초록 ▼

The present invention involves in situ laser patterning of thin-film layers during sequential deposition of the different layers. The layers may be applied using any known method of film deposition. The method of the present invention involves laser ablation to remove unwanted portions of the coatin

The present invention involves in situ laser patterning of thin-film layers during sequential deposition of the different layers. The layers may be applied using any known method of film deposition. The method of the present invention involves laser ablation to remove unwanted portions of the coating layers, including color filter materials, that have been sequentially deposited onto substantially the entire surface of a substrate. By controlling the depth of the laser ablation removal of the deposited films, it is possible to remove any portion of a film or layers of films or coatings that have been sequentially coated onto the surface of the substrate and to thereby control the depth and location of color filter materials coated upon the substrate. This patterning process can be employed in conjunction with any film deposition technique known in the art, including vacuum, wet chemical or dry processing deposition techniques, but is preferred with vacuum deposition. Because both the coating and the selective removal of the coatings by laser ablation can be performed without breaking vacuum, in the case of vacuum deposition, the process greatly simplifies and increases the rate of production of coated arrays, including color filter arrays. In addition, this method allows for the construction of complex pattern, thin film structures without the need for masking encountered with other patterning processes.

대표청구항 ▼

[ What is claimed and desired to be secured by United States Letters Patent is:] [1.] A method for patterning a plurality of different and sequentially applied coating materials to form a coated substrate, the method comprising steps of:(a) providing a first substrate having a first substrate surfac

[ What is claimed and desired to be secured by United States Letters Patent is:] [1.] A method for patterning a plurality of different and sequentially applied coating materials to form a coated substrate, the method comprising steps of:(a) providing a first substrate having a first substrate surface to be coated;(b) applying a first coating material to substantially all of the first substrate surface;(c) removing one or more regions of the first coating material to a first controlled depth by laser ablation to form a first patterned surface having regions coated with said first coating material and regions without coating;(d) applying at least a second coating material to substantially all of the first patterned surface; and(e) removing one or more regions of the second coating material to a plurality of second controlled depths by laser ablation to form a second patterned surface having a plurality of different regions selected from the group consisting of regions coated with said second coating material overlying said first coating material, regions coated with said first coating material and regions without coating.