초록 ▼

A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmissio

A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor die carrier comprising:a module for housing a semiconductor die, said module comprising a top, a bottom, and a plurality of planar outer side surfaces;a row of electrically conductive leads extending from at least one of said outer side surfaces of the mod

[ What is claimed is:] [1.] A semiconductor die carrier comprising:a module for housing a semiconductor die, said module comprising a top, a bottom, and a plurality of planar outer side surfaces;a row of electrically conductive leads extending from at least one of said outer side surfaces of the module, the row of leads comprising a plurality of adjacent leads;a semiconductor die housed within the module; andat least one high frequency capacitor secured to the module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads, wherein the at least one capacitor comprises a capacitive component secured to at least a first pair of the adjacent leads at the at least one outer side surface of the insulative module and wherein at least a second pair of the adjacent electrically conductive leads are separated by only air.