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A method and apparatus for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer

A method and apparatus for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.

대표청구항 ▼

[ We claim:] [1.] A system for processing a substrate comprising:a first wafer processing station; anda second wafer processing station coupled to the first station, wherein at least one of the first and second wafer processing stations comprises a roller to rotate the substrate, the roller havinga

[ We claim:] [1.] A system for processing a substrate comprising:a first wafer processing station; anda second wafer processing station coupled to the first station, wherein at least one of the first and second wafer processing stations comprises a roller to rotate the substrate, the roller havinga groove;a first outer edge;at least one tread extending between the groove and the first outer edge.