[특허]Hammer for forming bulges in an array of compliant pin blanks

[미국특허] Hammer for forming bulges in an array of compliant pin blanks 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-003/30 H01R-043/00
출원번호	US-0878434 (1997-06-18)
발명자 / 주소	Kman Stephen Joseph Stubecki John Arthur Sondej William Richard
출원인 / 주소	International Business Machines Corporation
대리인 / 주소	Calfee, Halter & Griswold LLP
인용정보	피인용 횟수 : 4 인용 특허 : 47

초록 ▼

A hammer for forming bulges in an array of compliant pin blanks by compressive deformation to thereby attach the array of pin blanks to a printed circuit board is provided. Each of the compliant pin blanks has a substrate engaging portion and a compliant section spaced from the substrate engaging portion projecting from the printed circuit board. The compliant section of each pin blank defines at least one protrusion extending outwardly farther than the remaining portions of the compliant section of the pin blank. The circuit board has a plurality of holes receiving the pin blanks. A hammer is provided which has a body defining a substrate facing surface for facing the printed circuit board and defining a plurality of holes extending from the substrate facing surface for receiving the compliant sections of the pin blanks. The holes in the substrate facing surface have a bulge cavity larger than the cross-section of the portion of the pin receiving blank therein. The compressive stress of the pin blanks will cause the blanks to be formed in the bulge cavities.

대표청구항 ▼

[ We claim:] [1.] A hammer for forming bulges in an array of compliant pin blanks by compressive deformation to thereby attach said array of pin blanks to a printed circuit board, each of said compliant pin blanks having a substrate-engaging portion and a compliant section spaced from said substrate-engaging portion and projecting from said printed circuit board when said pin blank is inserted therein, the compliant section of each of said pin blanks defining at least one protrusion extending outwardly from the central axis of the pin blank farther than the remaining portions of the compliant section of the pin blank, said printed circuit board having a plurality of holes receiving the substrate-engaging portions of said array of compliant pin blanks,said hammer comprising a body defining a substrate-facing surface for facing said printed circuit board when said compliant pin blanks are attached thereto, said body defining a plurality of holes in said substrate-facing surface for receiving the compliant sections of said pin blanks, each of said holes being elongated and arranged generally perpendicular to said substrate-facing surface, each of said holes defining in said substrate-facing surface a bulge cavity larger in cross-section than the cross-section of the portion of pin blank received therein so that compressive stress of said pin blanks will cause said blanks to deform and thereby form bulges in the bulge cavities, each of said holes further defining at least one groove therein, one groove corresponding to each of the protrusions in the respective compliant sections of said pins, each of said at least one groove in each of said holes being shaped to receive its respective protrusion when said array of pins is placed in said holes.

이 특허에 인용된 특허 (47) 인용/피인용 타임라인 분석

Emerick Alan J. (Warren Center PA) Marsh Eugene L. (Endicott NY) Miller Thomas L. (Vestal NY) Zalesinski Jerzy M. (Endicott NY), Affixing pluggable pins to a ceramic substrate.
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Darrow, Russell E.; Ingraham, Glenn J.; Larnerd, John D.; Nesky, Robert W., Apparatus for connecting contact pins to a substrate.
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Fey Donald (Vestal NY) Legg John T. (Glen Aubrey NY) Pierson Mark V. (Binghamton NY), Automatic extrusion pinning method and apparatus.
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Ushifusa Nobuyuki (Hitachi JPX) Shinohara Hiroichi (Hitachi JPX) Nagayama Kousei (Ibaraki JPX) Ogihara Satoru (Hitachi JPX) Soga Tasao (Hitachi JPX), Ceramic multilayer circuit board and semiconductor module.
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Lovendusky ; Charles Michael, Circuit board contact.
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Sitzler Fred C. (Hanover PA), Circuit board contact element and compliant section thereof.
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Kendall Jerry A. (Lewisville TX) Webb David M. (Lewisville TX), Compliant electrical connector pin.
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Neidich Douglas A. (Harrisburg PA), Compressible core electrical connector.
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Long William B. (Camp Hill PA) Shannon Suel G. (Harrisburg PA), Electrical connector for interconnecting printed circuit boards.
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Arisaka Hiroshi (Tokyo JPX), High frequency electrical connector comprising multilayer circuit board.
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Ozawa Takashi (Tokyo JPX) Munakata Ichiro (Kawasaki JPX) Takagi Hiroaki (Kawasaki JPX) Kozaki Ryoichi (Kawasaki JPX), Hybrid IC device.
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Fisher James (Georgetown CAX) Balkenhol Charles C. (Islington CAX) Roberts Leo B. (Ottawa CAX), Inserting pins into printed circuit boards.
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Whitehead Graham K. (Ipswich GB2) Taylor Kenneth (East Barnet GB2), Integrated circuit chip carrier.
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Frankeny Jerome A. (Taylor TX) Frankeny Richard F. (Austin TX) Hermann Karl (Austin TX) Imken Ronald L. (Round Rock TX), Integrated circuit packaging using flexible substrate.
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Desai Kishor V. (Vestal NY) Franchak Nelson P. (Binghamton NY) Katyl Robert H. (Vestal NY) Kohn Harold (Endwell NY) Sholtes Tamar A. (Endicott NY) Veeraraghavan Vilakkudi G. (Endicott NY) Woychik Cha, Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate.
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Koopman Nicholas George (Hopewell Junction NY), Method for making conduction-cooled circuit package.
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Mukherjee Shyama P. (Vestal NY), Method for producing a ceramic.
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Dougherty William E. (Wappingers Falls NY) Greer Stuart E. (Poughkeepsie NY), Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations di.
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Aakalu Nandakumar G. (Poughkeepsie NY) Rittmiller Lawrence A. (Saugerties NY), Non-bleeding thixotropic thermally conductive material.
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Chiang Jung-Shan (Taipei TWX), Pin grid array adaptor mounting hardware.
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Pierson Mark V. (Binghamton NY), Pin retention method and apparatus.
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Macek Joseph S. (Binghamton NY) Petrozello James R. (Endicott NY) Tomek Reinhold E. (Endwell NY), Pin with tubular elliptical compliant portion and method for affixing to mating receptacle.
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Kman Stephen J. (Port Crane NY) Stubecki John A. (Nichols NY) Sondej William R. (Vestal NY), Pinned module.
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Lin Paul T. (Austin TX), Process for making a hermetic low cost pin grid array package.
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Camsell Edwin (Harrisburg PA) Feiber Wolfgang E. A. (Harrisburg PA) Kline Jackie A. (Harrisburg PA) Rubendall Douglas C. (Millersburg PA), Programmable insertion tool for a pin header.
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Donson William A. (Endicott NY) Ellerson James V. (Endicott NY) Hammer Richard B. (Apalachin NY) Lafer William (Chenango Bridge NY) Snyder Keith A. (Vestal NY), Providing circuit lines on a substrate.
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Darrow Russell E. (Newark Valley NY) Memis Irving (Vestal NY) Poliak Richard M. (Endwell NY), Sealing of integrated circuit modules.
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Soga Tasao (Hitachi JPX) Goda Marahiro (Hitachi JPX) Nakano Fumio (Hitachi JPX) Kushima Tadao (Ibaraki JPX) Ushifusa Nobuyuki (Hitachi JPX) Kobayashi Fumiyuki (Sagamihara JPX) Sawahata Mamoru (Hitach, Semiconductor resin package structure.
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이 특허를 인용한 특허 (4) 인용/피인용 타임라인 분석

Moore,Richard B., Fastener forming apparatus and method for making a fastener of metal.
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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Hammer for forming bulges in an array of compliant pin blanks 원문보기