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Heat pipe lid for electronic packages 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/347
  • H01L-025/04
  • H01L-023/46
  • H01L-023/42
출원번호 US-0851152 (1997-05-05)
발명자 / 주소
  • Xie Hong
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 137  인용 특허 : 21

초록 ▼

An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the package substrate creating a space therebetween for accommodating the semiconductor device. The package cov

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor package comprising:a substrate having a top surface;at least one semiconductor device attached to said top surface of said substrate; anda cover secured to said substrate creating a space therebetween, said semiconductor device residing within said space,

이 특허에 인용된 특허 (21)

  1. Messina Gaetano P. (Hopewell Junction NY) Brewster Robert A. (Poughkeepsie NY) Kara Theodore J. (Poughkeepsie NY) Song Seaho (Highland NY), Apparatus for cooling integrated circuit chips.
    상세보기
  2. Estes Scott (Austin TX) Swamy Deepak (Austin TX), Circuit board-mounted IC package cooling apparatus.
    상세보기
  3. Hisano Katsumi (Kanagawa) Sasaki Tomiya (Kanagawa) Ishizuka Masaru (Kanagawa JPX), Cooling apparatus.
    상세보기
  4. Daikoku Takahiro (Ushiku JPX) Kawasaki Nobuo (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Kawamura Keizou (Ibaraki JPX) Zushi Shizuo (Hadano JPX) Miyamoto Mitsuo (Hadano JPX) Morihara Atsushi (Kat, Cooling apparatus for electronic device.
    상세보기
  5. Daikoku Takahiro,JPX ; Kobayashi Fumiyuki,JPX ; Ashiwake Noriyuki,JPX ; Kasai Kenichi,JPX ; Kawamura Keizou,JPX ; Idei Akio,JPX, Cooling device of multi-chip module.
    상세보기
  6. Conte Alfred S. (Hollister CA), Cooling multi-chip modules using embedded heat pipes.
    상세보기
  7. Meeker Robert G. (La Grangeville NY) Scanlon William J. (Hopewell Junction NY) Segal Zvi (Wappingers Falls NY), Gas encapsulated cooling module.
    상세보기
  8. Phelps ; Jr. Douglas W. (Burlington VT) Ward William C. (Burlington VT), Heat dissipation package for integrated circuits.
    상세보기
  9. Cirrito Vincent (Massapequa Park NY) Koubek Kevin J. (South Setauket NY) Quadrini John A. (Northport NY), Heat pipe cooled electronic circuit card.
    상세보기
  10. Meyer ; IV George A. (Conestoga PA) Coleman Robert F. (Lancaster PA), Heat pipe cooling plate.
    상세보기
  11. Murase Takashi (Yokohama JPX) Tanaka Suemi (Nishinomiya JPX), Heat pipe type cooling apparatus for semiconductor.
    상세보기
  12. Ashiwake Noriyuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku JPX) Hatsuda Toshio (Ibaraki JPX) Zushi Shizuo (Hadano NY JPX) Kobayashi Satomi (Rye NY), Heat sinks and semiconductor cooling device using the heat sinks.
    상세보기
  13. Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger and clamping plate.
    상세보기
  14. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger, and clamping plate.
    상세보기
  15. Sayka Anthony (San Antonio TX) Siddiqui Mohammad A. (San Antonio TX), Integrated circuit package including a heat pipe.
    상세보기
  16. Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Integrated heat pipe and circuit board structure.
    상세보기
  17. Kurokawa Yasuhiro (Tokyo JPX), Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing.
    상세보기
  18. Ferro Armand P. (Schenectady NY) Harnden ; Jr. John D. (Schenectady NY) McLaughlin Michael H. (Scotia NY), Power module with isolated substrates cooled by integral heat-energy-removal means.
    상세보기
  19. Neidig Arno (Plankstadt DEX) Wessjohann Hans G. (Mannheim DEX), Semiconductor power module with an integrated heat pipe.
    상세보기
  20. Sekhon Kalwant S. (Fullerton CA) Nelson Lloyd A. (Villa Park CA) Fritz ; Jr. John E. (Anaheim CA), Transistor cooling by heat pipes having a wick of dielectric powder.
    상세보기
  21. Shanker Bangalore J. (Santa Clara CA) Belani Jagdish G. (Cupertino CA), Use of a heat pipe integrated with the IC package for improving thermal performance.
    상세보기

이 특허를 인용한 특허 (137)

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