초록 ▼

A heat exchanger system for use in a hinged computing device is provided. The hinged computing device includes a base housing connected to a display housing by one or more hinges. A number of heat generating electronic components are located within the base housing, and a display screen is positione

A heat exchanger system for use in a hinged computing device is provided. The hinged computing device includes a base housing connected to a display housing by one or more hinges. A number of heat generating electronic components are located within the base housing, and a display screen is positioned in the display housing. The heat exchanger system includes a heat pipe located in the base and thermally coupled to both an electronic component and the hinge to allow heat transfer from the electronic component to the hinge. A flat plate heat pipe located in the display housing is mechanically and thermally coupled to the hinge to allow heat transfer from the hinge to the flat plate heat pipe for dissipation through the display housing.

대표청구항 ▼

[ What is claimed:] [1.] A heat exchanger system for transferring heat generated by an electronic component located in a first part of a computing device to a second part thereof for dissipation into the surrounding environment, said first part of the computing device being coupled to said second pa

[ What is claimed:] [1.] A heat exchanger system for transferring heat generated by an electronic component located in a first part of a computing device to a second part thereof for dissipation into the surrounding environment, said first part of the computing device being coupled to said second part by a thermally conductive hinge having a first hinge section and a second hinge section, said heat exchanger system comprising:a heat pipe located in the first part of the computing device and thermally coupled between the electronic component and the first hinge section; anda flat plate heat pipe located in the second part of the computing device, said flat plate heat pipe being thermally coupled to the second hinge section.