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A.C. plasma processing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/34
출원번호 US-0667387 (1996-06-21)
발명자 / 주소
  • Manley Barry W.
  • Billings Keith H.
출원인 / 주소
  • Sierra Applied Sciences, Inc.
대리인 / 주소
    Klaas, Law, O'Meara & Malkin, P.C.Dahl, Esq.
인용정보 피인용 횟수 : 24  인용 특허 : 17

초록

An AC plasma processing system according to the present invention may include a transformer for placing an alternating current on a first electrode and a second electrode contained within a process chamber. The secondary winding of the transformer is connected across the first and second electrodes.

대표청구항

[ What is claimed is:] [14.] A plasma processing system, comprising:a vacuum chamber having a first electrode and a second electrode, said vacuum chamber being adapted to receive a process gas and maintain said process gas within a predetermined pressure;a transformer having a primary winding and a

이 특허에 인용된 특허 (17)

  1. Scherer Michael (Rodenbach DEX) Maass Wolfram (Erlensee DEX) Szczyrbowski Joachim (Goldbach DEX), Apparatus for coating a substrate by magnetron sputtering.
  2. Scherer Michael (Rodenbach DEX) Latz Rudolf (Frankfurt DEX) Patz Ulrich (Linsengericht DEX), Apparatus for coating a substrate with dielectrics.
  3. Siefkes Jerry D. (Fort Collins CO) Harpold John G. (Bellvue CO) Schatz Douglas S. (Fort Collins CO), Apparatus for removal of electrical shorts in a sputtering system.
  4. Wurczinger Hans-Dieter (Bad Vilbel DEX), Arrangement for measuring the thickness of thin layers.
  5. Manley Barry W. (Boulder CO) Billings Keith H. (Guelph CAX), Circuit for reversing polarity on electrodes.
  6. Felper Gerald A. (Anaheim CA) Gerhard Francis H. (San Juan Capistrano CA), Closed loop feedback control circuits for gas discharge lamps.
  7. Teschner Gtz (Gelnhausen DEX), Device for the suppression of arcs.
  8. Fujii Syuitsu (Hiroshima JPX), High frequency plasma power source and impedance matching device for supplying power to a semiconductor processing appar.
  9. Siefkes Jerry D. (Fort Collins CO) Harpold John G. (Bellvue CO) Schatz Douglas S. (Fort Collins CO), Method and apparatus for recovery from low impedance condition during cathodic arc processes.
  10. Sichmann Eggo (Gelnhausen DEX) Krug Thomas (Hanau DEX) Fritsche Wolf-Eckart (Kleinostheim DEX) Pollmann Martin (Erlensee DEX), Method for coating polymethylmethacrylate substrate with aluminum.
  11. Siefkes Jerry D. (737 N. Taft Hill Rd. Fort Collins CO 80521) Harpold John G. (6203 N. County Rd. 29 Bellvue CO 80512) Schatz Douglas S. (901 Lochview Ct. Fort Collins CO 80524), Method for removal of electrical shorts in a sputtering system.
  12. Nishimura Eiichi (Yamanashi JPX) Toda Akihito (Yamanashi JPX) Sugiyama Kazuhiko (Hachioji JPX) Naitou Yukio (Kofu JPX), Plasma generating apparatus.
  13. Szczyrbowski Joachim (Goldbach DEX) Roegels Stephan (Rodenbach DEX), Process and apparatus for reactively coating a substrate.
  14. Ludwig Rainer (Karlstein DEX) Adam Rolf (Hanau DEX) Dietrich Anton (Triesen LIX) Kukla Reiner (Hanau DEX), Process for coating a dielectric substrate with copper.
  15. Sichmann Eggo (Gelnhausen DEX) Krug Thomas (Hanau DEX) Kempf Stephan (Alzenau DEX), Process for coating a substrate with electrically conductive materials.
  16. Vandervelden ; C. Keith ; Blake ; William P., Saturable reactor-type power supply.
  17. Drummond Geoffrey N. (Fort Collins CO), Thin film DC plasma processing system.

이 특허를 인용한 특허 (24)

  1. van Zyl, Gideon J., Arc detection and handling in radio frequency power applications.
  2. van Zyl,Gideon J., Arc detection and handling in radio frequency power applications.
  3. Richter, Ulrich, Arc extinction arrangement and method for extinguishing arcs.
  4. Ilic, Milan, Arc recovery with over-voltage protection for plasma-chamber power supplies.
  5. Ilic, Milan; Shilo, Vladislav V.; Huff, Robert Brian, Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch.
  6. Wiedemuth, Peter; Bannwarth, Markus; Wolf, Lothar, Arc suppression.
  7. Peter Maschwitz ; Jaime Li, Bipolar plasma source, plasma sheet source, and effusion cell utilizing a bipolar plasma source.
  8. Melanson, John L., Cascaded switching power converter for coupling a photovoltaic energy source to power mains.
  9. Klimczak, Andrzej; Bugyi, Rafal; Ozimek, Pawel, Current limiting device for plasma power supply.
  10. Hirose,Eiji, Holding mechanism of object to be processed.
  11. Chiu Chia-Yung,TWX, Method and apparatus for preventing arcing in sputter chamber.
  12. Scholl, Richard A.; Belkind, Abraham, Method and apparatus for substrate biasing in multiple electrode sputtering systems.
  13. Falk Milde DE; Torsten Winkler DE; Andreas Fickert DE; Volker Kirchhoff DE; Matthias Fahland DE, Method for monitoring alternating current discharge on a double electrode and apparatus.
  14. Ilic, Milan, Over-voltage protection during arc recovery for plasma-chamber power supplies.
  15. Young, George; Tomlins, Garry; Barry, Michael John; Barnard, Jacobus Marthinus, Power converter.
  16. Bulliard, Albert; Fragniere, Benoit; Oehen, Joel, Power supply device for plasma processing.
  17. Bulliard, Albert; Fragniere, Benoit; Oehen, Joel, Power supply device for plasma processing.
  18. Bulliard, Albert; Fragniere, Benoit; Oehen, Joel; Cardou, Olivier, Power supply device for plasma processing.
  19. Bulliard, Albert; Fragnière, Benoit; Oehen, Joël, Power supply device for plasma processing.
  20. Bulliard, Albert; Fragnière, Benoit; Oehen, Joël; Cardou, Olivier, Power supply device for plasma processing.
  21. Morgan, Forrest; Frost, Daryl; Heine, Frank; Pelleymounter, Doug; Walde, Hendrik, Power supply ignition system and method.
  22. Larson, Skip B.; Nauman, Jr., Kenneth E.; Walde, Hendrik; McDonald, R. Mike, Proactive arc management of a plasma load.
  23. Haag, Walter; Gruenenfelder, Pius, Sliding anode magnetron sputtering source.
  24. Hirose, Eiji, Workpiece holding mechanism.
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