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A method of mounting a power semiconductor die on a substrate, a package for the die and a power supply including the package. The die has a first power terminal on a first surface thereof and a second power terminal on an opposing second surface thereof. The method including the steps of: (1) formi

A method of mounting a power semiconductor die on a substrate, a package for the die and a power supply including the package. The die has a first power terminal on a first surface thereof and a second power terminal on an opposing second surface thereof. The method including the steps of: (1) forming an electrically-conductive, mechanical bond between the first surface and a first location on the substrate, the mechanical bond electrically coupling the first power terminal to the substrate and (2) soldering an elongated electrically conductive strap to the second surface and a second location on the substrate, the conductive strap composed of a material having an electrical resistivity at most about 5.0.times.10-.sup.8 ohm-meters (.OMEGA.-m) and forming a low impedance path between the second power terminal and the second location.

대표청구항 ▼

[ What is claimed is:] [1.] A package for a power semiconductor die, said die having a first power terminal on first surface thereof and a second power terminal on an opposing second surface thereof, said package comprising:an electrically-conductive, mechanical bond formed between said first surfac

[ What is claimed is:] [1.] A package for a power semiconductor die, said die having a first power terminal on first surface thereof and a second power terminal on an opposing second surface thereof, said package comprising:an electrically-conductive, mechanical bond formed between said first surface and a first location on a substrate, said mechanical bond electrically coupling said first power terminal to said substrate; andan elongated electrically conductive strap having an arcuate section soldered at a substantially tangential point on said arcuate section to said second surface and a second location on said substrate, said conductive strap composed of a material having an electrical resistivity at most about 5.0.times.10-.sup.8 ohm-meters (.OMEGA.-m) and forming a low impedance path between said second power terminal and said second location.