, Method for cleaning a surface.
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  33. Mikhaylich, Katrina A.; Ravkin, Mike, Method for cleaning and treating a semiconductor wafer after chemical mechanical polishing.
    상세보기
  34. Hugh Li ; Diane J. Hymes, Method for enabling conventional wire bonding to copper-based bond pad features.
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  35. Larry Ping-Kwan Wong, Method for validating pre-process adjustments to a wafer cleaning system.
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  36. Svirchevski Julia ; Mikhaylich Katrina ; Zhang Jackie, Method of HF-HF Cleaning.
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  37. Kunihiro Miyazaki JP, Method of cleaning a semiconductor substrate.
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  38. Stephens Donald Edgar ; Jones Oliver David ; Miller ; III Hugo John, Method of cleaning semiconductor wafers and other substrates.
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  39. Aoki Hidemitsu,JPX, Method of washing a semiconductor device.
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  40. Zhang Liming ; Zhao Yuexing ; Hymes Diane J. ; Krusell Wilbur C., Methods and apparatus for cleaning semiconductor substrates after polishing of copper film.
    상세보기
  41. Zhang Liming ; Zhao Yuexing ; Hymes Diane J. ; Krusell Wilbur C., Methods and apparatus for cleaning semiconductor substrates after polishing of copper film.
    상세보기
  42. Benson, Briant Enoch, Methods and materials for making a monolithic porous pad cast onto a rotatable base.
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  43. Benson, Briant Enoch, Methods and materials for making a monolithic porous pad cast onto a rotatable base.
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  44. Benson, Briant Enoch, Methods and materials for making a monolithic porous pad cast onto a rotatable base.
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  45. Jim Vail ; Mike Wallis, Methods for applying fluid through a brush interflow distributor.
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  46. Boyd,John M.; Orbock,Michael L.; Redeker,Fred C., Methods of proximity head brushing.
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  47. Bahten Kristan G., Microcleaning process for sponge or porous polymeric products.
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  48. Nagashima, Toshio, Polishing and cleaning compound device.
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  51. Wargo, Christopher; Singh, Rakesh Kumar; Trio, David; McNamara, Eric, Substrate cleaning brush.
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  52. Miyazaki, Kunihiro, Substrate treating apparatus.
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  53. Andros, Nicholas, Surface charge controlling apparatus for wafer cleaning.
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  54. Mikhaylich, Katrina A.; Ravkin, Mike; Anderson, Don E., System for cleaning a semiconductor wafer.
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  55. Robinson Karl M. ; Walker Michael A., Treatment of a surface having exposed silica.
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  59. Garcia Alejandro ; Krick Brent ; Nichtawitz Anthony,PEX ; Nordeen Daniel ; Oen Josh ; Smith Kenneth ; Suro Vincent ; Wolf Daniel, Wafer cleaning method and system.
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  60. Garcia Alejandro ; Krick Brent ; Nichtawitz Anthony,PEX ; Nordeen Daniel ; Oen Josh ; Smith Kenneth ; Suro Vincent ; Wolf Daniel, Wafer cleaning system.
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  61. Dickey Tanlin ; Svirchevski Julia S. ; Anderson Donald E. ; Ravkin Mike ; Treichel Helmuth W. ; Pascal Roy Winston ; Gardner Douglas S., Wafer scrubbing brush core.
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  62. Dickey, Tanlin; Svirchevski, Julia S.; Anderson, Donald E.; Ravkin, Mike; Treichel, Helmuth W.; Pascal, Roy Winston; Gardner, Douglas S., Wafer scrubbing brush core.
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  63. Bliven, Brian M.; Gardner, Douglas G., Wafer scrubbing brush core having an internal motor and method of making the same.
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  64. Boyd, John M.; Mikhaylich, Katrina A., Web-style pad conditioning system and methods for implementing the same.
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