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A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with t

A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.

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1. A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on said mounting module is dissipated by a cooling means, comprising: at least one conduction means which thermally connects said circuit elements with said cooling means, wh

1. A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on said mounting module is dissipated by a cooling means, comprising: at least one conduction means which thermally connects said circuit elements with said cooling means, wherein said conduction means includes a predetermined number of first conductive members placed in a respective hole formed in said conduction means, said first conductive members being movably supported by a first conductive material filled between a side surface of said first conductive members and a surface of said respective hole formed in said conduction means, a second conductive material is provided between said first conductive material and said circuit element, and a predetermined number of injection passages for filling one of said first conductive material and said second conductive material, and said first conductive material and said second conductive material are provided with said first conductive member. 2. The cooling device for a mounting module as claimed in claim 1, wherein said first conductive material has substantially an even thickness extending around said first conductive member. 3. The cooling device for a mounting module as claimed in claim 1, wherein at least two of said predetermined number of injection passages are connected with each other. 4. The cooling device for a mounting module as claimed in claim 3, wherein said at least two of said predetermined number of injection passages include an injection passage for filling said first conductive material and an injection passage for filling said second conductive material. 5. The cooling device for a mounting module as claimed in claim 4, wherein the ratio of a total outlet surface area of said injection passages for filling said first conductive material and a total outlet surface area of said injection passages for filling said second conductive material is substantially the same as a ratio of an amount of said first conductive material to be filled around a side surface of said first conductive member and an amount of said second conductive material to be filled between said circuit element and said first conductive member. 6. The cooling device for a mounting module as claimed in claim 1, wherein said first conductive member includes an extending portion having a hook shape, and said conduction means includes a hook portion engageable with said extending portion of said first conductive member. 7. The cooling device for a mounting module as claimed in claim 6, wherein said first conductive material is present between said extending portion of said first conductive member and said hook portion of said conduction means. 8. The cooling device for a mounting module as claimed in claim 1, wherein a predetermined number of elastic members is provided between said first conductive member and said cooling means in order to press said first conductive member towards said circuit element. 9. The cooling device for a mounting module as claimed in claim 6, wherein a second conductive member is provided between said circuit element and said first conductive member, and said second conductive material is present between said first conductive member and said second conductive member. 10. The cooling device for a mounting module as claimed in claim 9, wherein said second conductive member has an upper portion having a concave shape, facing said first conductive member, and said first conductive member has a lower portion having a convex shape engageable with said concave shape of said upper portion of said second conductive member. 11. The cooling device for a mounting module as claimed in claim 9, wherein a sealing member is provided on said second conductive member in order to seal said second conductive material. 12. The cooling device for a mounting module as claimed in claim 1, wherein said conduction means includes a step portion engageable with an extending portion of said first conductive member, said first conductive material applicable to said step portion. 13. The cooling device for a mounting module as claimed in claim 12, wherein a sealing member is provided on said step portion. 14. A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on said mounting module is dissipated by a cooling member comprising: at least one conduction member to thermally connect said circuit elements with said cooling member; wherein said conduction member includes a predetermined number of first conductive members placed in a respective hole formed in said conduction member, said first conductive members being movably supported by a first conductive material filled between a side surface of said first conductive members and a surface of said respective hole formed in said conduction member and by a second conductive material disposed between a lower surface of said first conductive member and said circuit elements.