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Fluid transmissive apparatus for heat transfer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0922287 (1997-09-03)
발명자 / 주소
  • Batchelder John Samual
대리인 / 주소
    Hodgson
인용정보 피인용 횟수 : 47  인용 특허 : 7

초록

A heat transfer apparatus for transferring heat between an object and a flowing fluid, comprising a plurality of fluid transmissive heat transfer units arranged in a splayed array for transferring heat between an object in contact with the splayed array and a fluid flowing from and to a plurality of

대표청구항

[ We claim:] [1.] A heat transfer apparatus for transferring heat between an object and a flowing fluid, comprising;a plurality of fluid transmissive heat transfer units, each heat transfer unit comprising a row of substantially parallel elongated heat conducting elements, each heat conducting eleme

이 특허에 인용된 특허 (7)

  1. Casati Paolo (Milan ITX) Marchisi Giuseppe (Milan ITX), Combination and method for coupling a heat sink to a semiconductor device.
  2. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  3. Korinsky George K. (The Woodlands TX), Heat sink for a personal computer.
  4. Akachi Hisateru (No. 6-5-603 ; Kamitsuruma 5-chome Sagamihara City ; Kanagawa Prefecture JPX), L-type heat sink.
  5. Hatada Toshio (Tsuchiura) Matsushima Hitoshi (Ibaraki) Kondou Yoshihiro (Ibaraki) Inoue Hiroshi (Ibaraki) Otsuka Kanji (Higashiyamato) Shirai Yuji (Kodaira) Ohba Takao (Hadano) Yamagiwa Akira (Hadano, LSI cooling apparatus and computer cooling apparatus.
  6. Brady Kevin J. (Millington NJ) Cohn Charles (Wayne NJ), Pin-fin heat sink.
  7. Ozeki Tamio (Tokyo JPX), Process for manufacturing a pin type radiating fin.

이 특허를 인용한 특허 (47)

  1. Lee, Jae Hyuk, Air conditioner with heat pipe.
  2. Poliquin, Eric; Crane, Douglas T.; Jovovic, Vladimir; Dean, Joseph; Kossakovski, Dmitri; LaGrandeur, John Walter, Cartridge-based thermoelectric systems.
  3. Marroquin, Christopher M.; O'Connell, Kevin M.; Schultz, Mark D.; Tian, Shurong, Cold plate.
  4. Bell,Lon E., Compact, high-efficiency thermoelectric systems.
  5. Lopatinsky, Edward; Schaefer, Daniel; Rosenfeld, Saveliy; Fedoseyev, Lev, Cooler for an electronic device.
  6. Barsun, Stephan Karl; Barr, Andrew Harvey; Dobbs, Robert William, Cooling device having fins arranged to funnel air.
  7. Gerard MacManus GB; Bruce Fryers GB; Nicholas Foley GB; Michael Tate GB, Cooling devices.
  8. Fryers Bruce,GBX ; MacManus Gerard,GBX ; Tate Michael,GBX ; Foley Nicholas,GBX, Cooling equipment.
  9. Bell, Lon E., Efficiency thermoelectrics utilizing convective heat flow.
  10. Klein, John Frederick, Foam metal heat exchanger system.
  11. Brignone, Mauro; Ziggiotti, Alessandro; Repetto, Piermario; Lambertini, Vito Guido; Perlo, Piero, Generator of electric energy based on the thermoelectric effect.
  12. Wilding, Werner; Schwartze, Sebastian, Heat exchanger with a porous metal structure having manifolds and tubes.
  13. Ross, Ernest, Heat sink.
  14. Suzuki, Masumi, Heat sink and electronic device with heat sink.
  15. Sun, Ke; Chen, Xiao Zhu, Heat sink having high heat dissipation efficiency.
  16. LaGrandeur, John; Bell, Lon E., Heater-cooler with bithermal thermoelectric device.
  17. Self, Bob J., Heatsink with improved heat dissipation capability.
  18. Budelman Gerald A., Heatsink with integrated blower for improved heat transfer.
  19. Ranalli, Marco; Adldinger, Martin; Crane, Douglas T., High efficiency thermoelectric generation.
  20. Bell, Lon E., High power density thermoelectric systems.
  21. Bell, Lon E., High power density thermoelectric systems.
  22. Symons,Robert S., Integrated liquid cooling device for electronic components.
  23. Symons,Robert S., Integrated liquid cooling device with immersed electronic components.
  24. Gerald A. Budelman, Method and apparatus for improving the thermal performance of heat sinks.
  25. Tsao, Pei Haw; Pan, Hsin Yu, Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC).
  26. Lakra, Paul; Butler, Stephen James, Method of an apparatus for heating a substrate.
  27. Materna, Peter Albert, Optimized fins for convective heat transfer.
  28. Materna,Peter A., Optimized fins for convective heat transfer.
  29. Richards,Leslie W., Plug baffle device for mold.
  30. Bell, Lon E.; LaGrandeur, John, System and method for climate control within a passenger compartment of a vehicle.
  31. Bell, Lon E.; LaGrandeur, John, System and method for distributed thermoelectric heating and cooling.
  32. LaGrandeur, John; Poliquin, Eric; Kossakovski, Dmitri; Jovovic, Vladimir, Systems and methods for reducing current and increasing voltage in thermoelectric systems.
  33. Kanatzidis, Mercouri G.; Androulakis, John; Sootsman, Joseph R., Thermoelectric compositions and process.
  34. Goenka, Lakhi Nandlal, Thermoelectric device efficiency enhancement using dynamic feedback.
  35. Bell, Lon E.; Diller, Robert W., Thermoelectric heat pump.
  36. Bell, Lon E.; Diller, Robert W., Thermoelectric heat pump.
  37. Bell, Lon E.; Diller, Robert W., Thermoelectric heat pump.
  38. Heremans, Joseph P.; Jaworski, Christopher M.; Jovovic, Vladimir; Harris, Fred, Thermoelectric materials having porosity.
  39. Bell, Lon E.; Diller, Robert W.; Park, Darrell, Thermoelectric personal environment appliance.
  40. Bell,Lon E.; Diller,Robert W., Thermoelectric personal environment appliance.
  41. Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generating systems utilizing segmented thermoelectric elements.
  42. Bell,Lon E., Thermoelectric power generation systems.
  43. Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generator for variable thermal power source.
  44. Bell, Lon E.; Crane, Douglas Todd, Thermoelectric power generator for variable thermal power source.
  45. Bell, Lon E., Thermoelectrics utilizing convective heat flow.
  46. Bell,Lon E., Thermoelectrics utilizing convective heat flow.
  47. Bell,Lon E., Thermoelectrics utilizing thermal isolation.
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