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[미국특허] Card type semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • G06K-019/06
  • H05K-001/00
출원번호 US-0435465 (1995-05-05)
우선권정보 JP-0055192 (1995-02-21)
발명자 / 주소
  • Hashimoto Nobuaki,JPX
  • Nakamura Norio,JPX
  • Suemori Hiroyuki,JPX
  • Sugai Hiroshi,JPX
  • Imaoka Norio,JPX
  • Noake Kazuyoshi,JPX
출원인 / 주소
  • Seiko Epson Corporation, JPX
대리인 / 주소
    Oliff & Berridge, PLC
인용정보 피인용 횟수 : 93  인용 특허 : 18

초록 ▼

A card type semiconductor device includes a main circuit board and a first sub-circuit-board equipped with a main memory. The main circuit board is connected to the first sub-circuit-board through an FPC. A first TCP equipped with the CPU and a second TCP equipped with the I/O sub-system chip are mo

대표청구항 ▼

[ What is claimed is:] [1.] A card type semiconductor device, comprising:a main circuit board having a first side and a second side, electronic components being mounted on the main circuit board on both the first and second sides, the electronic components on the first side of the main circuit board

이 특허에 인용된 특허 (18) 인용/피인용 타임라인 분석

  1. Piorunneck Heinz (Trumbull CT) Eisenberg Donald S. (Weston CT), Bi-level card edge connector and method of making the same.
    상세보기
  2. Hall Roger L. (Nashua NH) Romano Domenic R. (Chelmsford MA), Cathode ray tube display terminal having an enclosure for protection of a logic board.
    상세보기
  3. Kametani Masatsugu (Ibaraki JPX) Umekita Kazuhiro (Ibaraki JPX), Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus.
    상세보기
  4. Buist Kevin S. (Belle Mead NJ) Campesi Robert J. (Flemington NJ) Raine Randolph W. (Belle Mead NJ) Walck Jeffrey A. (Lebanon NJ) Weinschenk John (Edison NJ) Zappacosta Elisa E. (Media PA), Computer system housing monitor with detachable module for providing diverse functionality.
    상세보기
  5. Matsushita Tsuyoshi (Shizuoka JPX), Connecting structure for connecting a memory unit to a memory unit controller.
    상세보기
  6. Ugon Michel (Saint-Ouen FRX), Device for the protection of access to a permanent memory of a portable data carrier.
    상세보기
  7. Tsukada Katsumi (Suwa JPX) Nakamura Norio (Suwa JPX) Nimura Minoru (Suwa JPX) Suemori Hiroyuki (Suwa JPX) Kamihata Tomio (Suwa JPX) Yamazaki Mutsuaki (Suwa JPX), Electronic device having a flat, card-like casing enclosing components for a complete computer system.
    상세보기
  8. Tsukada Katsumi (Suwa JPX) Nakamura Norio (Suwa JPX) Nimura Minoru (Suwa JPX) Suemori Hiroyuki (Suwa JPX) Kamihata Tomio (Suwa JPX) Yamazaki Mutsuaki (Suwa JPX), Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs.
    상세보기
  9. Perkins Carl C. (Irvine CA), Electrostatically protected IC card.
    상세보기
  10. Rasmussen Kris A. (Tinton Falls NJ), Folding electronic card assembly.
    상세보기
  11. Wu Andrew L. (Shrewsbury) Smelser Donald W. (Bolton) Bruce ; II E. William (Lunenburg MA) O\Dea John (Galway IRX), High density memory array packaging.
    상세보기
  12. Kusui Masaaki (Itami JPX), IC card and method of manufacturing the same.
    상세보기
  13. Houldsworth John (1555 Autmn Ridge Cir. Reston VA 22094) Duck Anthony P. (1115 N. Vernon St. Arlington VA 22201), Method of assembly for small electrical devices.
    상세보기
  14. Kikinis Dan (Saratoga CA), Modular notebook computer having a planar array of module bays and a pivotally attached flat-panel display.
    상세보기
  15. Oppenberg George A. (Brooklyn NY), Multilayer printed circuit board with pseudo-coaxial transmission lines.
    상세보기
  16. Anzelone Thomas A. (Ft. Lauderdale FL) Cheung Samuel T. (Boca Raton FL) Cohen Mark E. (Boca Raton FL) Cooke Kevin K. (Delray Beach FL) Dewitt John R. (Boca Raton FL) Miller Michael S. (Delray Beach F, Personal computer processor card interconnect system.
    상세보기
  17. Ugon Michel (Saint-Ouen FRX), Portable data carrier including a microprocessor.
    상세보기
  18. Normington Peter J. C. (516 E. Country Plaza South Gilbert AZ 85234), Semiconductor device including stacked die.
    상세보기

이 특허를 인용한 특허 (93) 인용/피인용 타임라인 분석

  1. Bolken,Todd O., Alternative method used to package multimedia card by transfer molding.
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  2. Tongbi Jiang ; Walter L. Moden, Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices.
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  3. Tongbi Jiang ; Walter L. Moden, Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices.
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  4. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, Co-support circuit panel and microelectronic packages.
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  5. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, Co-support component and microelectronic assembly.
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  6. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, Co-support for XFD packaging.
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  7. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, Co-support for XFD packaging.
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  8. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, Co-support module and microelectronic assembly.
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  9. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, Co-support system and microelectronic assembly.
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  10. Sun, Zhuowen; Chen, Yong, Compact microelectronic assembly having reduced spacing between controller and memory packages.
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  11. Wallace,Robert F.; Norman,Robert D.; Harari,Eliyahou, Computer memory cards using flash EEprom integrated circuit chips and memory-controller systems.
    상세보기
  12. Shilling, Thomas H.; Snider, Todd; Grupen-Shemansky, Melissa, Connections for electronic devices on double-sided circuit board.
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  13. Maroney, John E., Controller board having expandable memory.
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  14. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, De-skewed multi-die packages.
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  15. Crisp, Richard Dewitt; Haba, Belgacem; Zohni, Wael, Deskewed multi-die packages.
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  16. Sun, Zhuowen; Chen, Yong; Bang, Kyong-Mo, Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design.
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  17. Nguyen, David; Nan, Nan; Ni, Jim Chin-Nan; Yu, Frank I-Kang; Ma, Abraham C.; Shen, Ming-Shiang, Dual-personality extended USB plugs and receptacles using with PCBA and cable assembly.
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  18. Paczkowski, Theodore T., Hearing-aid assembly using folded flex circuits.
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  19. Chang,Shih Cherng, Heat dissipation for chip-on-chip IC packages.
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  20. Mahon Shawn M. ; Paczkowski Theodore T. ; Schmieg Steven R., High density stacked circuit module.
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  21. Kie Y. Ahn ; Leonard Forbes ; Paul Farrar, High performance packaging for microprocessors and DRAM chips which minimizes timing skews.
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  22. Sun, Zhuowen; Chen, Yong; Bang, Kyong-Mo, High-bandwidth memory application with controlled impedance loading.
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  23. Sun, Zhuowen; Chen, Yong; Bang, Kyong-Mo, High-bandwidth memory application with controlled impedance loading.
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  24. Yamazaki, Shunpei, IC card.
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  25. Yamazaki, Shunpei, IC card.
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  26. Yamazaki, Shunpei, IC card.
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  27. Luu, Lu Vinh, Integrated circuit card with multiple integral electronic modules.
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  28. Pendse, Rajendra D., Integrated circuit package system with pedestal structure.
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  29. Shen Ming-Tung,TWX, Integrated circuit packaging structure.
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  30. Wehrly, Jr., James Douglas, Memory card and method for devising.
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  31. Wehrly, Jr., James Douglas, Memory card and method for devising.
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  32. Haba, Belgacem; Zohni, Wael; Crisp, Richard Dewitt; Mohammed, Ilyas, Memory module in a package.
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  33. Haba, Belgacem; Zohni, Wael; Crisp, Richard Dewitt; Mohammed, Ilyas, Memory module in a package.
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  34. Haba, Belgacem; Zohni, Wael; Crisp, Richard Dewitt; Mohammed, Ilyas, Memory module in a package.
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  35. Haba, Belgacem; Zohni, Wael; Crisp, Richard Dewitt; Mohammed, Ilyas, Memory module in a package.
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  36. Ito, Sotaro; Takahashi, Michimasa; Mikado, Yukinobu, Method for manufacturing a multilayered circuit board.
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  37. Nakashiba, Yasutaka; Ogawa, Kenta, Method of manufacturing a semiconductor device.
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  38. Hiew, Siew S.; Ma, Abraham C.; Nan, Nan, Micro-SD to secure digital adaptor card and manufacturing method.
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  39. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows.
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  40. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis.
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  41. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other.
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  42. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows.
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  43. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows.
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  44. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis.
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  45. Jaggers, Christopher M.; Zill, Jay M., Modular bay enclosure removable card method and system.
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  46. Hiew, Siew S.; Ma, Abraham C.; Nan, Nan, Molded memory card with write protection switch assembly.
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  47. Ni, Jim Chin-Nan; Nan, Nan; Ma, Abraham C., Molding method for COB-EUSB devices and metal housing package.
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  48. Ni, Jim Chin-Nan; Nan, Nan; Ma, Abraham C., Molding method for COB-EUSB devices and metal housing package.
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  49. Hiew, Siew S.; Ni, Jim C.; Lee, Charles C.; Yu, I-Kang; Shen, Ming-Shiang, Molding methods to manufacture single-chip chip-on-board USB device.
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  50. Nakamura,Naoki, Multilayer wiring board, manufacturing method therefor and test apparatus thereof.
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  51. Ito, Sotaro; Takahashi, Michimasa; Mikado, Yukinobu, Multilayered printed circuit board and method for manufacturing the same.
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  52. Ohta, Eiji; Yamazaki, Norihiko; Matsumura, Shinichi, Noncontact IC card.
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  53. Munoz-Bustamante Carlos ; McConnell Daniel, Printed circuit board for coupling surface mounted optoelectric semiconductor devices.
    상세보기
  54. Nakashiba, Yasutaka; Ogawa, Kenta, Semiconductor device.
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  55. Murayama, Kei; Higashi, Mitsutoshi, Semiconductor device and method of production of same.
    상세보기
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  58. T채uber,Andreas, Semiconductor memory apparatus with variable contact connections, and a corresponding semiconductor apparatus.
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  59. Hiew,Siew S.; Ni,Jim Chin Nan; Ma,Abraham C.; Shen,Ming Shiang, Single chip USB packages by various assembly methods.
    상세보기
  60. Crisp, Richard Dewitt; Chen, Yong; Haba, Belgacem; Zohni, Wael; Sun, Zhuowen, Single package dual channel memory with co-support.
    상세보기
  61. Crisp, Richard Dewitt; Chen, Yong; Haba, Belgacem; Zohni, Wael; Sun, Zhuowen, Single package dual channel memory with co-support.
    상세보기
  62. Hiew, Siew S.; Ma, Abraham C.; Nan, Nan, Single shot molding method for COB USB/EUSB devices with contact pad ribs.
    상세보기
  63. Hiew, Siew S.; Ma, Abraham C.; Nan, Nan, Single shot molding method for COB USB/EUSB devices with contact pad ribs.
    상세보기
  64. Xie,Hong; Stone,Brent, Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery.
    상세보기
  65. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for assemblies without wirebonds to package substrate.
    상세보기
  66. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for assemblies without wirebonds to package substrate.
    상세보기
  67. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for assemblies without wirebonds to package substrate.
    상세보기
  68. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for assemblies without wirebonds to package substrate.
    상세보기
  69. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for assemblies without wirebonds to package substrate.
    상세보기
  70. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for multi-die wirebond assemblies with parallel windows.
    상세보기
  71. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for multi-die wirebond assemblies with parallel windows.
    상세보기
  72. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for multi-die wirebond assemblies with parallel windows.
    상세보기
  73. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for multi-die wirebond assemblies with parallel windows.
    상세보기
  74. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for wirebond assemblies without windows.
    상세보기
  75. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization for wirebond assemblies without windows.
    상세보기
  76. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of signal terminals.
    상세보기
  77. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of signal terminals.
    상세보기
  78. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate.
    상세보기
  79. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate.
    상세보기
  80. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate.
    상세보기
  81. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate.
    상세보기
  82. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of terminals for wirebond assemblies without windows.
    상세보기
  83. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of terminals for wirebond assemblies without windows.
    상세보기
  84. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of terminals for wirebond assemblies without windows.
    상세보기
  85. Crisp, Richard Dewitt; Zohni, Wael; Haba, Belgacem; Lambrecht, Frank, Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows.
    상세보기
  86. Dixon, Duane, Surface mount power supply device and associated method.
    상세보기
  87. Nguyen Kevin ; Nguyen Binh Quang ; Tavallaei Siamak, Symmetric memory board.
    상세보기
  88. Xie,Hong; Stone,Brent, System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery.
    상세보기
  89. Sun, Zhuowen; Bang, Kyong-Mo; Haba, Belgacem; Zohni, Wael, TFD I/O partition for high-speed, high-density applications.
    상세보기
  90. Sun, Zhuowen; Bang, Kyong-Mo; Haba, Belgacem; Zohni, Wael, TFD I/O partition for high-speed, high-density applications.
    상세보기
  91. Shigehiro Koji,JPX, Tape carrier package and its fabrication method therefor.
    상세보기
  92. Ni, Jim Chin-Nan; Ma, Abraham C., USB flash drive with deploying and retracting functionalities using retractable cover/cap.
    상세보기
  93. Hiew, Siew S.; Nan, Nan; Ma, Abraham C., USB package with bistable sliding mechanism.
    상세보기

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