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Powder metal heat sink for integrated circuit devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/34
출원번호 US-0839867 (1997-04-22)
발명자 / 주소
  • Schneider Mark R.
출원인 / 주소
  • LSI Logic Corporation
인용정보 피인용 횟수 : 0  인용 특허 : 52

초록

Apparatus for use in cooling an integrated circuit structure. The apparatus includes a heat sink having a first portion configured for thermal engagement with an integrated circuit device and a second portion configured for the dissipation of heat into an ambient fluid, such as air. The heat sink is

대표청구항

[ What is claimed is:] [1.] A heat sink assembly, comprising:a powdered metal first heat sink unit including a first central body and a first cantilevered fin extending out from said first central body; anda powdered metal second heat sink unit including a second central body and a second cantilever

이 특허에 인용된 특허 (52)

  1. Derryberry Lesli A. (Dallas TX) Williams Charles E. (Dallas TX), A chip carrier and mounting structure connected to the chip carrier.
  2. Corman Ned E. (Harrisburg PA) Kandybowski Steven J. (Tower City PA) Scheingold William S. (Palmyra PA) Youngfleish Frank C. (Harrisburg PA), Active device substrate connector having a heat sink.
  3. Itoh Yoshiaki (Hyogo JPX) Odani Yusuke (Hyogo JPX) Akechi Kiyoaki (Hyogo JPX) Kuroishi Nobuhito (Hyogo JPX), Aluminum-silicon alloy heatsink for semiconductor devices.
  4. Brown Candice H. (San Jose CA), Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to th.
  5. Christiansen Robert A. (Salvisa KY) DiGirolamo Joel A. (Lexington KY), Circuit board with self-supporting connection between sides.
  6. Jha Sunil C. (Attleboro MA) Forster James A. (Barrington RI) Breit Henry F. (Attleboro MA), Circuit system, a composite material for use therein, and a method of making the material.
  7. Kirby Peter L. (Newcastle Upon Tyne GB2), Electrical assembly.
  8. Funari Joseph (Vestal NY) Green Mary C. (Endicott NY) Reynolds Scott D. (Endwell NY) Sammakia Bahgat G. (Johnson City NY), Electronic package with improved heat sink.
  9. Schneider Mark R. (San Jose CA) Joroski Joseph (San Jose CA), Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system.
  10. Larson Ralph I. (North Reading MA), Graphite heat-sink mountings.
  11. Butt Sheldon H. (Godfrey IL) Voss Scott V. (Portola Valley CA), Heat dissipating interconnect tape for use in tape automated bonding.
  12. Ishida Yoshio (Osaka JPX), Heat sink.
  13. Gabuzda Paul G. (Laguna Beach CA), Heat sink device assembly for encumbered IC package.
  14. Ehlert Michael R. (Beaverton OR) Helderman Earl R. (Hillsboro OR), Heat sink device using composite metal alloy.
  15. Wakabayashi Tetsushi (Kawasaki JPX) Honda Norio (Aizuwakamatsu JPX) Sakuma Osamu (Yokohama JPX), Heat sink for a semiconductor device.
  16. Long Jon (Livermore CA) Schneider Mark (San Jose CA) Patil Sadanand (San Jose CA), Heat sink for semiconductor device assembly.
  17. Villaume Henry F. (Intervale NH), Heat sink plate for multiple semi-conductors.
  18. Spaight ; Ronald Neil, Heat transfer mechanism for integrated circuit package.
  19. Schneider Mark R. (San Jose CA), Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same.
  20. Sugimoto Masahiro (Yokosuka JPX) Wakasugi Yasumasa (Kawasaki JPX), Heatsink package for flip-chip IC.
  21. McShane Michael B. (Austin TX) Lin Paul (Austin TX), High performance overmolded electronic package.
  22. Eisele Dieter (Lampertheim DEX) Weimann Klaus (Lampertheim DEX), High-power semiconductor assembly in disk-cell configuration.
  23. Hoyer Norman S. (Mt. Lebanon PA) Iyer Natraj C. (Monroeville PA), Hot isostatic pressing of high performance electrical components.
  24. Patil Sadanand (San Jose CA) Murphy Adrian (San Jose CA) Newman Keith (Sunnyvale CA), Integral dam and heat sink for semiconductor device assembly.
  25. Lee James C. K. (Los Altos Hills CA), Integrated circuit packaging systems with double surface heat dissipation.
  26. Hawthorne Emily (San Francisco CA) McCormick John (Redwood City CA), Location and standoff pins for chip on tape.
  27. Frantz Earl L. (Reading PA), Low expansion low resistivity composite powder metallurgy member and method of making the same.
  28. Shimp David A. (Prospect KY), Metal acetylacetonate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols.
  29. Schneider Mark R. (San Jose CA), Method and apparatus for dissipating heat in an electronic device.
  30. Hashemi Seyed H. (Austin TX) Olla Michael A. (Austin TX) Dolbear Thomas P. (Austin TX) Nelson Richard D. (Austin TX), Method for encapsulating an integrated circuit using a removable heatsink support block.
  31. McShane Michael B. (Austin TX) Casto James J. (Austin TX) Joiner Bennett A. (Austin TX), Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suc.
  32. Itoh Yoshiaki (Hyogo JPX) Odani Yusuke (Hyogo JPX) Akechi Kiyoaki (Hyogo JPX) Kuroishi Nobuhito (Hyogo JPX), Method for producing material for semiconductor device.
  33. Harner Leslie L. (Ruscombmanor Township ; Berks County PA) Del Corso Gregory J. (Brecknock Township ; Berks County PA), Method of making a low thermal expansion, high thermal conductivity, composite powder metallurgy member and a member mad.
  34. Iyer Natraj C. (Monroeville PA) Male Alan T. (Murrysville Boro PA) Lovic William R. (New Kensington PA), Method of making dimensionally reproducible compacts.
  35. Fey Maurice G. (Plum Borough PA) Iyer Natraj C. (Monroeville PA) Male Alan T. (Murrysville Boro PA) Lovic William R. (New Kensington PA), Methods of making high performance compacts and products.
  36. Mundinger David C. (Stockton CA) Benett William J. (Livermore CA) Beach Raymond J. (Livermore CA), Modular package for cooling a laser diode array.
  37. Pollard David D. (Amanda OH) Krajci Gary E. (American OH), Mounting arrangement for disc mounted semiconductor devices.
  38. Kurokawa Yasuhiro (Tokyo JPX), Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing.
  39. Schneider Mark R. (San Jose CA), Powder metal heat sink for integrated circuit devices.
  40. Matsuda Hideo (Yokohama JPX), Press-packed semiconductor device with lateral fixing member.
  41. Nguyen My N. (San Diego CA), Rapid-curing adhesive formulation for semiconductor devices.
  42. Nguyen My N. (San Diego CA), Rapid-curing adhesive formulation for semiconductor devices.
  43. Honda Norio (Kawasaki JPX) Sugahara Takehisa (Kawasaki JPX), Semiconductor device.
  44. Marrs Robert C. (Scottsdale AZ), Semiconductor device having a thermal dissipator and electromagnetic shielding.
  45. Scorey Clive R. (Cheshire CT), Sinterless powder metallurgy process for manufacturing composite copper strip.
  46. Schneider Mark (San Jose CA) Joroski Joseph (San Jose CA), Stackable heatsink structure for semiconductor devices.
  47. Pitasi Martin J. (Newbury MA), Surface-to-air heat exchanger for electronic devices.
  48. Olla Michael A. (Austin TX), Thermal heat sink encapsulated integrated circuit.
  49. Craft Scott (Phoenix AZ), Thermal shunt for electronic circuits.
  50. McShane Michael B. (Austin TX) Casto James J. (Austin TX) Joiner Bennett A. (Austin TX), Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation.
  51. Jaatinen Pia Helena,FIX ; Heinonen Esa Henrik,FIX ; Hervonen Antti Lauri Juhani,FIX ; Nieminen Lauri Sakari,FIX, Use of dexmedetomidine for treating ethanol-induced neurodegeneration.
  52. Schuck David B. (Escondido CA), VLSI Packaging system.
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