초록

A process for the production of a structure having a thin semiconductor film (2) adhering to a target substrate (24). The process which is applicable to the production of electronic components comprises the steps of

대표청구항 ▼

[ We claim:] [1.] A process for the production of a structure having a semiconductor thin film (4) adhering to a target substrate (24), comprising the following steps:a) producing a first structure having a thin semiconductor film on a first substrate (2) to form a thin film-first substrate assembly

[ We claim:] [1.] A process for the production of a structure having a semiconductor thin film (4) adhering to a target substrate (24), comprising the following steps:a) producing a first structure having a thin semiconductor film on a first substrate (2) to form a thin film-first substrate assembly, the thin film having a first free face (10) called the front face and a second face (8) called the rear face bonded to the first substrate by a first bonding energy E.sub.0, andb) transferring the thin film (4) from the first substrate (2) to the target substrate (24), said transfer involving both a tearing of the thin film (4) from the first substrate (2) by application to the thin film-first substrate assembly tearing away forces able to overcome the first bonding energy and adhesive contacting of the thin film (4) with the target substrate (24), said transferring being accomplished byb.sub.1) the adhesive contacting of a manipulator (12) with the first face (10) of the thin film (4), the adhesive contact being established with a second bonding energy E.sub.1 exceeding the first bonding energy,b.sub.2) separating of the thin film (4) and the first substrate (2) by tearing away the thin film (4) level with the second face (8) and the first substrate, andb.sub.3) adhesive contacting of the second face of the thin film (4) with the target substrate (24) with a third bonding energy E.sub.2 and separating of the thin film (4) from the manipulator (12).