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[미국특허] Apparatus for transferring a wafer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
  • B65G-049/07
출원번호 US-0564575 (1995-11-29)
우선권정보 KR-0032936 (1994-12-06)
발명자 / 주소
  • Lee Jong-Hyun,KRX
  • Yoo Hyung-Joun,KRX
  • Choi Boo-Yeon,KRX
  • Jang Won-Ick,KRX
  • Jang Ki-Ho,KRX
출원인 / 주소
  • Electronics and Telecommunications Research Institute, KRX
대리인 / 주소
    Jacobson, Price, Holman & Stern, PLLC
인용정보 피인용 횟수 : 83  인용 특허 : 14

초록 ▼

An apparatus for transferring a wafer in a semiconductor manufacturing process, and for carrying a wafer between a cassette and a wafer chuck without an additional tool such as a tripod. The apparatus includes: a holder capable of holding the side of the wafer; a wafer transfer assembly including an

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for transferring a wafer, having rounded edges, said apparatus comprising:a gripping and transferring means for gripping and transferring a wafer to and from a wafer chuck without additional tools further comprising:holding means for holding the rounded edges

이 특허에 인용된 특허 (14) 인용/피인용 타임라인 분석

  1. Richards Edmond A. (Marlton NJ), Apparatus for conveying a semiconductor wafer.
    상세보기
  2. Yoshikawa Toshiaki (Kawasaki JPX), Apparatus for forming functional deposited films by way of hybrid excitation.
    상세보기
  3. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Dial deposition and processing apparatus.
    상세보기
  4. Hosoda Yuji (Chiyoda JPX) Honma Kazuo (Ami JPX) Fujie Masakatsu (Ushiku JPX), Grip device for sheet-like objects.
    상세보기
  5. Asamoto Hiroshi (Komatsu JA), Gripping device.
    상세보기
  6. Benko John W. (Trenton NJ) Levkoff Jerome (Ewing NJ) Sutryn Daniel C. (Wyomissing Hills PA) Viriyayuthakorn Montri (Hamilton Square NJ), MOCVD method and apparatus.
    상세보기
  7. Oda Masao (Hyogo) Iwasa Tatsuya (Hyogo JPX), Method and apparatus for forming thin film.
    상세보기
  8. Malin Cosmas (Mauren LIX) Sawatzki Harry (Vaduz LIX), Method and apparatus for holding and conveying platelike substrates.
    상세보기
  9. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
    상세보기
  10. Ohmori Toshiaki (Itami JPX) Fukumoto Takaaki (Itami JPX), Semiconductor manufacturing apparatus.
    상세보기
  11. Lee Sang S. (Chungnam KRX) Kang Bong K. (Chungnam KRX) Park Seung K. (Chungnam KRX) Yoo Hyoung J. (Chungnam KRX), Transport device for wafers of variable diameter.
    상세보기
  12. Witherspoon Linda L. (22 Cottonwood La. Los Lunas NM 87031), Wafer handling and placement tool.
    상세보기
  13. Moe Rolf (Alameda CA) Corriea David J. (Hayward CA) Premeau John E. (Fremont CA), Wafer transfer apparatus.
    상세보기
  14. Trapani Silvio P. (1907 Cordilleras Rd. Redwood City CA 94062), Wafer-handling tool.
    상세보기

이 특허를 인용한 특허 (83) 인용/피인용 타임라인 분석

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  3. Caveney, Robert T., Apparatus for alignment and orientation of a wafer for processing.
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  4. Lin Zhihong J. ; Wang Chongyang, Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down ch.
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  5. Lin Zhihong J. ; Wang Chongyang, Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme.
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  6. Lin, Zhihong J.; Wang, Chongyang, Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme.
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  7. Zhihong J. Lin ; Chongyang Wang, Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme.
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  8. Zhihong J. Lin ; Chongyang Wang, Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme.
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