초록 ▼

A semiconductor device which includes a ceramic package main body, a semiconductor element and a closure for sealing the semiconductor element in the package. A capacitor is formed on an upper or lower surface of the closure. The capacitor has a dielectric film interposed between a pair of electrode

A semiconductor device which includes a ceramic package main body, a semiconductor element and a closure for sealing the semiconductor element in the package. A capacitor is formed on an upper or lower surface of the closure. The capacitor has a dielectric film interposed between a pair of electrode films. The dielectric film includes a ceramic filler and an amorphous glass. The closure and the package main body are sealed. A terminal formed in the package main body and the electrode film of the capacitor are connected electrically. High-density packaging on a substrate can be achieved. High strength of the closure itself can be maintained. Thermal stress developed in the closure itself, or the conjugated portion between the closure and the package main body, can be suppressed. Reliability of a sealed structure in the semiconductor device for a long period of time can be increased.

대표청구항 ▼

[ What is claimed:] [1.] A semiconductor device, comprising:a ceramic package main body,a semiconductor element,a closure for sealing the semiconductor element in the package main body, the closure having an upper surface and a lower surface, the closure and the package main body being sealed,a capa

[ What is claimed:] [1.] A semiconductor device, comprising:a ceramic package main body,a semiconductor element,a closure for sealing the semiconductor element in the package main body, the closure having an upper surface and a lower surface, the closure and the package main body being sealed,a capacitor formed on at least one of the upper surface and the lower surface of the closure, the capacitor comprising a dielectric film interposed between a first electrode film and a second electrode film, the dielectric film comprising a ceramic filler and an amorphous glass, anda terminal formed in the package main body, the terminal and at least the first electrode film being electrically connected to each other, whereinthe package main body comprises a ceramic material selected from the group consisting of alumina, Si.sub.3 N.sub.4, mullite, AlN and glass-ceramics, and whereinthe dielectric film comprises between about 80 to 99% by weight of the ceramic filler and between about 1 to 20% by weight of the amorphous glass.