초록 ▼

A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which

A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit is to be used.

대표청구항 ▼

[ What is claimed is:] [1.] A method of making a shielded integrated circuit, comprising:using a plastic integrated circuit having a plastic body with internal elements;visualizing the location of the internal elements;cutting away selectively certain portions of the plastic body while avoiding cont

[ What is claimed is:] [1.] A method of making a shielded integrated circuit, comprising:using a plastic integrated circuit having a plastic body with internal elements;visualizing the location of the internal elements;cutting away selectively certain portions of the plastic body while avoiding contacting the internal elements to create a plurality of cutout portions;providing complementary shaped shielding members dimensioned suitably to fit within said cutout portions; andaffixing the complementary shaped shielding members within said cutout portions to shield the integrated circuit from radiation.