초록 ▼

A chip scale ball grid array for integrated circuit packaging having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate. The nonpolymer support structure acts to increase circuit reliability by reducing thermal stress effects and/or by reducing or eliminat

A chip scale ball grid array for integrated circuit packaging having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate. The nonpolymer support structure acts to increase circuit reliability by reducing thermal stress effects and/or by reducing or eliminating formation of voids in an integrated circuit package. A nonpolymer support structure may be a material, such as copper foil, having sufficient rigidity to allow processing of chip scale package in strip format.

대표청구항 ▼

[ What is claimed is:] [1.] An electronic package comprising:an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit;a flexible intermediate circuit including an array of electrical interconnects;at least one nonpolymer layer hav

[ What is claimed is:] [1.] An electronic package comprising:an integrated circuit having at least one electrical contact site centrally disposed on a first side of the integrated circuit;a flexible intermediate circuit including an array of electrical interconnects;at least one nonpolymer layer having first and second sides, said first side of said nonpolymer layer being structurally coupled to said first side of said integrated circuit, and said second side of said nonpolymer layer being structurally coupled to said intermediate circuit, wherein said nonpolymer layer is conductive and is electrically coupled to said integrated circuit to form a power or ground plane;a slot extending through a central portion of said intermediate circuit and said nonpolymer layer, the slot aligned with the at least one electrical contact site of the integrated circuit; rein said at least one centrally disposed electrical contact site of the IC is electrically coupled to at least one electrical interconnect of said intermediate circuit by a conductive feature selected from the group consisting of wire bonding and thermocompression bonding.