$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[미국특허] Remote plasma source 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-010/00
출원번호 US-0751486 (1996-11-18)
발명자 / 주소
  • Fairbairn Kevin
  • Ponnekanti Hari K.
  • Cheung David
  • Tanaka Tsutomu,JPX
  • Kelka Malcal
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Patterson & Associates
인용정보 피인용 횟수 : 221  인용 특허 : 0

초록 ▼

The present invention provides a remote plasma source mountable on a process chamber and connectable on one end to a gas inletting system and on the other end to a gas distribution system disposed in a process chamber. Preferably, a conventional microwave generator is utilized to deliver microwaves

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for exciting one or more gases outside of a processing chamber, comprising:(a) at least one gas inlet selectively connectable to a chamber gas feed;(b) at least one gas outlet;(c) an energy transparent conduit disposed between the gas inlet and the gas outlet

이 특허를 인용한 특허 (221)

  1. Chandran, Shankar W.; Hendrickson, Scott; Jones, Gwendolyn D.; Venkataraman, Shankar; Yieh, Ellie, Accelerated plasma clean.
    상세보기
  2. Chandran,Shankar N.; Hendrickson,Scott; Jones,Gwendolyn D.; Venkataraman,Shankar; Yieh,Ellie, Accelerated plasma clean.
    상세보기
  3. Nemani, Srinivas D.; Koshizawa, Takehito, Air gap process.
    상세보기
  4. Purayath, Vinod R.; Ingle, Nitin K., Air gaps between copper lines.
    상세보기
  5. Kang, Sean; Ko, Jungmin; Luere, Oliver, Airgap formation with damage-free copper.
    상세보기
  6. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum oxide selective etch.
    상세보기
  7. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum selective etch.
    상세보기
  8. Xue, Jun; Hsu, Ching-Mei; Li, Zihui; Godet, Ludovic; Wang, Anchuan; Ingle, Nitin K., Anisotropic gap etch.
    상세보기
  9. Cook Robert C., Apparatus and method for plasma enhanced chemical vapor deposition (PECVD) in a single wafer reactor.
    상세보기
  10. Chistyakov, Roman; Abraham, Bassam Hanna, Apparatus and method for sputtering hard coatings.
    상세보기
  11. Oakley Thomas Franklin ; Turner Barry Gaskins, Apparatus and method for supplying fluids to a plasma arc torch.
    상세보기
  12. Oakley Thomas Franklin ; Turner Barry Gaskins, Apparatus and method for supplying fluids to a plasma arc torch.
    상세보기
  13. Lubomirsky,Dmitry; Shanmugasundram,Arulkumar; Pancham,Ian A.; Lopatin,Sergey, Apparatus for electroless deposition.
    상세보기
  14. Harvey,Keith; Janakiraman,Karthik; Floyd,Kirby, Backflush chamber clean.
    상세보기
  15. Rocha Alvarez, Juan Carlos; Balasubramanian, Ganesh; Cho, Tom K.; Padhi, Deenesh; Nowak, Thomas; Kim, Bok Hoen; M'Saad, Hichem; Raj, Daemian, Blocker plate bypass to distribute gases in a chemical vapor deposition system.
    상세보기
  16. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
    상세보기
  17. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
    상세보기
  18. Lubomirsky, Dmitry, Chamber with flow-through source.
    상세보기
  19. Lubomirsky, Dmitry, Chamber with flow-through source.
    상세보기
  20. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
    상세보기
  21. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
    상세보기
  22. Wang, Xikun; Pandit, Mandar; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K.; Liu, Jie, Chlorine-based hardmask removal.
    상세보기
  23. Wood, Bingxi Sun; Kawaguchi, Mark N.; Papanu, James S.; Mosely, Roderick C.; Lai, Chiukun Steven; Kao, Chien Teh; Ai, Hua; Wang, Wei W., Cleaning of native oxide with hydrogen-containing radicals.
    상세보기
  24. Wang, Xikun; Cui, Zhenjiang; Park, Soonam; Ingle, Nitin K., Cobalt-containing material removal.
    상세보기
  25. Lubomirsky, Dmitry; Kim, Sung Je, Conditioned semiconductor system parts.
    상세보기
  26. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
    상세보기
  27. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
    상세보기
  28. Hoinkis, Mark; Yan, Chun; Miyazoe, Hiroyuki; Joseph, Eric, Copper residue chamber clean.
    상세보기
  29. Becker, Volker; Laermer, Franz; Schilp, Andrea; Beck, Thomas, DEVICE AND METHOD FOR THE HIGH-FREQUENCY ETCHING OF A SUBSTRATE USING A PLASMA ETCHING INSTALLATION AND DEVICE AND METHOD FOR IGNITING A PLASMA AND FOR PULSING THE PLASMA OUT PUT OR ADJUSTING THE SAM.
    상세보기
  30. Zhu, Lina; Kang, Sean S.; Nemani, Srinivas D.; Kao, Chia-Ling, Delicate dry clean.
    상세보기
  31. Borean, Christophe; Delcarri, Jean-Luc, Device and process for chemical vapor phase treatment.
    상세보기
  32. Sandhu, Gurtej S.; Sharan, Sujit, Device for in-situ cleaning of an inductively-coupled plasma chambers.
    상세보기
  33. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
    상세보기
  34. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
    상세보기
  35. Purayath, Vinod R.; Wang, Anchuan; Ingle, Nitin K., Dopant etch selectivity control.
    상세보기
  36. Welch Michael D. ; Shan Homgqing ; Luscher Paul E. ; Lee Evans Y. ; Carducci James D. ; Salimian Siamak, Double slit-valve doors for plasma processing.
    상세보기
  37. Welch, Michael D.; Shan, Homgqing; Luscher, Paul E.; Lee, Evans Y.; Carducci, James D.; Salimian, Siamak, Double slit-valve doors for plasma processing.
    상세보기
  38. Zhang, Jingchun; Ingle, Nitin K.; Wang, Anchuan, Dry etch process.
    상세보기
  39. Kim, Sang Hyuk; Yang, Dongqing; Lee, Young S.; Jung, Weon Young; Kim, Sang-jin; Hsu, Ching-Mei; Wang, Anchuan; Ingle, Nitin K., Dry-etch for selective oxidation removal.
    상세보기
  40. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
    상세보기
  41. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
    상세보기
  42. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Wang, Yunyu; Lee, Young, Dry-etch for silicon-and-carbon-containing films.
    상세보기
  43. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
    상세보기
  44. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
    상세보기
  45. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Dual discharge modes operation for remote plasma.
    상세보기
  46. Ingle, Nitin K.; Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Enhanced etching processes using remote plasma sources.
    상세보기
  47. Cheung, David; Fang, Haoquan; Kuo, Jack; Kalinovski, Ilia; Li, Ted; Yao, Andrew, Enhanced passivation process to protect silicon prior to high dose implant strip.
    상세보기
  48. Nowak, Thomas; Latchford, Ian; Tanaka, Tsutomu; Kim, Bok Heon; Xu, Ping; Foster, Jason; DeShong, Heath B.; Seamons, Martin, Enhanced remote plasma cleaning.
    상세보기
  49. Korolik, Mikhail; Ingle, Nitin K.; Zhang, Jingchun; Wang, Anchuan; Liu, Jie, Etch suppression with germanium.
    상세보기
  50. Bluck, Terry; Barnes, Michael S.; Fairbairn, Kevin P., Evaporative system for solar cell fabrication.
    상세보기
  51. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Even tungsten etch for high aspect ratio trenches.
    상세보기
  52. Huang Wen-Liang,TWX, Find end point of CLF3 clean by pressure change.
    상세보기
  53. Purayath, Vinod R.; Ingle, Nitin K., Flash gate air gap.
    상세보기
  54. Huseinovic, Armin; Berry, Ivan L., Fluid distribution members and/or assemblies.
    상세보기
  55. Goto, Haruhiro Harry; Harshbarger, William R.; Shang, Quanyuan; Law, Kam S., Fluorine process for cleaning semiconductor process chamber.
    상세보기
  56. Pandit, Mandar; Wang, Xikun; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Fluorine-based hardmask removal.
    상세보기
  57. Tepman Avi, Front end vacuum processing environment.
    상세보기
  58. White, Carl L.; Shero, Eric; Reed, Joe, Gap maintenance for opening to process chamber.
    상세보기
  59. Murugesh,Laxman; Krishnaraj,Padmanabhan; Dunham,Carl, Gas distributor having directed gas flow and cleaning method.
    상세보기
  60. Park, Seung; Wang, Xikun; Liu, Jie; Wang, Anchuan; Kim, Sang-jin, Gas-phase tungsten etch.
    상세보기
  61. Kim, Sung Je; Kalita, Laksheswar; Pareek, Yogita; Kadam, Ankur; Goradia, Prerna Sonthalia; Thakur, Bipin; Lubomirsky, Dmitry, Generation of compact alumina passivation layers on aluminum plasma equipment components.
    상세보기
  62. Korolik, Mikhail; Ingle, Nitin; Kioussis, Dimitri, Germanium etching systems and methods.
    상세보기
  63. Cho, Tae; Kang, Sang Won; Yang, Dongqing; Lu, Raymond W.; Hillman, Peter; Celeste, Nicholas; Tan, Tien Fak; Park, Soonam; Lubomirsky, Dmitry, Grooved insulator to reduce leakage current.
    상세보기
  64. Goto, Haruhiro Harry; Cheung, David, High dose implantation strip (HDIS) in H2 base chemistry.
    상세보기
  65. Goto, Haruhiro Harry; Cheung, David, High dose implantation strip (HDIS) in H2 base chemistry.
    상세보기
  66. Goto, Haruhiro Harry; Cheung, David, High dose implantation strip (HDIS) in H2 base chemistry.
    상세보기
  67. Tran, Toan Q.; Malik, Sultan; Lubomirsky, Dmitry; Roy, Shambhu N.; Kobayashi, Satoru; Cho, Tae Seung; Park, Soonam; Venkataraman, Shankar, High temperature chuck for plasma processing systems.
    상세보기
  68. Chen, Zhijun; Li, Zihui; Ingle, Nitin K.; Wang, Anchuan; Venkataraman, Shankar, Highly selective doped oxide removal method.
    상세보기
  69. Felsenthal David ; Lee Chunghsin ; Sferlazzo Piero, In-line sputter deposition system.
    상세보기
  70. Chen, Xinglong; Lubomirsky, Dmitry; Venkataraman, Shankar, Insulated semiconductor faceplate designs.
    상세보기
  71. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
    상세보기
  72. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
    상세보기
  73. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Integrated oxide and nitride recess for better channel contact in 3D architectures.
    상세보기
  74. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated oxide recess and floating gate fin trimming.
    상세보기
  75. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
    상세보기
  76. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
    상세보기
  77. Nguyen, Son T.; Lubomirsky, Dmitry, Layered thin film heater and method of fabrication.
    상세보기
  78. Kevin Fairbairn ; Howard E. Grunes ; Christopher Lane ; Kelly A. Colborne, Load-lock with external staging area.
    상세보기
  79. Cheung, David; Li, Ted; Guha, Anirban; Ostrowski, Kirk, Low damage photoresist strip method for low-K dielectrics.
    상세보기
  80. Hsu, Ching-Mei; Ingle, Nitin K.; Hamana, Hiroshi; Wang, Anchuan, Low temperature gas-phase carbon removal.
    상세보기
  81. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Metal air gap.
    상세보기
  82. Robert C. Cook ; Daniel L. Brors, Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors.
    상세보기
  83. Paranjpe,Ajit P., Method and apparatus for layer by layer deposition of thin films.
    상세보기
  84. Reed, Joseph C; Shero, Eric J, Method and apparatus for minimizing contamination in semiconductor processing chamber.
    상세보기
  85. Zheng, Yi; Singh, Vinita; Nemani, Srinivas D.; Chen, Chen-An; Lee, Ju-Hyung; Venkataraman, Shankar, Method for cleaning a process chamber.
    상세보기
  86. Kao, Chien-Teh; Chou, Jing-Pei (Connie); Lai, Chiukin (Steven); Umotoy, Sal; Huston, Joel M.; Trinh, Son; Chang, Mei; Yuan, Xiaoxiong (John); Chang, Yu; Lu, Xinliang; Wang, Wei W.; Phan, See-Eng, Method for front end of line fabrication.
    상세보기
  87. Reed, Joseph C.; Shero, Eric J., Method for minimizing contamination in semiconductor processing chamber.
    상세보기
  88. Chen, David L.; Su, Yuh-Jia; Chiu, Eddie Ka Ho; Pozzoli, Maria Paola; Li, Senzi; Colangelo, Giuseppe; Alba, Simone; Petroni, Simona, Method for post-etch cleans.
    상세보기
  89. Rossman, Kent, Method of cleaning a semiconductor processing chamber.
    상세보기
  90. Ko, Jungmin, Method of fin patterning.
    상세보기
  91. Chistyakov, Roman, Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities.
    상세보기
  92. Chistyakov, Roman; Abraham, Bassam Hanna, Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities.
    상세보기
  93. Chistyakov,Roman, Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities.
    상세보기
  94. Chistyakov,Roman, Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities.
    상세보기
  95. Li, Zihui; Kao, Chia-Ling; Wang, Anchuan; Ingle, Nitin K., Methods for anisotropic control of selective silicon removal.
    상세보기
  96. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of SiN films.
    상세보기
  97. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of metal and metal-oxide films.
    상세보기
  98. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Methods for etch of metal and metal-oxide films.
    상세보기
  99. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of sin films.
    상세보기
  100. Chen, David; Goto, Haruhiro Harry; Martina, Martina; Greer, Frank; Alokozai, Shamsuddin, Methods for stripping photoresist and/or cleaning metal regions.
    상세보기
  101. Chen, David; Goto, Haruhiro Harry; Su, Martina; Greer, Frank; Alokozai, Shamsuddin, Methods for stripping photoresist and/or cleaning metal regions.
    상세보기
  102. Hong, Sukwon; Hamana, Hiroshi; Liang, Jingmei, Methods of reducing substrate dislocation during gapfill processing.
    상세보기
  103. Balasubramanian, Ganesh; Rocha-Alvarez, Juan Carlos; Cho, Tom K.; Raj, Daemian, Methods of uniformity control for low flow process and chamber to chamber matching.
    상세보기
  104. Daniel L. Brors ; Robert C. Cook, Mini-batch process chamber.
    상세보기
  105. Felsenthal David ; Lee Chunghsin ; Sferlazzo Piero, Multi-layer sputter deposition apparatus.
    상세보기
  106. Hua,Zhong Qiang; Tan,Zhengquan; Li,Zhuang; Rossman,Kent, Multistep remote plasma clean process.
    상세보기
  107. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
    상세보기
  108. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
    상세보기
  109. Shang, Quanyuan; Yadav, Sanjay; Harshbarger, William R.; Law, Kam S., On-site cleaning gas generation for process chamber cleaning.
    상세보기
  110. Shang,Quanyuan; Yadav,Sanjay; Harshbarger,William R.; Law,Kam S., On-site cleaning gas generation for process chamber cleaning.
    상세보기
  111. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K.; Anthis, Jeffrey W.; Schmiege, Benjamin, Oxide and metal removal.
    상세보기
  112. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
    상세보기
  113. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
    상세보기
  114. Xu, Lin; Chen, Zhijun; Wang, Anchuan; Nguyen, Son T., Oxide etch selectivity systems and methods.
    상세보기
  115. Lubomirsky, Dmitry, Oxygen compatible plasma source.
    상세보기
  116. Yang, Haichun; Lu, Xinliang; Kao, Chien-Teh; Chang, Mei, Passivation layer formation by plasma clean process to reduce native oxide growth.
    상세보기
  117. Chen, Xinglong; Yang, Jang-Gyoo; Tam, Alexander; Tam, Elisha, Pedestal with multi-zone temperature control and multiple purge capabilities.
    상세보기
  118. Thedjoisworo, Bayu Atmaja; Jacobs, Bradley Jon; Berry, Ivan; Cheung, David, Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films.
    상세보기
  119. Goto, Haruhiro Harry; Kalinovski, Ilia; Mohamed, Khalid, Photoresist strip method for low-k dielectrics.
    상세보기
  120. Shaviv, Roey; Ostrowski, Kirk; Cheung, David; Park, Joon; Thedjoisworo, Bayu; Lord, Patrick J., Photoresist strip processes for improved device integrity.
    상세보기
  121. Becknell, Alan Frederick; Buckley, Thomas James; Ferris, David; Pingree, Jr., Richard E.; Sakthivel, Palanikumaran; Srivastava, Aseem Kumar; Waldfried, Carlo, Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith.
    상세보기
  122. Srivastava, Aseem Kumar; Sakthivel, Palanikumaran; Buckley, Thomas James, Plasma ashing apparatus and endpoint detection process.
    상세보기
  123. Cheung, David; Ostrowski, Kirk J, Plasma based photoresist removal system for cleaning post ash residue.
    상세보기
  124. Cheung, David; Ostrowski, Kirk J., Plasma based photoresist removal system for cleaning post ash residue.
    상세보기
  125. Lubomirsky, Dmitry, Plasma processing system with direct outlet toroidal plasma source.
    상세보기
  126. Boulos, Maher I.; Jurewicz, Jerzy; Guo, Jiayin, Plasma reactor for the synthesis of nanopowders and materials processing.
    상세보기
  127. Lee, Sang In; Lee, Ilsong; Yang, Hyo Seok, Plasma reactor with conductive member in reaction chamber for shielding substrate from undesirable irradiation.
    상세보기
  128. Lee, Sang In; Lee, Ilsong; Yang, Hyo Seok, Plasma reactor with conductive member in reaction chamber for shielding substrate from undesirable irradiation.
    상세보기
  129. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Plasma-free metal etch.
    상세보기
  130. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Polarity control for remote plasma.
    상세보기
  131. Choi, Tom; Ko, Jungmin; Kang, Sean, Poly directional etch by oxidation.
    상세보기
  132. Kellogg, Michael C.; Dhindsa, Rajinder; Stevenson, Tom, Pressure controlled heat pipe temperature control plate.
    상세보기
  133. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
    상세보기
  134. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
    상세보기
  135. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  136. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  137. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  138. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  139. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  140. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  141. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  142. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  143. Eristoff, D. Guy; Barnes, Michael S.; Wall, Arthur C.; Bluck, Terry, Processing tool with combined sputter and evaporation deposition sources.
    상세보기
  144. Naik, Mehul; Ma, Paul F.; Nemani, Srinivas D., Protective via cap for improved interconnect performance.
    상세보기
  145. Sugiyama, Toru; Nakano, Ryu, Purge step-controlled sequence of processing semiconductor wafers.
    상세보기
  146. Chen, Xinglong; Garg, Saurabh; Yang, Jang-Gyoo, RPS assisted RF plasma source for semiconductor processing.
    상세보기
  147. Chen, Xinglong; Garg, Saurabh; Yang, Jang-Gyoo, RPS assisted RF plasma source for semiconductor processing.
    상세보기
  148. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  149. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  150. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  151. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  152. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
    상세보기
  153. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
    상세보기
  154. Sorensen, Carl A.; Kudela, Jozef, Remote inductively coupled plasma source for CVD chamber cleaning.
    상세보기
  155. Hua, Zhong Qiang; Kamath, Sanjay; Lee, Young S.; Yieh, Ellie Y.; Le, Hien-Minh Huu; Patel, Anjana M.; Gondhalekar, Sudhir R., Remote plasma clean process with cycled high and low pressure clean steps.
    상세보기
  156. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Remotely-excited fluorine and water vapor etch.
    상세보기
  157. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
    상세보기
  158. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
    상세보기
  159. Yang, Dongqing; Zhu, Lala; Wang, Fei; Ingle, Nitin K., Saving ion-damaged spacers.
    상세보기
  160. Chen, Zhijun; Huang, Jiayin; Wang, Anchuan; Ingle, Nitin, Selective SiN lateral recess.
    상세보기
  161. Wang, Xikun; Lei, Jianxin; Ingle, Nitin; Shaviv, Roey, Selective cobalt removal for bottom up gapfill.
    상세보기
  162. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
    상세보기
  163. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
    상세보기
  164. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
    상세보기
  165. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
    상세보기
  166. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
    상세보기
  167. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
    상세보기
  168. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
    상세보기
  169. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
    상세보기
  170. Citla, Bhargav; Ying, Chentsau; Nemani, Srinivas; Babayan, Viachslav; Stowell, Michael, Selective etch using material modification and RF pulsing.
    상세보기
  171. Wang, Xikun; Ingle, Nitin, Selective in situ cobalt residue removal.
    상세보기
  172. Hoinkis, Mark; Miyazoe, Hiroyuki; Joseph, Eric, Selective sputtering for pattern transfer.
    상세보기
  173. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and nitrogen.
    상세보기
  174. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and oxygen.
    상세보기
  175. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
    상세보기
  176. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
    상세보기
  177. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
    상세보기
  178. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
    상세보기
  179. Wang, Xikun; Ingle, Nitin, Selective tungsten removal.
    상세보기
  180. Pandit, Mandar B.; Wang, Anchuan; Ingle, Nitin K., Self-aligned process.
    상세보기
  181. Arnepalli, Ranga Rao; Goradia, Prerna Sonthalia; Visser, Robert Jan; Ingle, Nitin; Korolik, Mikhail; Biswas, Jayeeta; Lodha, Saurabh, Self-limiting atomic thermal etching systems and methods.
    상세보기
  182. Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Semiconductor processing systems having multiple plasma configurations.
    상세보기
  183. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
    상세보기
  184. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
    상세보기
  185. Nguyen, Andrew; Ramaswamy, Kartik; Nemani, Srinivas; Howard, Bradley; Vishwanath, Yogananda Sarode, Semiconductor system assemblies and methods of operation.
    상세보기
  186. Wang,Hougong; Ngan,Kenny King Tai; Xu,Zheng, Semiconductor wafer preheating.
    상세보기
  187. Satoh, Kiyoshi; Sato, Kazuo; Fududa, Hideaki, Semiconductor-processing device provided with a remote plasma source for self-cleaning.
    상세보기
  188. Huston, Joel M., Showerhead assembly.
    상세보기
  189. Ko, Jungmin; Choi, Tom; Ingle, Nitin; Kim, Kwang-Soo; Wou, Theodore, SiN spacer profile patterning.
    상세보기
  190. Park, Seung; Wang, Anchuan, Silicon etch process with tunable selectivity to SiO2 and other materials.
    상세보기
  191. Korolik, Mikhail; Ingle, Nitin K.; Wang, Anchuan; Xu, Jingjing, Silicon germanium processing.
    상세보기
  192. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Silicon oxide selective removal.
    상세보기
  193. Huang, Jiayin; Chen, Zhijun; Wang, Anchuan; Ingle, Nitin, Silicon pretreatment for nitride removal.
    상세보기
  194. Li, Zihui; Hsu, Ching-Mei; Zhang, Hanshen; Zhang, Jingchun, Silicon selective removal.
    상세보기
  195. Chen, Zhijun; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Silicon-carbon-nitride selective etch.
    상세보기
  196. Kim, Hun Sang; Choi, Jinhan; Koseki, Shinichi, Simplified litho-etch-litho-etch process.
    상세보기
  197. Goto, Haruhiro Harry; Cheung, David, Simultaneous front side ash and backside clean.
    상세보기
  198. Luere, Olivier; Kang, Sean S.; Nemani, Srinivas D., Spacer formation.
    상세보기
  199. Klein, Martin P.; Felsenthal, David; Sferlazzo, Piero, Substrate processing pallet and related substrate processing method and machine.
    상세보기
  200. Klein, Martin P.; Felsenthal, David; Sferlazzo, Piero, Substrate processing pallet and related substrate processing method and machine.
    상세보기
  201. Klein, Martin P.; Felsenthal, David; Sferlazzo, Piero, Substrate processing pallet and related substrate processing method and machine.
    상세보기
  202. Kurita, Shinichi; Anwar, Suhail; Kiyotake, Toshio, Substrate support bushing.
    상세보기
  203. Kurita, Shinichi; Anwar, Suhail; Kiyotake, Toshio, Substrate support bushing.
    상세보기
  204. Barnes, Michael S.; Bluck, Terry, System and method for processing substrates with detachable mask.
    상세보기
  205. Scollay, Stuart; Bluck, Terry; Chen, Xiang, System and method for substrate transport.
    상세보기
  206. Fairbairn, Kevin; Barzilai, Jessica; Ponnekanti, Hari K.; Taylor, W. N. (Nick), Tandem process chamber.
    상세보기
  207. Fairbairn, Kevin; Barzilai, Jessica; Ponnekanti, Hari K.; Taylor, W. N. (Nick), Tandem process chamber.
    상세보기
  208. Cook, Robert C.; Brors, Daniel L., Thermal gradient enhanced CVD deposition at low pressure.
    상세보기
  209. Benjaminson, David; Lubomirsky, Dmitry, Thermal management systems and methods for wafer processing systems.
    상세보기
  210. Kroeker Tony R., Three chamber load lock apparatus.
    상세보기
  211. Tony R. Kroeker, Three chamber load lock apparatus.
    상세보기
  212. Wang, Xikun; Pandit, Mandar; Wang, Anchuan; Ingle, Nitin K., Titanium nitride removal.
    상세보기
  213. Wang, Xikun; Xu, Lin; Wang, Anchuan; Ingle, Nitin K., Titanium oxide etch.
    상세보기
  214. Liu, Jie; Wang, Xikun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Tungsten oxide processing.
    상세보기
  215. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Tungsten separation.
    상세보기
  216. Cheung, David; Fang, Haoquan; Kuo, Jack; Kalinovski, Ilia; Li, Zhao; Yao, Guhua; Guha, Anirban; Ostrowski, Kirk J., Ultra low silicon loss high dose implant strip.
    상세보기
  217. Klein,Martin P.; Keigler,Arthur; Felsenthal,David, Ultra-thin wafer handling system.
    상세보기
  218. Balasubramanian, Ganesh; Rocha Alvarez, Juan Carlos; Cho, Tom K.; Raj, Daemian, Uniformity control for low flow process and chamber to chamber matching.
    상세보기
  219. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., V trench dry etch.
    상세보기
  220. Liu, Jie; Purayath, Vinod R.; Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Vertical gate separation.
    상세보기
  221. Stowell, Michael W.; Liang, Qiwei, Workpiece processing chamber having a rotary microwave plasma source.
    상세보기

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

관련 콘텐츠

저작권 관리 안내
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로