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[미국특허] Chemical mechanical polishing device for a semiconductor wafer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-029/00
  • C23F-001/04
출원번호 US-0760218 (1996-12-04)
우선권정보 JP-0317884 (1995-12-06)
발명자 / 주소
  • Shiraishi Yasushi,JPX
출원인 / 주소
  • NEC Corporation, JPX
대리인 / 주소
    Sughrue, Mion, Zinn, Macpeak & Seas, PLLC
인용정보 피인용 횟수 : 63  인용 특허 : 3

초록 ▼

In a chemical mechanical polishing (CMP) device, a semiconductor wafer is held by a carrier with its surface to be polished facing upward. A polishing belt is fed from one reel and taken up by the other reel by way of pulleys, running in contact with the surface of the wafer to be polished. A condit

대표청구항 ▼

[ What is claimed is:] [1.] A chemical mechanical polishing (CMP) device for polishing a work surface of a semiconductor wafer, comprising:a carrier for holding the semiconductor wafer such that the work surface faces upwards;a porous pad having a polishing side facing downwards for contacting the w

이 특허에 인용된 특허 (3) 인용/피인용 타임라인 분석

  1. Lund Douglas E. (13304 Purple Sage Dallas TX 75240), Automatic chemical and mechanical polishing system for semiconductor wafers.
    상세보기
  2. Homma Tetsuya (Tokyo JPX), Method of manufacturing semiconductor device using the abrasive.
    상세보기
  3. Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA) Talieh Homayoun (San Jose CA), Wafer polishing machine with fluid bearings and drive systems.
    상세보기

이 특허를 인용한 특허 (63) 인용/피인용 타임라인 분석

  1. Young, Douglas W.; Perlov, Vulf; Velazquez, Efrain, Advanced Bi-directional linear polishing system and method.
    상세보기
  2. Talieh, Homayoun; Volodarsky, Konstantin; Ashjaee, Jalal; Young, Douglas W., Apparatus and method for loading a wafer in polishing system.
    상세보기
  3. John M. White ; Phillip R. Sommer, Apparatus for chemical mechanical planarization having nested load cups.
    상세보기
  4. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
    상세보기
  5. Steckenrider,J. Scott; Snider,Gary W., Continuous contour polishing of a multi-material surface.
    상세보기
  6. Basol,Bulent M.; Talieh,Homayoun, Electrochemical mechanical processing apparatus.
    상세보기
  7. Dinesh Chopra ; Gundu Sabde, Fixed abrasive chemical-mechanical planarization of titanium nitride.
    상세보기
  8. Chopra, Dinesh; Sabde, Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
    상세보기
  9. Chopra,Dinesh; Sabde,Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
    상세보기
  10. Chopra,Dinesh; Sabde,Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
    상세보기
  11. Talieh, Homayoun; Young, Douglas W., Fluid bearing slide assembly for workpiece polishing.
    상세보기
  12. Osterheld, Thomas H., Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile.
    상세보기
  13. Krusell, Wilbur; Travis, Glenn; Engdahl, Erik; Bagley, James, Linear reciprocating disposable belt polishing method and apparatus.
    상세보기
  14. Wilbur Krusell ; Glenn Travis ; Erik Engdahl ; James Bagley, Linear reciprocating disposable belt polishing method and apparatus.
    상세보기
  15. Basol,Bulent M.; Uzoh,Cyprian E.; Bogart,Jeffrey A., Low-force electrochemical mechanical processing method and apparatus.
    상세보기
  16. Bonner,Benjamin A.; McReynolds,Peter; Menk,Gregory E.; Iyer,Anand N.; Prabhu,Gopalakrishna B.; Rondum,Erik S.; Jackson,Robert L.; Leung,Garlen, Materials for chemical mechanical polishing.
    상세보기
  17. Bonner,Benjamin A.; McReynolds,Peter; Menk,Gregory E.; Iyer,Anand N.; Prabhu,Gopalakrishna B.; Rondum,Erik S.; Jackson,Robert L.; Leung,Garlen, Materials for chemical mechanical polishing.
    상세보기
  18. Boyd, John M.; Lacy, Michael S., Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.
    상세보기
  19. Boyd, John M.; Lacy, Michael S., Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.
    상세보기
  20. John M. Boyd ; Michael S. Lacy, Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool.
    상세보기
  21. Boyd, John M., Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path.
    상세보기
  22. Moore Scott E., Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  23. Moore, Scott E., Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  24. Moore, Scott E., Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  25. Moore, Scott E., Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  26. Moore, Scott E., Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  27. Moore, Scott E., Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  28. Scott E. Moore, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  29. Scott E. Moore, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  30. Scott E. Moore, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  31. Scott E. Moore, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  32. Gundu M. Sabde ; Scott Meikle, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
    상세보기
  33. Gundu M. Sabde ; Scott Meikle, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
    상세보기
  34. Gundu M. Sabde ; Scott Meikle, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
    상세보기
  35. Sabde Gundu M. ; Meikle Scott, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
    상세보기
  36. Sabde, Gundu M.; Meikle, Scott, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
    상세보기
  37. Sabde, Gundu M.; Meikle, Scott, Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives.
    상세보기
  38. Moore, Scott E., Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface.
    상세보기
  39. Moore, Scott E., Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface.
    상세보기
  40. Moore, Scott E., Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface.
    상세보기
  41. Moore, Scott E., Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface.
    상세보기
  42. Moore,Scott E., Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface.
    상세보기
  43. Moore,Scott E., Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface.
    상세보기
  44. Moore,Scott E., Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface.
    상세보기
  45. Crevasse Annette Margaret ; Easter William Graham ; Maze John Albert ; Miceli ; III Frank, Method for making porous CMP article.
    상세보기
  46. Taylor, Theodore M., Method for securing a subpad to a subpad support.
    상세보기
  47. Richard Faubert ; John A. Adams, Method for selective removal of copper.
    상세보기
  48. Taylor,Theodore M., Method of replacing a subpad of a polishing apparatus.
    상세보기
  49. Xu, Cangshan; Zhao, Eugene Y.; Dai, Fen, Methods for making reinforced wafer polishing pads and apparatuses implementing the same.
    상세보기
  50. Homayoun Talieh ; Konstantin Volodarsky ; Jalal Ashjaee ; Douglas W. Young, Polishing apparatus and method with a refreshing polishing belt and loadable housing.
    상세보기
  51. Homayoun Talieh ; Konstantin Volodarsky ; Jalal Ashjaee ; Douglas W. Young, Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein.
    상세보기
  52. Talieh, Homayoun; Volodarsky, Konstantin; Ashjaee, Jalal; Young, Douglas W., Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein.
    상세보기
  53. Gotkis, Yehiel; Owczarz, Aleksander A.; Kistler, Rodney, Polishing pad ironing system and method for implementing the same.
    상세보기
  54. Cheng Tsungnan ; Wilson Ethan C. ; Chang Shou-sung ; Lee Gregory C. ; Tzeng Huey M. ; Weldon David E. ; Can Linh X. ; Lau Luis ; Yang Siyuan, Polishing pad shaping and patterning.
    상세보기
  55. Chopra Dinesh, Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies.
    상세보기
  56. Chopra, Dinesh, Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies.
    상세보기
  57. Dinesh Chopra, Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies.
    상세보기
  58. Talieh Homayoun, Reverse linear chemical mechanical polisher with loadable housing.
    상세보기
  59. Taylor,Theodore M., Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support.
    상세보기
  60. Taylor,Theodore M., Subpad support with releasable subpad securing element and polishing apparatus.
    상세보기
  61. Basol, Bulent M.; Talieh, Homayoun, System and method for electrochemical mechanical polishing.
    상세보기
  62. Shijian Li ; John M. White ; Lawrence M. Rosenberg ; Martin Scales ; Ramin Emami ; James V. Tietz ; Manoocher Birang, System for chemical mechanical planarization.
    상세보기
  63. Cangshan Xu ; Brian S. Lombardo, Unsupported chemical mechanical polishing belt.
    상세보기

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