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[미국특허] Computer having a high density connector system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-013/20
출원번호 US-0702195 (1996-08-23)
발명자 / 주소
  • Crane
  • Jr. Stanford W.
  • Portuondo Maria M.
  • Erickson Willard
  • Bizzarri Maurice
출원인 / 주소
  • The Panda Project
대리인 / 주소
    Morgan, Lewis & Bockius LLP
인용정보 피인용 횟수 : 21  인용 특허 : 52

초록 ▼

A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used

대표청구항 ▼

[ What is claimed is:] [1.] A computer system, comprising:a first plurality of slots for printed circuit boards using high-density connector systems, each of the high-density connector systems having one connector, having two rows of contact elements, on each side of a printed circuit board, the eac

이 특허에 인용된 특허 (52) 인용/피인용 타임라인 분석

  1. Balakrishnan Ramanatha V. (San Jose CA), Active bus backplane.
    상세보기
  2. Frei John K. (Mesa AZ) Brice-Heames Kenneth (Mesa AZ), Apparatus for adapting semiconductor die pads and method therefor.
    상세보기
  3. Brune Johannes (Erlangen DEX) Latussek Hans-Peter (Feucht DEX), Backplane for supporting removable modular.
    상세보기
  4. Higgins ; III Leo M. (Lakeville MA), Circuit board fabrication.
    상세보기
  5. Sucheski Matthew M. (Harrisburg PA) Barkus Lee A. (Millersburg PA), Coaxial contact element.
    상세보기
  6. Shah Kaushik S. (Santa Clara CA) Glider Joseph S. (Palo Alto CA) Asato Edward E. (Sunnyvale CA) Johnson ; III Hoke S. (Monte Sereno CA) Trang Duc H. (San Jose CA), Dual channel data block transfer bus.
    상세보기
  7. Billman Timothy B. (King NC) Thrush Roger L. (Clemmons NC), Dual readout extended socket.
    상세보기
  8. Goldfarb Samuel (21 Sycamore Dr. Roslyn ; County of Nassau NY 11576), Electronic component package with multiconductive base forms for multichannel mounting.
    상세보기
  9. Whitsitt Steven L. (Waukesha WI), Expanded register rack for a programmable logic controller.
    상세보기
  10. McNeill Andrew B. (Deerfield Beach FL) Newsom Thomas H. (Boca Raton FL) Osborn Neal A. (Delray Beach FL) Reid Eddie M. (Boca Raton FL), Feature board with automatic adjustment to one of two bus widths based on sensing power level at one connection contact.
    상세보기
  11. Sugimoto Masahiro (Yokosuka JPX) Wakasugi Yasumasa (Kawasaki JPX) Harada Shigeki (Kawasaki JPX), Heatsink package for flip-chip IC.
    상세보기
  12. Shaheen Joseph M. (La Habra CA) Yamaguchi James S. (Lake Forest CA), Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture.
    상세보기
  13. Mendenhall David W. (Greenville RI) Marian Steve P. (Plainville MA) Goff Jay T. (Cranston RI) Cotter Neil J. (Marston Mills MA) Corbesero Steve R. (Johnston RI), High density backplane connector.
    상세보기
  14. Biechler Donald t. (Harrisburg PA) Hillbish Warren C. (Hummelstown PA) Kaufman John W. (Hershey PA), High density electrical connector.
    상세보기
  15. Krajewski Nicholas J. (Chippewa Falls WI) Breske Carl D. (Scandia MN) Johnson David J. (Chippewa Falls WI) Kiefer David R. (Chippewa Falls WI) McDaniel Kent T. (Eau Claire WI) Moore ; Jr. William T. , High density interconnect apparatus.
    상세보기
  16. Frankeny, Jerome A.; Frankeny, Richard F.; Haj-Ali-Ahmadi, Javad; Hermann, Karl; Imken, Ronald L., High density interconnect strip.
    상세보기
  17. Malo Cheryne (Foxboro MA) Marian Steven P. (Plainville MA) Mendenhall David W. (Greenville RI), High density parallel interconnect.
    상세보기
  18. Desai Kishor V. (Vestal NY) Macek Thomas G. (Endicott NY) Patel Maganlal S. (Endicott NY) Thomas Edwin L. (Apalachin NY), High density, separable connector and contact for use therein.
    상세보기
  19. Pope Richard A. (Austin TX) Boling Clyde W. (Austin TX) Bates David A. (Cedar Park TX), High-density connector.
    상세보기
  20. Yoshizumi Toshiaki (Hyogo JPX) Yoshioka Akiyoshi (Hyogo JPX), High-voltage thyristor converter and laser with mirror control therefor.
    상세보기
  21. Tukamoto Takashi (Suwa JPX) Abe Sachiyuki (Suwa JPX) Yabushita Tetsuo (Suwa JPX) Hayashi Yoshimitsu (Suwa JPX), Integrated circuit package for flexible computer system alternative architectures.
    상세보기
  22. Shaffer Howard R. (Millersburg PA), Limited insertion force contact terminals and connectors.
    상세보기
  23. Coder James E. (Bradford PA), Lock open folding knife with side release.
    상세보기
  24. Murphy Preston J. (Austin TX), Method and apparatus for controlling circuit expansion for consumer electronic systems.
    상세보기
  25. Husak David J. (Windham NH) Madnick Jay L. (Derry NH) Hauser Stephen A. (Burlington MA), Method and apparatus for live insertion and removal of electronic sub-assemblies.
    상세보기
  26. Gregoire George D. (9927 Aviary Dr. San Diego CA 92131), Method and apparatus for making printed circuit boards.
    상세보기
  27. Gregoire George D. (9927 Aviary Dr. San Diego CA 92131), Method for making printed circuit boards.
    상세보기
  28. Gregoire George D. (San Diego CA), Method of mounting a surface-mountable IC to a converter board.
    상세보기
  29. Reylek Robert S. (St. Paul MN) Thompson Kenneth C. (St. Paul MN), Miniature multiple conductor electrical connector.
    상세보기
  30. Marian Steven P. (Plainville MA), Modified high density backplane connector.
    상세보기
  31. Deters John B. (17743 Soda Springs Rd. Los Gatos CA 95030), Modular computer system with passive backplane.
    상세보기
  32. Taniuchi Kenjiro (Kawasaki JPX) Miyazawa Hideo (Kawasaki JPX) Ishikawa Kouji (Kawasaki JPX) Watanabe Kouji (Kawasaki JPX), Mounting device for mounting an electronic device on a substrate by the surface mounting technology.
    상세보기
  33. Martens John D. (Plano TX) Ammon J. Preston (Dallas TX), Multi row high density connector.
    상세보기
  34. Feng Bai-Cwo (Tarrytown NY) Feng George C. (Fishkill NY) McMaster Richard H. (Wappingers Falls NY), Multi-layer package incorporating a recessed cavity for a semiconductor chip.
    상세보기
  35. Koepke Richard A. (New Bedford MA), Multi-path feed-thru lead and method for formation thereof.
    상세보기
  36. Hirano Naohiko (Yokohama JPX), Multilayer package.
    상세보기
  37. Tillotson John (Southfield MI), Multiple contact header assembly.
    상세보기
  38. Buck Jonathan E. (Harrisburg PA) Rose William H. (Harrisburg PA), Paired contact electrical connector system.
    상세보기
  39. Row Edward J. (Mountain View CA) Boucher Laurence B. (Saratoga CA) Pitts William M. (Los Altos CA) Blightman Stephen E. (San Jose CA), Parallel I/O network file server architecture.
    상세보기
  40. Methvin David H. (Boulder CO) Un Chong S. (Anaheim CA), Parallel string processor and method for a minicomputer.
    상세보기
  41. Shirling David J. (Waterbury CT), Pin grid array having seperate posts and socket contacts.
    상세보기
  42. Ammon J. Preston (Dallas TX) Weaver Harry R. (Dallas TX) Evans Evan J. (Plano TX), Printed circuit board finger connector.
    상세보기
  43. Cnyrim Henner (Laatzen DEX) Felsen Peter (Wennigsen DEX), Printed circuit board for carrying a mixed-component assembly.
    상세보기
  44. Brown Candice H. (San Jose CA), Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit la.
    상세보기
  45. Bittorf Bradley J. (Shaker Heights OH) Flood Mark A. (Mayfield Heights OH) Kalan Michael D. (Mayfield Heights OH) Sepsi Robert R. (Richmond Heights OH), Programmable controller with a dual intermodule message system.
    상세보기
  46. Laut Marvin (Dracut MA), Ring-connected circuit module assembly.
    상세보기
  47. Arima Hideo (Yokohama JPX) Takeda Kenji (Kamakura JPX) Yamamura Hideho (Yokohama JPX) Kobayashi Fumiyuki (Sagamihara JPX), Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same mo.
    상세보기
  48. Jurista Thomas M. (Vestal NY) Mantilla Osvaldo A. (Endicott NY), Sequential Connecting device.
    상세보기
  49. Cady James W. (Austin TX), Simulcast standard multichip memory addressing system.
    상세보기
  50. Lavan Thomas J. (El Toro CA), Single inline memory module support system.
    상세보기
  51. Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL), Thermally conductive integrated circuit package with radio frequency shielding.
    상세보기
  52. Crane ; Jr. Stanford W. (Cincinnati OH), Ultra-high density electrical interconnect system.
    상세보기

이 특허를 인용한 특허 (21) 인용/피인용 타임라인 분석

  1. Meier Matthias ; Babb Samuel M. ; Allan Scott P., Adaptive PCI slot.
    상세보기
  2. Aguinaga, Jr., Salvador; Dipert, Dwight; Schwan, Martin, Backplane apparatus and board for use therewith.
    상세보기
  3. Liu, Fangming; Zhang, Guodong; Liu, Sang, Backplane apparatus and communication device.
    상세보기
  4. Crane, Jr., Stanford W.; Portuondo, Maria M.; Erickson, Willard; Bizzarri, Maurice, Backplane system having high-density electrical connectors.
    상세보기
  5. Crane, Jr.,Stanford W., Backplane system having high-density electrical connectors.
    상세보기
  6. Thane M. Larson ; Kirk Bresniker, CompactPCI-based computer system with mid-plane connector for equivalent front and back loading.
    상세보기
  7. Garnett, Paul J; Heffernan, Peter, Computer connections.
    상세보기
  8. MacLaren John M. ; Hausauer Brian ; Rajagopaian Usha, Computer expansion slot and associated logic for automatically detecting compatibility with an expansion card.
    상세보기
  9. Crane ; Jr. Stanford W. ; Portuondo Maria M. ; Erickson Willard ; Bizzarri Maurice, Computer system having a modular architecture.
    상세보기
  10. Henneberg, Wolf Neumann, Connection contact for establishing electrical contact in a circuit board or a lead frame.
    상세보기
  11. Araki, Katsuhiko, Control system and control method.
    상세보기
  12. Debord, Pierre; Glaise, Rene; Gomez, Claude, Fragmented backplane system for I/O applications.
    상세보기
  13. Debord, Pierre; Glaise, Rene; Gomez, Claude, Fragmented backplane system for I/O applications.
    상세보기
  14. Crane ; Jr. Stanford W. ; Krishnapura Lakshminarasimha ; Fuoco Daniel ; Lee Roy K. ; Link Kevin J. ; Behar Moises ; Dutta Arindum ; Cross William, Interface optimized computer system architecture.
    상세보기
  15. Crane, Jr., Stanford W., Modular architecture for high bandwidth computers.
    상세보기
  16. Hogerl, Jurgen, Module unit for memory modules and method for its production.
    상세보기
  17. Perino Donald V. ; Gamini Nader, Multi-slot connector with integrated bus providing contact between adjacent modules.
    상세보기
  18. Haba, Belgacem; Perego, Richard E.; Nguyen, David; Garrett, Jr., Billy W.; Tsern, Ely; Hampel, Craig E.; Yip, Wai-Yeung, Multiple channel modules and bus systems using same.
    상세보기
  19. Haba,Belgacem; Perego,Richard E.; Nguyen,David; Garrett, Jr.,Billy W.; Tsern,Ely; Hampel,Crag E.; Yip,Wai Yeng, Multiple channel modules and bus systems using same.
    상세보기
  20. Summers Mark David ; Cohlman Donald Charles ; Sharrit John Paul ; Cornils Curtis Lee, Secure bus arbiter interconnect arrangement.
    상세보기
  21. Goldys John J. ; Bloomer Charles T., Small computer system interface (SCSI) bus backplane interface.
    상세보기

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