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Sputter target/backing plate assembly and method of making same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B21D-039/00
출원번호 US-0426246 (1995-04-21)
발명자 / 주소
  • Hunt Thomas J.
  • Gilman Paul S.
출원인 / 주소
  • Materials Research Corporation
대리인 / 주소
    Wood, Herron, & Evans L.L.P.
인용정보 피인용 횟수 : 61  인용 특허 : 2

초록 ▼

This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of an underlying backing plate. The method of fo

대표청구항 ▼

[ What is claimed is:] [1.] A method of forming a bonded sputter target/backing plate assembly comprising a sputter target having a bonding surface, and an underlying backing plate having a bonding surface, comprising the steps of:providing a self-supporting sputter target having a bonding surface,

이 특허에 인용된 특허 (2)

  1. Kida Otojiro (Yokohama JPX) Mitsui Akira (Yokohama JPX) Hayashi Atsushi (Yokohama JPX), Ceramic rotatable magnetron sputtering cathode target and process for its production.
    상세보기
  2. Mueller John J. (Hilliard OH) Stellrecht David E. (Columbus OH), Method of bonding a sputter target-backing plate assembly assemblies produced thereby.
    상세보기

이 특허를 인용한 특허 (61)

  1. Kim, Jaeyeon, Aluminum-comprising target/backing plate structures.
    상세보기
  2. Sarkar, Jaydeep; Gilman, Paul, Diffusion bonded high purity copper sputtering target assemblies.
    상세보기
  3. Zhang Hao, Diffusion bonded sputter target assembly and method of making.
    상세보기
  4. Zhang, Hao, Diffusion bonded sputter target assembly and method of making same.
    상세보기
  5. Takahashi, Kazushige; Miyashita, Hirohito, Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method therefor.
    상세보기
  6. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
    상세보기
  7. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
    상세보기
  8. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
    상세보기
  9. Ivanov,Eugene Y.; Conard,Harry W., Friction fit target assembly for high power sputtering operation.
    상세보기
  10. Smathers, David B.; Heimanson, Dorian; Gutkin, Michael, Hermetic sealing of target/backing plate assemblies using electron beam melted indium or tin.
    상세보기
  11. Katsumi Watanabe JP, Highly gas tight chamber and method of manufacturing same.
    상세보기
  12. Watanabe, Katsumi, Highly gas tight chamber and method of manufacturing same.
    상세보기
  13. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
    상세보기
  14. Neumann, Martin John; Nguyen, Que Anh Song; Mehtani, Disha; Pradhan, Anshu A.; Rozbicki, Robert T.; Shrivastava, Dhairya; Frank, Trevor; Martin, Todd, Lithium sputter targets.
    상세보기
  15. Neumann, Martin John; Nguyen, Que Anh Song; Pradhan, Anshu A.; Rozbicki, Robert T.; Shrivastava, Dhairya; Satern, Jason; Martin, Todd, Lithium sputter targets.
    상세보기
  16. Ivanov, Eugene Y.; Conard, Harry W., Low temperature sputter target bonding method and target assemblies produced thereby.
    상세보기
  17. Ivanov,Eugene Y., Low temperature sputter target/backing plate method and assembly.
    상세보기
  18. Facey,Joseph C.; Ward,Ivan, Method for centering a sputter target onto a backing plate and the assembly thereof.
    상세보기
  19. Lo, Chi-Fung; Draper, Darryl, Method for consolidating and diffusion-bonding powder metallurgy sputtering target.
    상세보기
  20. Voutsas, Apostolos; Hartzell, John, Method for fabricating silicon targets.
    상세보기
  21. Koenigsmann, Holger J.; Perry, Andrew C.; Hunt, Thomas J.; Gilman, Paul S., Method for forming sputter target assemblies.
    상세보기
  22. Koenigsmann, Holger J.; Perry, Andrew C.; Hunt, Thomas J.; Gilman, Paul S., Method for forming sputter target assemblies.
    상세보기
  23. Schulz-Harder, Jürgen, Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacks.
    상세보기
  24. Ivanov, Eugene Y.; Conard, Harry W., Method of assembling target and backing plates.
    상세보기
  25. Gilman Paul S. ; Kulkarni Shailesh ; Blanchet Jean Pierre,FRX, Method of bonding a sputtering target to a backing plate.
    상세보기
  26. Wickersham, Jr.,Charles E.; Workman,David P., Method of forming a sputtering target assembly and assembly made therefrom.
    상세보기
  27. Kobayashi, Kiyokazu, Method of joining steel products, method of processing junction surfaces of steel products, and reinforcing member.
    상세보기
  28. Parfeniuk, Chris; Beier, Tony, Methods of bonding physical vapor deposition target materials to backing plate materials.
    상세보기
  29. Kim, Jaeyeon, Methods of bonding two aluminum-comprising masses to one another.
    상세보기
  30. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
    상세보기
  31. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
    상세보기
  32. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
    상세보기
  33. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
    상세보기
  34. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
    상세보기
  35. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
    상세보기
  36. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
    상세보기
  37. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
    상세보기
  38. Shin, Jong-Won; Margadant, Nikolaus; Leitner, Klaus, Non-continuous bonding of sputtering target to backing material.
    상세보기
  39. Parfeniuk, Chris; Beier, Tony, Physical vapor deposition target constructions.
    상세보기
  40. Wilhartitz, Peter; Sch?nauer, Stefan; Polcik, Peter, Process for manufacturing an evaporation source.
    상세보기
  41. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
    상세보기
  42. Young, Jeremy R., Process for the removal of contaminants from sputtering target substrates.
    상세보기
  43. Hunt, Thomas J.; Koenigsmann, Holger J.; Gilman, Paul S., Recessed sputter target.
    상세보기
  44. Yuan, Yongwen; Ivanov, Eugene Y.; Liu, Yang; Frausto, Phil; Miao, Weifang, Silicon sputtering target with special surface treatment and good particle performance and methods of making the same.
    상세보기
  45. Facey, Joseph C.; Ward, Ivan, Sputter target and backing plate assembly.
    상세보기
  46. Facey, Joseph C.; Ward, Ivan, Sputter target and backing plate assembly.
    상세보기
  47. Parker, Ronald M.; Rozbicki, Robert T., Sputter target and sputtering methods.
    상세보기
  48. Bardus Steven L. ; Qamar Sohail S. ; Bansal Anurag, Sputter target assembly having a metal-matrix-composite backing plate and methods of making same.
    상세보기
  49. Gilman Paul S. ; Hunt Thomas J. ; Annavarapu Suresh, Sputter target/backing plate assembly and method of making same.
    상세보기
  50. Plaisted, Dean T.; Asbas, Michael; Ferrin, Lawrence C.; Carter, Paul G.; Laverriere, Guy P., Sputtering target.
    상세보기
  51. Yamazaki, Shunpei; Takayama, Toru; Sato, Keiji, Sputtering target and manufacturing method thereof, and transistor.
    상세보기
  52. Wickersham, Jr., Charles E.; Levit, Vladimir; Alexander, P. Todd, Sputtering target and method of fabrication.
    상세보기
  53. Kachalov,Mikhail Y.; Wickersham, Jr.,Charles E., Sputtering target assemblies using resistance welding.
    상세보기
  54. Shimomuki Hitoshi,JPX ; Sasaki Fumio,JPX ; Shimizu Eiichi,JPX, Sputtering target assembly production method.
    상세보기
  55. Yamazaki, Shunpei, Sputtering target, method for manufacturing the same, and method for manufacturing semiconductor device.
    상세보기
  56. Yamazaki, Shunpei, Sputtering target, method for manufacturing the same, manufacturing semiconductor device.
    상세보기
  57. Oda, Kunihiro; Okabe, Takeo; Miyashita, Hirohito, Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor.
    상세보기
  58. Oda, Kunihiro, Tantalum sputtering target and method for preparation thereof.
    상세보기
  59. Wickersham, Jr., Charles E.; Levit, Vladimir; Alexander, P. Todd, Tantalum sputtering target and method of fabrication.
    상세보기
  60. Wickersham, Jr.,Charles E.; Zhang,Zhiguo; Ellison,Larry Edwin; Kachalov,Mikhail Y.; White, III,John D., Thermography test method and apparatus for bonding evaluation in sputtering targets.
    상세보기
  61. Smith, Timothy G., Tungsten-iron projectile.
    상세보기

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