초록 ▼

A method for surface mounting electrical components to a substrate, such as a printed circuitboard, involves use of an anisotropically conductive adhesive or Z-Axis adhesive between facing conductive surface areas on the component and substrate. Pressure is applied to the conductive adhesive by a no

A method for surface mounting electrical components to a substrate, such as a printed circuitboard, involves use of an anisotropically conductive adhesive or Z-Axis adhesive between facing conductive surface areas on the component and substrate. Pressure is applied to the conductive adhesive by a nonconducting adhesive that is first cured between oppositely facing nonconductive surface areas of the component and substrate. This fixes the thickness of each layer of the conductive adhesive at a dimension no greater than its design conductive thickness. In a first submethod, the nonconducting adhesive is a fast setting adhesive subjected to mechanical pressure only as it is assembled on the substrate prior to the subsequent curing of the conductive adhesive. In a second submethod, it is a high shrinkage adhesive that applies compressive force between the component and substrate as it cures and shrinks dimensionally while at a temperature below the subsequent curing temperature of the conductive adhesive.

대표청구항 ▼

[ I claim:] [1.] A method for mounting an electrical component to a supporting substrate comprising the following steps:providing an electrical component, the electrical component having a nonconductive surface and a pair of conductive surfaces adjacent the nonconductive surface, the pair of conduct

[ I claim:] [1.] A method for mounting an electrical component to a supporting substrate comprising the following steps:providing an electrical component, the electrical component having a nonconductive surface and a pair of conductive surfaces adjacent the nonconductive surface, the pair of conductive surfaces of the electrical component being a first conductive surface and a second conductive surface;providing a substrate, the substrate having a nonconductive surface and a pair of conductive surfaces adjacent the nonconductive surface, the pair of conductive surfaces of the substrate being a third conductive surface and a fourth conductive surface;applying a nonconductive adhesive in contact with the nonconductive surface of the substrate and in contact with the nonconductive surface of the electrical component, the nonconductive adhesive not being in contact with the first, second, third or fourth conductive surfaces, the nonconductive adhesive curing at a first temperature, the nonconductive adhesive shrinking as it cures;applying an anisotropically conductive adhesive in contact with the first conductive surface and in contact with the third conductive surface, the anisotropically conductive adhesive curing at a second temperature, the second temperature being higher than the first temperature;applying the anisotropically conductive adhesive in contact with the second conductive surface and in contact with the fourth conductive surface;curing the nonconductive adhesive at the first temperature to bond the nonconductive surface of the substrate to the nonconductive surface of the electrical component, the nonconductive adhesive shrinking as it cures, the anisotropically conductive adhesive being compressed between the first and third conductive surfaces and between the second and fourth conductive surfaces as the nonconductive adhesive shrinks; andafter curing the nonconductive adhesive, curing the compressed anisotropically conductive adhesive at the second temperature to 1) form an electrically conductive path between the first and third conductive surfaces and bond the first conductive surface to the third conductive surface and 2) form an electrically conductive path between the second and fourth conductive surfaces and bond the second conductive surface to the fourth conductive surface.