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1. Kosugi Yuhei (Tokyo JPX) Yamamoto Osamu (Tokyo JPX) Izumi Hiroaki (Tokyo JPX) Kusamitsu Hideki (Tokyo JPX) Omagari Shin-ichi (Tokyo JPX) Watanabe Hideo (Tokyo JPX) Minowa Yoshio (Tokyo JPX), Composite microwave circuit module assembly and its connection structure.

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2. Moser Lester J. (Scottsdale AZ), Coplanar waveguide semiconductor package.

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3. McCandless Jay H. (Issaquah WA), Hermetic waveguide-to-microstrip transition module.

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4. Ho Pang T. (Mountain View CA) Rubin Michael D. (Saratoga CA), Hermetically sealed active microwave integrated circuit.

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5. Shibagaki Nobuhiko (Hachioji JPX) Hikita Mitsutaka (Hachioji JPX) Tabuchi Toyoji (Yokohama JPX) Akagi Takatoshi (Kokubunji JPX) Wakamori Satoshi (Yokohama JPX) Matsumoto Tomomi (Hiratsuka JPX), High frequency circuit device.

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6. Miyauchi Akira (Kawasaki JPX) Nishimoto Hiroshi (Tokyo JPX) Okiyama Tadashi (Kawasaki JPX) Kitasagami Hiroo (Kawasaki JPX) Sugimoto Masahiro (Yokohama JPX) Tamada Haruo (Yokohama JPX) Emori Shinji (U, Integrated circuit device having strip line structure therein.

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7. Heckaman Douglas E. (Indialantic FL) Frisco Jeffrey A. (Palm Bay FL) Rieder Gregory C. (Satellite Beach FL) Bajgrowicz Edward J. (Palm Bay FL), Microwave chip carrier package having cover-mounted antenna element.

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이 특허를 인용한 특허 (51) 인용/피인용 타임라인 분석

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2. McDonough,Robert J.; Sun,Weimin, Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier.

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3. Goren, Yehuda G.; Chen, Tong, Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes.

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8. Loibl Josef,DEX ; Gander Helmut,DEX, Electronic control unit with a contact pin, and method of producing the control unit.

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9. Onishi Keiji,JPX ; Iwaki Hideki,JPX ; Seki Shun-ichi,JPX ; Taguchi Yutaka,JPX ; Shiraishi Tsukasa,JPX ; Bessho Yoshihiro,JPX ; Kawasaki Osamu,JPX ; Eda Kazuo,JPX, Electronic part and a method of production thereof.

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10. Haemer,Joseph Michael; Chong,Fu Chiung; Modlin,Douglas N., Enhanced compliant probe card systems having improved planarity.

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15. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.

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16. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.

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