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Vaporizer apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-019/00
출원번호 US-0862155 (1997-05-22)
우선권정보 JP-0153407 (1996-05-24)
발명자 / 주소
  • Horie Kuniaki,JPX
  • Ogure Naoaki,JPX
  • Fukunaga Yukio,JPX
  • Hongo Akihisa,JPX
출원인 / 주소
  • Ebara Corporation, JPX
대리인 / 주소
    Wenderoth, Lind & Ponack, L.L.P.
인용정보 피인용 횟수 : 25  인용 특허 : 3

초록

Heat can be supplied effectively to a porous member of a vaporizer apparatus so that a vaporizing operation can be carried out smoothly and efficiently. The vaporizer apparatus includes a vaporizer section having a porous member including a liquid receiving surface and a vapor discharge surface. A f

대표청구항

[ What is claimed is:] [1.] A vaporizer apparatus for vaporizing a liquid, said apparatus comprising:a vaporizer section including a porous member having a liquid receiving surface, a vapor discharge surface and voids communicating with said liquid receiving surface and said vapor discharge surface;

이 특허에 인용된 특허 (3)

  1. Arnold Manfred (Aschaffenburg DEX) Gegenwart Rainer (Rdermark DEX) Noll Sonja (Frankfurt DEX) Ritter Jochen (Laubach DEX) Stoll Helmut (Sulzbach DEX), Apparatus for the evaporation of liquids.
  2. Kirlin Peter S. (Brookfield) Binder Robin L. (Bethlehem) Gardiner Robin A. (Bethel CT), Method for delivering an involatile reagent in vapor form to a CVD reactor.
  3. Tanaka Hiroshi (Hyogo JPX) Doi Nobuaki (Hyogo JPX) Omori Masashi (Hyogo JPX) Ishikawa Hiroaki (Hyogo JPX), Steam drying apparatus, cleaning apparatus incorporating the same, and steam drying process.

이 특허를 인용한 특허 (25)

  1. Talieh,Homayoun, Apparatus for electroprocessing a workpiece surface.
  2. Ashjaee,Jalal; Nagorski,Boguslaw; Basol,Bulent M.; Talieh,Homayoun; Uzoh,Cyprian, Apparatus for processing surface of workpiece with small electrodes and surface contacts.
  3. Woelk, Egbert; DiCarlo, Ronald L.; Shenai-Khatkhate, Deodatta Vinayak, Delivery device, methods of manufacture thereof and articles comprising the same.
  4. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.
  5. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.
  6. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.
  7. Basol, Bulent M.; Bogart, Jeffrey, Electrode and pad assembly for processing conductive layers.
  8. Fukuoka, Tetsuo; Akimoto, Masami; Kitano, Takahiro; Kimura, Yoshio; Hayashi, Shinichi; Ito, Hikaru, Heating apparatus, and coating and developing apparatus.
  9. Talieh,Homayoun; Basol,Bulent, Method and apparatus for forming an electrical contact with a semiconductor substrate.
  10. Basol,Bulent M., Method and apparatus for localized material removal by electrochemical polishing.
  11. Vasilev, Vladislav, Method and apparatus for workpiece surface modification for selective material deposition.
  12. Vasilev, Vladislav, Method and apparatus for workpiece surface modification for selective material deposition.
  13. Woelk, Egbert; DiCarlo, Jr., Ronald L., Method for constant concentration evaporation and a device using the same.
  14. Basol, Bulent M., Method for controlling conductor deposition on predetermined portions of a wafer.
  15. Tuominen, Marko; Shero, Eric; Verghese, Mohith, Method for controlling the sublimation of reactants.
  16. Jan Snijders, Gert; Raaijmakers, Ivo, Method for vaporizing non-gaseous precursor in a fluidized bed.
  17. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Method of making rolling electrical contact to wafer front surface.
  18. Uzoh,Cyprian; Basol,Bulent; Talieh,Homayoun, Pad designs and structures for a versatile materials processing apparatus.
  19. Mayer, Steven T.; Drewery, John Stephen; Webb, Eric G., Photoresist-free metal deposition.
  20. Basol,Bulent, Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece.
  21. Basol, Bulent M., Plating methods for low aspect ratio cavities.
  22. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Providing electrical contact to the surface of a semiconductor workpiece during processing.
  23. Sloan Jeffrey E. ; Bellegarde Eugene L., Steam cleaning system.
  24. Tuominen, Marko; Shero, Eric; Verghese, Mohith, System for controlling the sublimation of reactants.
  25. Tuominen, Marko; Shero, Eric; Verghese, Mohith, System for controlling the sublimation of reactants.
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