초록 ▼

A method of making a composite comprises applying controlled heating to a bonding surface of a preformed substantially rigid thermoplastic substrate to cause the bonding surface to flow, without causing substantial heat soaking, melting, or other damage to a residue portion of the substrate, or a se

A method of making a composite comprises applying controlled heating to a bonding surface of a preformed substantially rigid thermoplastic substrate to cause the bonding surface to flow, without causing substantial heat soaking, melting, or other damage to a residue portion of the substrate, or a second component known as a bonding layer. The method further comprises causing pressurized contact at an interface between the bonding surface and the bonding layer, while the bonding surface is in a flow state. The invention further contemplates an apparatus for making a composite, comprising a heater capable of applying controlled heating to the bonding surface, and a bonding device in communication with the heater for creating pressurized contact at the interface between the bonding surface and the bonding layer, following controlled heating.

대표청구항 ▼

[ I claim:] [1.] A method of making a composite, comprising the steps of:placing a substantially rigid thermoplastic substrate and a bonding layer in a bonding device, the substantially rigid thermoplastic substrate having a bonding surface and a residue;applying controlled heating to the bonding de

[ I claim:] [1.] A method of making a composite, comprising the steps of:placing a substantially rigid thermoplastic substrate and a bonding layer in a bonding device, the substantially rigid thermoplastic substrate having a bonding surface and a residue;applying controlled heating to the bonding device, to cause a flow state in said bonding surface of the substrate, wherein the step of applying controlled heating comprises applying heating of an appropriate temperature for an appropriate period of time to cause the bonding surface to flow without causing substantial heat soaking, melting or other damage, by warpage or otherwise, to the residue of the substrate or the bonding layer; and thenclosing the bonding device to cause pressurized contact at an interface between said bonding surface and said bonding layer while the bonding surface is in a flow state, to form a bond at said interface.