이 특허를 인용한 특허 (49)

1. Thomsen Peter, Apparatus and method for enabling hot plugging of an integrated circuit.

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2. Janicek George M. ; Liu Rui ; Scocca Anthony J., Apparatus and method of adapting a rectifier module to enhance cooling.

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3. Foster, Sr.,Jimmy Grant; June,Michael S.; Makley,Albert Vincent; Matteson,Jason Aaron, Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board.

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4. Ribarich, Thomas J.; Wilhelm, Dana; Brown, Derek, Ballast control card.

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5. Lee, Sang Cheol, Chipset cooling device of video graphic adapter card.

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6. Tian, Shurong; Cipolla, Thomas M.; Coteus, Paul W., Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs).

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7. Hood ; III Charles D. ; Broder Damon W. ; Holloway Eric B., Combination electromagnetic shield and heat spreader.

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8. Chandrakant D. Patel ; Vernon Alan Barber ; Hannsjorg Obermaier ; Christian Belady ; David Mike Chastain, Cooling arrangement for high density packaging of electronic components.

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9. Chen, Kuang-Liang; Wang, Ting-Hao; Chang, Ching-Tsai; Liu, Yun-Ping; Tsay, Wen-Bin, Data processing device and motherboard module thereof.

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10. Weeber, Volker; Barth, Heinrich; Schertlen, Ralph, Electronic control device.

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11. Tan, Zeu-Chia, Electronic device and heat dissipation apparatus of the same.

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12. Suzuki Masumi,JPX ; Ueda Akira,JPX, Electronic device having IC card slot.

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13. Hastings Robert J. ; Thompson Daniel T., Electronic device securement system.

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14. Rau, Timothy; Simon, Glenn C., Frame having frame blades that participate in cooling memory modules.

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15. Lin,Wei Pin, Graphics card heat-dissipating device.

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16. Lai Ching-Ho,TWX ; Pei Wen-Chun,TWX, Heat dissipating electrical apparatus.

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17. Guan, Zhi-Bin; Chang, Yao-Ting; Tan, Zeu-Chia, Heat sink and electronic device using the same.

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18. Masashi Kawamura JP, Heat sink and memory module with heat sink.

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19. Lonergan, Kevin J.; Tusler, Ralph M.; Gaudet, Richard A., Heat sink for edge connectors.

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20. Choi, Soo Yong; Joo, Jae Man; Lee, Seok Yeong; Kang, Jung Hun; Oh, Sang Kyoung, Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink.

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21. Mease,Keith D.; McClain,Sean M., Heat sink with integral card guide.

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22. Summers, Mark D.; Mauritz, Karl H.; Bedi, Amber S.; Handley, William; Miller, Carol; Leija, Javier; Dragoon, Daniel, Heat transfer apparatus.

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23. Lubbers, Clark E.; Schow, R. Brian; Umland, Wayne; Roberson, Randy L.; Bean, Robert G., High performance multi-controller processing.

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24. Corisis David J., IC package with dual heat spreaders.

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25. Corisis, David J., IC package with dual heat spreaders.

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26. Corisis, David J., IC package with dual heat spreaders.

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27. Corisis, David J.; Moden, Walter L.; Lee, Terry R., Integrated circuit package support system.

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28. Tehan Matthew A. ; Losinski Armand ; Parkinson Jay Berkley, Integrated convection and conduction heat sink for multiple mounting positions.

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29. Wyler Gregory T., Integrated processor mounting mechanism and heat sink.

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30. Lai,Cheng Tien; Zhou,Zhi Yong; Ding,Qiao Li, Memory module assembly.

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31. Lai,Cheng Tien; Zhou,Zhi Yong; Ding,Qiao Li, Memory module assembly including a clip for mounting a heat sink thereon.

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32. Bridges, Jeremy S.; Megarity, William M.; Remis, Luke D.; Sellman, Gregory D., Memory module connector with air deflection system.

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33. Sicola, Stephen J.; Sardeson, Bruce; Spicher, Dennis; Roberts, Bruce; Pagano, Bill, Method and apparatus for controlling communications in data storage complexes.

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34. Smith Grant M., Method and apparatus for heat dissipation in a multi-processor module.

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35. Sicola, Stephen J.; Sardeson, Bruce A.; Spicher, Dennis; Roberts, Richard Bruce; Pagano, Bill; Miller, William K.; Wade, Clay T.; Shepp, Mark, Method and apparatus for sensing positions of device enclosures within multi-shelf cabinets.

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36. Corisis, David J., Method for a semiconductor assembly having a semiconductor die with dual heat spreaders.

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37. McCullough, Kevin A.; Sagal, E. Mikhail, Method of manufacturing a U-shaped heat sink assembly.

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38. Gilliland,Don A.; Wurth,Dennis J., Modular heat sink fin modules for CPU.

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39. Lubbers,Clark E.; Reiser,James M.; Korgaonkar,Anuja; Roberson,Randy L.; Bean,Robert G., Point in time storage copy.

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40. Lu, Shao-Feng, Power supply and heat dissipation module thereof.

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41. Lubbers, Clark E.; Woestehoff, Keith D.; Yandell, Jesse L.; Reiser, James M.; Korgaonkar, Anuja; Roberson, Randy L.; Bean, Robert G., System and method for atomizing storage.

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42. Lubbers, Clark E.; Reiser, James M.; Korgaonkar, Anuja; Roberson, Randy L.; Bean, Robert G., System and method for generating point in time storage copy.

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43. Lubbers, Clark E.; Woestehoff, Keith D.; Hua, Masami Y.; Helliwell, Richard P.; Roberson, Randy L.; Bean, Robert G., System and method for interfacing with virtual storage.

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44. Sicola, Stephen J.; Sardeson, Bruce; Spicher, Dennis; Roberts, Bruce; Pagano, Bill; Kelton, Allen B., System and method for locating a failed storage device in a data storage system.

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45. Nakanishi, Tohru; Nishiio, Toshihiko, Thermal controller for computer, thermal control method for computer and computer equipped with thermal controller.

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46. Allman Richard K., Thermally-coupled heat dissipation apparatus for electronic devices.

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47. Kevin A. McCullough ; E. Mikhail Sagal, U-shaped heat sink assembly.

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48. Sicola,Stephen J.; Sardeson,Bruce; Spicher,Dennis; Roberts,Bruce; Pagano,Bill; Lary,Richard; Miller,William K.; Conrad,Mark J., Unified management system and method for multi-cabinet data storage complexes.

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49. Wong Thomas J. ; Crocker Michael T., Wrap around clip for an electronic cartridge.

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