이 특허를 인용한 특허 (39)

1. Onishi Takashi,JPX ; Yoshikawa Kazuo,JPX ; Nishi Seiji,JPX ; Yamamoto Seigou,JPX, A1 alloy films and melting A1 alloy sputtering targets for depositing A1 alloy films.

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2. Takagi Katsutoshi,JPX ; Onishi Takashi,JPX, A1-N1-Y alloy films for electrodes of semiconductor devices and sputtering targets for depositing the A1-N1-Y alloy films.

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3. Pavate Vikram ; Narasimhan Murali, Coil for sputter deposition.

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4. Chaudhury, Prabir K.; Srinivasan, Raghavan; Viswanathan, Srinath, Continuous severe plastic deformation process for metallic materials.

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5. Pavate Vikram ; Ramaswami Seshadri ; Abburi Murali ; Narasimhan Murali, Copper target for sputter deposition.

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6. Hartwig, Jr., Karl T., Equal channel angular extrusion method.

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7. Lijun Yao JP; Tadao Ueda JP, High purity aluminum materials.

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8. Michaluk, Christopher A.; Huber, Jr., Louis E., High purity niobium and products containing the same, and methods of making the same.

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9. Michaluk, Christopher A.; Huber, Louis E.; Kawchak, Mark N.; Maguire, Jr., James D., High purity tantalum, products containing the same, and methods of making the same.

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10. Michaluk, Christopher A.; Huber, Louis E.; Kawchak, Mark N.; Maguire, Jr., James D., High purity tantalum, products containing the same, and methods of making the same.

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11. Michaluk,Christopher A.; Huber,Louis E.; Kawchak,Mark N.; Maguire, Jr.,James D., High purity tantalum, products containing the same, and methods of making the same.

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12. Lijun Yao JP; Tadao Ueda JP, Material comprising titanium.

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13. Vikram Pavate ; Murali Narasimhan, Method and apparatus of forming a sputtered doped seed layer.

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14. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies.

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15. Zhu Yuntian T. ; Lowe Terry C. ; Jiang Honggang ; Huang Jianyu, Method for producing ultrafine-grained materials using repetitive corrugation and straightening.

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16. Vikram Pavate ; Murali Abburi ; Murali Narasimhan ; Seshadri Ramaswami, Method of enhancing hardness of sputter deposited copper films.

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17. Holcomb, M. Kirk; Smathers, David B., Method of making a sputter target and sputter targets made thereby.

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18. Segal, Vladimir; Willett, William B.; Ferrasse, Stephane, Methods of fabricating articles and sputtering targets.

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19. Segal,Vladimir M.; Li,Jianxing; Alford,Frank; Ferrasse,Stephane, Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions.

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20. Miao, Weifang; Smathers, David B.; Bailey, Robert S., Monolithic aluminum alloy target and method of manufacturing.

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21. Miao, Weifang; Smathers, David B.; Bailey, Robert S., Monolithic aluminum alloy target and method of manufacturing.

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22. Segal Vladimir, Polycrystalline, metallic sputtering target.

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23. Segal, Vladimir, Process for producing a metal article.

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24. Lijun Yao JP; Tadao Ueda JP, Process for producing sputtering target materials.

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25. Yao, Lijun; Ueda, Tadao, Process for producing sputtering target materials.

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26. Segal, Vladimir; Willett, William B.; Ferrasse, Stephane, Sputtering targets formed from cast materials.

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27. Turner, Stephen P., Tantalum PVD component producing methods.

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28. Turner Stephen P., Tantalum sputtering target with fine grains and uniform texture and method of manufacture.

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29. Turner,Stephen P., Tantalum sputtering target with fine grains and uniform texture and method of manufacture.

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30. Ritesh P. Shah ; Vladimir Segal, Tantalum-comprising articles.

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31. Ferrasse, Stephane; Hort, Werner H.; Kim, Jaeyeon; Alford, Frank C., Target designs and related methods for coupled target assemblies, methods of production and uses thereof.

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32. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target.

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33. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target.

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34. Pavate Vikram ; Hansen Keith J. ; Mori Glen ; Narasimhan Murali ; Ramaswami Seshadri ; Nulman Jaim, Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target.

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35. Koenigsmann, Holger J.; Gilman, Paul S., Textured-grain-powder metallurgy tantalum sputter target.

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36. Koenigsmann,Holger J.; Gilman,Paul S., Textured-grain-powder metallurgy tantalum sputter target.

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37. Perry, Andrew C.; Gilman, Paul S.; Van den Sype, Jaak, Textured-metastable aluminum alloy sputter targets and method of manufacture.

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38. Perry, Andrew C.; Gilman, Paul S.; Van den Sype, Jaak, Textured-metastable aluminum alloy sputter targets and method of manufacture.

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39. Yuntian T. Zhu ; Terry C. Lowe ; Ruslan Z. Valiev RU; Vladimir V. Stolyarov RU; Vladimir V. Latysh RU; Georgy J. Raab RU, Ultrafine-grained titanium for medical implants.

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